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  Microchip Technology Semiconductor Electronic Components Datasheet  


MCP1404

(MCP1403 - MCP1405) Low-side MOSFET Drivers


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MCP1403/4/5
4.5A Dual High-Speed Power MOSFET Drivers
Features
• High Peak Output Current: 4.5A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2200 pF in 15 ns
- 5600 pF in 34 ns
• Short Delay Times: 40 ns (typ.)
• Low Supply Current:
- With Logic ‘1’ Input – 1.0 mA (typ.)
- With Logic ‘0’ Input – 150 µA (typ.)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing
Up To 5V
• Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN,
and 16-Pin SOIC
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
• Motor and Solenoid Drive
General Description
The MCP1403/4/5 are a family of dual-inverting, dual-
non-inverting, or complimentary output drivers. They
can delivery high peak currents of 4.5A typically into
capacitive loads. These devices also feature low shoot-
through current, matched rise/fall times and
propagation delays.
The MCP1403/4/5 drivers operate from a 4.5V to 18V
single power supply and can easily charge and
discharge 2200 pF gate capacitance in under 15 ns
(typ). They provide low enough impedances in both the
on and off states to ensure the MOSFETs intended
state will not be affected, even by large transients. The
input to the MCP1403/4/5 may be driven directly from
either TTL or CMOS (3V to 18V).
The MCP1403/4/5 dual-output 4.5A driver family is
offered in both surface-mount and pin-through-hole
packages with a -40oC to +125oC temperature rating.
The low thermal resistance of the thermally enhanced
DFN package allows for greater power dissipation
capability for driving heavier capacitive or resistive
loads.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
Package Types
8-Pin
MCP1404
PDIP/SOIC MCP1403
MCP1405
NC 1
IN A 2
GND 3
IN B 4
8 NC
7 OUT A
6 VDD
5 OUT B
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
MCP1404
8-Pin DFN(2) MCP1403
MCP1405
NC 1
IN A 2
GND 3
IN B 4
8 NC
7 OUT A
6 VDD
5 OUT B
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
16-Pin SOIC
MCP1404
MCP1403
MCP1405
NC
IN A
NC
GND
GND
NC
IN B
NC
1
2
3
4
5
6
7
8
16 NC
15 OUT A
14 OUT A
13 VDD
12 VDD
11 OUT B
10 OUT B
9 NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
Note 1: Duplicate pins must both be connected for
proper operation.
2: Exposed pad of the DFN package is electrically
isolated.
© 2007 Microchip Technology Inc.
DS22022B-page 1



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Functional Block Diagram (1)
730 µA
300 mV
Inverting
Input
Effective
Input C = 20 pF
(Each Input)
GND
4.7V
Non-inverting
MCP1403 Dual Inverting
MCP1404 Dual Non-inverting
MCP1405 Inverting / Non-inverting
Note 1: Unused inputs should be grounded.
VDD
Output
DS22022B-page 2
© 2007 Microchip Technology Inc.



Part Number MCP1404
Description (MCP1403 - MCP1405) Low-side MOSFET Drivers
Maker Microchip Technology - Microchip Technology
Total Page 22 Pages
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