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GP200MHS18

Dynex Semiconductor
Part Number GP200MHS18
Manufacturer Dynex Semiconductor
Title Half Bridge IGBT Module
Description GP200MHS18 GP200MHS18 Half Bridge IGBT Module DS5304-3.1 January 2001 FEATURES s s s s Non Punch Through Silicon Isolated Copper Baseplate Low ...
Features s s s s Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 200A Per Arm KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 200A 400A APPLICATIONS s s s s High Power Inverters Motor Controlle...

Datasheet PDF File GP200MHS18 Datasheet

GP200MHS18   GP200MHS18   GP200MHS18  




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