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M14C16DD

M14C16 Die Description



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M14C16 DD
M14C16 Die Description
PRODUCT
s WAFER SIZE
M14C16
152 mm (6 inches)
s DIE IDENTIFICATION M14C16KA_R
s DIE SIZE (X x Y)
1390 x 2375 µm
s SCRIBE LINE
101.8 x 102.4 µm
s PAD OPENING
100 x 100 µm
DIE LAYOUT
s DI
Die Identification (at the position shown in Figure 1)
s C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
s C4, C6, C8
These ISO pins do not appear on the M14C16 die
s NC
This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in µm).
Figure 1. M14C16 Die Plot
C7: SDA (X= –429.0; Y= +1004.3)
NC: TEST
C5: GND (X= +337.7; Y= +1020.6)
DI
NC: TEST
C3: SCL (X= –514.4; Y= –904.4)
AI02496
C2: WC (X= –349.4; Y= –1004.4)
DD.M14C16/9811V1.1
NC: TEST
C1: VCC (X= +514.3; Y= –604.0)
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M14C16 DD
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
© 1998 STMicroelectronics - All Rights Reserved
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners.
STMicroelectronics GROUP OF COMPANIES
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Part Number M14C16DD
Description M14C16 Die Description
Maker STMicroelectronics - STMicroelectronics
Total Page 2 Pages
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