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Maxim Integrated Semiconductor Electronic Components Datasheet


MAX11108

Serial 12-Bit ADC


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MAX11108 pdf
MAX11108
EVALUATION KIT AVAILABLE
Tiny, 2.1mm x 1.6mm, 3Msps,
Low-Power, Serial 12-Bit ADC
General Description
TheMAX11108 is a tiny (2.1mm x 1.6mm), 12-bit, com-
pact, high-speed, low-power, successive approximation
analog-to-digital converter (ADC). This high-performance
ADC includes a high-dynamic range sample-and-hold
and a high-speed serial interface. This ADC accepts a
full-scale input from 0V to the power supply or to the ref-
erence voltage.
The MAX11108 features a single-ended analog input
connected to the ADC core. The device also includes a
separate supply input for data interface and a dedicated
input for reference voltage.
The MAX11108 "communicates" from 1.5V to VDD and
operates from a 2.2V to 3.6V supply. The device con-
sumes only 6.6mW at 3Msps and includes full power-
down mode and fast wake-up for optimal power man-
agement and a high-speed 3-wire serial interface. The
3-wire serial interface directly connects to SPI/QSPI™/
MICROWIRE® devices without external logic.
Excellent dynamic performance, low voltage, low power,
ease of use, and extremely small package size make this
converter ideal for portable battery-powered data-acquisi-
tion applications, and for other applications that demand
low-power consumption and minimal space.
The MAX11108 is available in an ultra-TQFN (2.1mm x
1.6mm) package, and operates over the -40°C to +125°C
temperature range.
Applications
● Instrument Data Acquisition
● Mobile
● Portable Data Logging
● Medical Instrumentation
● Battery-Operated Systems
● Communication Systems
Benefits and Features
● Compact ADC Saves Space
• Single-Ended Analog Input 12-Bit Resolution ADC
• 3Msps Conversion Rate with No Pipeline Delay
• 73dB SNR
• 10-Pin, Ultra-TQFN (μDFN), 2.1mm x 1.6mm
Package
● Low Power Consumption Extends Battery Life
• 6.6mW at 3Msps
• Very Low Power Consumption at 2.5μA/ksps
• 1.3μA Power-Down Current
• 2.2V to 3.6V Supply Voltage
● Variable I/O Voltage Range of 1.5V to 3.6V Eases
Interface to Microcontrollers
● SPI-/QSPI-/MICROWIRE-Compatible Serial Interface
Directly Connects to 1.5V, 1.8V, 2.5V, or 3V Digital
System
Functional Diagram
VOVDD VDD
CS
SCLK
CONTROL MAX11108
LOGIC
SAR
OUTPUT
BUFFER
DOUT
AIN CDAC
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corp.
µMAX is a registered trademark of Maxim Integrated Products, Inc.
VREF
AGND
19-6227; Rev 3; 3/15



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MAX11108 pdf
MAX11108
Tiny, 2.1mm x 1.6mm, 3Msps,
Low-Power, Serial 12-Bit ADC
Absolute Maximum Ratings
VDD to AGND...........................................................-0.3V to +4V
REF, OVDD, AIN to AGND.......................... -0.3V to the lower of
.............................................................. (VDD + 0.3V) and +4V
CS, SCLK, DOUT TO AGND...................... -0.3V to the lower of
(VOVDD + 0.3V) and +4V
Input/Output Current (all pins).............................................50mA
Continuous Power Dissipation (TA = +70°C)
Ultra TQFN (derate 9mW/°C above +70°C).................722mW
Operating Temperature Range......................... .-40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Ultra TQFN
Junction-to-Ambient Thermal Resistance (θJA)..........110.8°C/W
Junction-to-Case Thermal Resistance (θJC).............62.1°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 2.2V to 3.6V, VREF = VDD, VOVDD = VDD. fSCLK = 48MHz, 50% duty cycle, 3Msps. CDOUT = 10pF, TA = -40°C to +125°C,
unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
DC ACCURACY
Resolution
12 Bits
Integral Nonlinearity
INL
±1 LSB
Differential Nonlinearity
DNL No missing codes
±1 LSB
Offset Error
OE
±0.3
±3
LSB
Gain Error
GE Excluding offset and reference errors
±1 ±3 LSB
Total Unadjusted Error
TUE
±1.5
LSB
DYNAMIC PERFORMANCE (fAIN = 1MHz)
Signal-to-Noise and Distortion
SINAD
70 72
dB
Signal-to-Noise Ratio
SNR
70.5
72
dB
Total Harmonic Distortion
THD
-85 -75
dB
Spurious-Free Dynamic Range
SFDR
76 85
dB
Intermodulation Distortion
Full-Power Bandwidth
IMD f1 = 1.0003MHz, f2 = 0.99955MHz
-3dB point
-84 dB
40 MHz
Full-Linear Bandwidth
SINAD > 68dB
2.5 MHz
Small-Signal Bandwidth
45 MHz
www.maximintegrated.com
Maxim Integrated 2



Part Number MAX11108
Description Serial 12-Bit ADC
Maker Maxim Integrated - Maxim Integrated
Total Page 16 Pages
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