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5059H

32kHz output Crystal Oscillator Module ICs



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5059H pdf
5059H series
32kHz output Crystal Oscillator Module ICs
OVERVIEW
The 5059H series are 32.768kHz output and 125°C operation crystal oscillator module ICs with divide-by-512 (or divide-by-1024)
frequency,AT-cut crystal 16.777216MHz (or 33.554432MHz) oscillator circuit built-in.
It is possible to generate a 32.768kHz output crystal oscillator with excellent temperature characteristics by usingAT-cut crystal.
There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal oscillators.
FEATURES
Wide range of operating supply voltage: 1.6 to 5.5V
Oscillation frequency(fundamental oscillator):16.777216MHz or 33.554432MHz
Output frequency: 32.768kHz (oscillation frequency divided by 512 or 1024)
-40 to +125°C operating temperature range
Regulated voltage drive oscillator circuit for reduced power consumption
and crystal drive current
3 pad layout options for mounting
5059HAx : for Flip Chip Bonding
5059HBx : for Wire Bonding(Type I)
5059HCx : for Wire Bonding(Type II)
Oscillation capacitors CG,CD built-in
Standby function
High impedance in standby mode, oscillator stops
Power-saving pull-up resistor built-in
±1mAoutput drive capability (Ta=-40 to +85°C)
±0.8mAoutput drive capability (Ta=-40 to +125°C)
50±5% output duty (1/2VDD)
Wafer form (WF5059Hxx)
Chip form (CF5059Hxx)
APPLICATIONS
32.768kHz output crystal oscillator modules
SERIES CONFIGURATION
Version*1
Oscillation frequency[MHz] Oscillation capacitors*2[pF]
fundamental oscillator
CG
CD
5059HAA
5059HBA
16.777216
32
5059HCA
5059HAB
5059HBB
33.554432
21
5059HCB
*1. It becomes WF5059Hxx in case of the wafer form and CF5059Hxx in case of the chip form.
*2. The oscillation capacitors do not contain parasitic capacitance.
Output
frequency[kHz]
32.768
(fOSC/512)
32.768
(fOSC/1024)
PAD layout
Flip Chip Bonding
Wire Bonding Type
Wire Bonding Type
Flip Chip Bonding
Wire Bonding Type
Wire Bonding Type
ORDERING INFORMATION
Device
Package
WF5059Hxx-4
Wafer form
CF5059Hxx-4
Chip form
FormWF:Wafer form
CF:Chip(Die) form
Version Name
WF5059H□□-4
Oscillation frequency A:16.777216MHz
B:33.554432MHz
PAD layout
A:For Flip Chip Bonding
B:For Wire Bonding(Type I)
C:For Wire Bonding(Type II)
SEIKO NPC CORPORATION - 1



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5059H pdf
PAD LAYOUT
WF5059HAx
(For Flip Chip Bonding)
VSS 5
5059H series
(375,345)
CF5059HBx
(For Wire Bonding (Type I))
(375,345)
4Q
Q5
4 VSS
CF5059HCx
(For Wire Bonding (Type II))
(375,345)
VDD 5
4Q
Y INHN 6
(0,0) 3 VDD Y VDD 6
(0,0) 3 INHN Y INHN 6
(0,0)
3 VSS
12
(-375,-345) XT
XTN
X
Chip size: 0.75×0.69mm
Chip thickness : 130m
PAD size : 80m
Chip base : Vss level
1
(-375,-345) XTN
X
2
XT
Chip size: 0.75×0.69mm
Chip thickness : 130m
PAD size : 80m
Chip base : Vss level
12
(-375,-345) XT
XTN
X
Chip size: 0.75×0.69mm
Chip thickness : 130m
PAD size : 80m
Chip base : Vss level
PAD COORDINATES
PAD PAD coordinates[μm]
No. X
Y
1 -146 -235
2 146 -235
3 265 -41
4 265 186
5 -265 186
6 -265 -41
PIN DESCRIPTION
PAD No.
5059HAx
1
2
3
4
5
5059HBx
2
1
6
5
4
5059HCx
1
2
5
4
3
636
Pin
XT
XTN
VDD
Q
VSS
INHN
Function
Crystal connection pins.
Crystal is connected between XT and XTN.
(+)supply voltage
Output(32.768kHz)
(-)ground
Input pin controlled output state(oscillator stops when
LOW),Power-saving pull-up resistor built-in
BLOCK DIAGRAM
INHN
VRG
XT
CG
RF
R
D
CD
DIVIDER
1/512
or
1/1024
CMOS
XTN
Q
VDD
VSS
SEIKO NPC CORPORATION - 2



Part Number 5059H
Description 32kHz output Crystal Oscillator Module ICs
Maker NPC - NPC
Total Page 11 Pages
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