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STMicroelectronics Electronic Components Datasheet


B100NF04L

STB100NF04L



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STB100NF04L
N-CHANNEL 40V - 0.0036 - 100A D2PAK
STripFET™ II POWER MOSFET
TYPE
VDSS
RDS(on)
STB100NF04L
40 V <0.0042
s TYPICAL RDS(on) = 0.0036
s LOW THRESHOLD DRIVE
s 100% AVALANCHE TESTED
s LOGIC LEVEL DEVICE
ID
100 A
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remark-
able manufacturing reproducibility.
APPLICATIONS
s HIGH CURRENT, HIGH SWITCHING SPEED
s MOTOR CONTROL, AUDIO AMPLIFIERS
s DC-DC & DC-AC CONVERTERS
s SOLENOID AND RELAY DRIVERS
3
1
D2PAK
TO-263
(Suffix “T4”)
ADD SUFFIX “T4” FOR ORDERING IN TAPE & REEL
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDS Drain-source Voltage (VGS = 0)
VDGR
Drain-gate Voltage (RGS = 20 k)
VGS Gate- source Voltage
ID(*) Drain Current (continuos) at TC = 25°C
ID Drain Current (continuos) at TC = 100°C
IDM(•) Drain Current (pulsed)
Ptot Total Dissipation at TC = 25°C
Derating Factor
dv/dt (1) Peak Diode Recovery voltage slope
EAS (2) Single Pulse Avalanche Energy
Tstg Storage Temperature
Tj Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area.
(*) Current Limited by package
February 2002
.
Value
40
40
± 16
100
70
400
300
2
3.6
1.4
-65 to 175
175
(1) ISD 100A, di/dt 240A/µs, VDD 32V, Tj TJMAX
(2) Starting Tj = 25 oC, IAR = 50A, VDD= 30V
Unit
V
V
V
A
A
A
W
W/°C
V/ns
J
°C
°C
1/9



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STB100NF04L
THERMAL DATA
Rthj-case
Rthj-amb
Tj
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
Typ
0.5
62.5
300
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
40
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
°C/W
°C/W
°C
Max.
1
10
±100
Unit
V
µA
µA
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 4.5 V
ID = 50 A
ID = 50 A
Min.
1
Typ. Max.
0.0036 0.0042
0.0040 0.0065
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 20 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
50
6400
1300
190
Max.
Unit
S
pF
pF
pF
2/9



Part Number B100NF04L
Description STB100NF04L
Maker STMicroelectronics - STMicroelectronics
Total Page 9 Pages
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