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Maxim Integrated Semiconductor Electronic Components Datasheet


MAX11154

SAR ADC


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MAX11154 pdf
EVALUATION KIT AVAILABLE
MAX11154
18-Bit, 500ksps, 0 to 5V SAR ADC with
Internal Reference in TDFN
General Description
The MAX11154 18-bit, 500ksps, SAR ADC offers excellent
AC and DC performance with unipolar input range, small
size, and internal reference. The MAX11154 integrates an
optional internal reference and buffer, saving additional
cost and space.
This ADC typically achieves 93.8dB SNR and -105.8dB THD.
The device guarantees 18-bit no-missing codes and ±2
LSB INL (typ).
The MAX11154 communicates using an SPI-compatible
serial interface at 2.3V, 3V, 3.3V, or 5V logic. The serial
interface can be used to daisy-chain multiple ADCs for
multichannel applications and provides a busy indicator
option for simplified system synchronization and timing.
The MAX11154 is offered in a 12-pin, 3mm x 3mm,
TDFN package and is specified over the -40NC to +85NC
temperature range.
Applications
● Data Acquisition Systems
● Industrial Control Systems/Process Control
● Medical Instrumentation
● Automatic Test Equipment
Benefits and Features
● High DC/AC Accuracy Improves Measurement Quality
• 18-Bit Resolution with No Missing Codes
• 500ksps Throughput Rates without Pipeline Delay/
Latency
• 93.8dB SNR and -105.8dB THD at 10kHz
• 1.7 LSBRMS Transition Noise
• ±0.6 LSB DNL (typ) and ±2 LSB INL (typ)
● Highly Integrated ADC Saves Cost and Space
• ±7ppm/°C Internal Reference
• Internal Reference Buffer
● Wide Supply Range and Low Power Simplify
Power-Supply Design
• 5V Analog Supply
• 2.3V to 5V Digital Supply
• 23.6mW Power Consumption with External Reference
at 500ksps
• 10µA in Shutdown Mode
● Multi-Industry Standard Serial Interface and
Small Package Reduce Size
• SPI/QSPI™/MICROWIRE®/DSP-Compatible
Serial Interface
• 3mm x 3mm Tiny 12-Pin TDFN Package
Selector Guide and Ordering Information appear at end of
data sheet.
Typical Operating Circuit
0 to 5V
10
MAX9632
4.7nF
AIN+
AIN-
REF
10µF
1µF VDD
(5V)
0.1µF
OVDD
(2.3V TO 5V)
18-BIT ADC
MAX11154
REF
BUF
INTERFACE
AND CONTROL
CONFIGURATION REGISTER
INTERNAL
REFERENCE
AGNDS
GND
SCLK
DIN
DOUT
HOST
CONTROLLER
CNVST
REFIO
0.1µF
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corporation.
14-Bit to 18-Bit SAR ADC Family
14-BIT
16-BIT
16-BIT 18-BIT
500ksps 250ksps 500ksps 500ksps
±5V Input
Internal
Reference
MAX11167
MAX11169
0 to 5V Input
Internal
Reference
MAX11161
MAX11165
0 to 5V Input
External MAX11262 MAX11163
Reference
MAX11166 MAX11156
MAX11168 MAX11158
MAX11160 MAX11150
MAX11164 MAX11154
MAX11162 MAX11152
19-6722; Rev 2; 11/15



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MAX11154 pdf
MAX11154
18-Bit, 500ksps, 0 to 5V SAR ADC with
Internal Reference in TDFN
Absolute Maximum Ratings
VDD to GND.............................................................-0.3V to +6V
OVDD to GND........ -0.3V to the lower of (VDD + 0.3V) and +6V
AIN+ to GND............................................................-0.3V to +6V
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 18.2mW/NC above +70NC)...................1349mW
Operating Temperature Range............................ -40NC to +85NC
AIN-, REF, REFIO, AGNDS
Junction Temperature.......................................................+150NC
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, DIN, DOUT, CNVST
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................. +300NC
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
Maximum Current into Any Pin...........................................50mA
Soldering Temperature (reflow)........................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (qJA).......59.3NC/W
Junction-to-Case Thermal Resistance (qJC)............22.5NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 4.75V to 5.25V, VOVDD = 2.3V to 5.25V, fSAMPLE = 500ksps, Reference Mode 3, VREF = 4.096V; TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
ANALOG INPUT (Note 3)
Input Voltage Range
SYMBOL
CONDITIONS
AIN+ to AIN-, K = 5.0/4.096
Absolute Input Voltage Range
Input Leakage Current
Input Capacitance
Input-Clamp Protection Current
STATIC PERFORMANCE (Note 4)
Resolution
No Missing Codes
Offset Error
Offset Error Temperature
Coefficient
Gain Error
Gain Error Temperature
Coefficient
Integral Nonlinearity
Differential Nonlinearity
Positive Full-Scale Error
Analog Input CMRR
N
INL
DNL
CMRR
AIN+ to GND
AIN- to GND
Acquisition phase
Both inputs
Guaranteed by design
MIN TYP MAX UNITS
0
+K x
VREF
-0.1
+(VDD +
0.1)
-0.1 +0.1
-10 +0.001 +10
32
-20 +20
V
V
µA
pF
mA
18
18
-15.5
±1.45
+15.5
Bits
Bits
LSB
±0.01
LSB/°C
-15 ±4.3 +15
LSB
±0.016
LSB/°C
-6 ±2 +6 LSB
-1 ±0.6 +1
LSB
-22 +22 LSB
-7.86
LSB/V
www.maximintegrated.com
Maxim Integrated 2



Part Number MAX11154
Description SAR ADC
Maker Maxim Integrated - Maxim Integrated
Total Page 28 Pages
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