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STMicroelectronics Electronic Components Datasheet


W10NK807

STW10NK807


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STP10NK80Z - STP10NK80ZFP
STW10NK80Z
N-CHANNEL 800V - 0.78- 9A TO-220/TO-220FP/TO-247
Zener-Protected SuperMESH™Power MOSFET
TYPE
VDSS RDS(on)
ID
Pw
STP10NK80Z
800 V < 0.90 9 A 160 W
STP10NK80ZFP 800 V < 0.90 9 A 40 W
STW10NK80Z
800 V < 0.90 9 A 160 W
s TYPICAL RDS(on) = 0.78
s EXTREMELY HIGH dv/dt CAPABILITY
s 100% AVALANCHE TESTED
s GATE CHARGE MINIMIZED
s VERY LOW INTRINSIC CAPACITANCES
s VERY GOOD MANUFACTURING
REPEATIBILITY
DESCRIPTION
The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established strip-
based PowerMESH™ layout. In addition to pushing
on-resistance significantly down, special care is tak-
en to ensure a very good dv/dt capability for the
most demanding applications. Such series comple-
ments ST full range of high voltage MOSFETs in-
cluding revolutionary MDmesh™ products.
TO-220
3
2
1
TO-220FP
3
2
1
TO-247
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING
s SWITCH MODE POWER SUPPLIES
s DC-AC CONVERTERS FOR WELDING, UPS
AND MOTOR DRIVE
ORDERING INFORMATION
SALES TYPE
MARKING
STP10NK80Z
P10NK80Z
STP10NK80ZFP
P10NK80ZFP
STW10NK80Z
W10NK80Z
February 2003
PACKAGE
TO-220
TO-220FP
TO-247
PACKAGING
TUBE
TUBE
TUBE
1/11



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STP10NK80Z - STP10NK80ZFP - STW10NK80Z
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDS Drain-source Voltage (VGS = 0)
VDGR
Drain-gate Voltage (RGS = 20 k)
VGS Gate- source Voltage
ID Drain Current (continuous) at TC = 25°C
ID Drain Current (continuous) at TC = 100°C
IDM ( ) Drain Current (pulsed)
PTOT
Total Dissipation at TC = 25°C
Derating Factor
VESD(G-S) Gate source ESD(HBM-C=100pF, R=1.5KΩ)
dv/dt (1) Peak Diode Recovery voltage slope
VISO
Insulation Withstand Voltage (DC)
Tj Operating Junction Temperature
Tstg Storage Temperature
( ) Pulse width limited by safe operating area
(1) ISD 9A, di/dt 200A/µs, VDD V(BR)DSS, Tj TJMAX.
(*) Limited only by maximum temperature allowed
STP10NK80Z
9
6
36
160
1.28
-
Value
STP10NK80ZFP STW10NK80Z
800
800
± 30
9 (*) 9
6 (*) 6
36 (*)
36
40 160
0.32
1.28
4
4.5
2500
-
-55 to 150
-55 to 150
THERMAL DATA
Rthj-case
Rthj-amb
Tl
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Maximum Lead Temperature For Soldering Purpose
TO-220 TO-220FP
0.78 3.1
62.5
300
TO-247
0.78
50
Unit
V
V
V
A
A
A
W
W/°C
KV
V/ns
V
°C
°C
°C/W
°C/W
°C
AVALANCHE CHARACTERISTICS
Symbol
Parameter
IAR Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
EAS Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
Max Value
9
290
Unit
A
mJ
GATE-SOURCE ZENER DIODE
Symbol
Parameter
BVGSO
Gate-Source Breakdown
Voltage
Test Conditions
Igs=± 1mA (Open Drain)
Min.
30
Typ.
Max.
Unit
V
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
2/11



Part Number W10NK807
Description STW10NK807
Maker ST Microelectronics - ST Microelectronics
Total Page 11 Pages
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