(W25X10 - W25X80) SERIAL FLASH MEMORY

W25X10, W25X20, W25X40, W25X80 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI -1- Publication Release Date: September 22, 2006 Preliminary - Revision I W25X10, W25X20, W25X40, W25X80 Table of Contents1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5 PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5 PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5 PIN CONFIGURATION WSON 6X5-MM .................................................................................... 6 PIN DESCRIPTION..................................................................................................................... 6 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8. 9. Package Types ............................................................................................................... 7 Chip Select (/CS) ............................................................................................................ 7 Serial Data Output (DO) ................................................................................................. 7 Write Protect (/WP)......................................................................................................... 7 HOLD (/HOLD) ............................................................................................................... 7 Serial Clock (CLK) .......................................................................................................... 7 Serial Data Input / Output (DIO) ..................................................................................... 7 BLOCK DIAGRAM ...................................................................................................................... 8 FUNCTIONAL DESCRIPTION ................................................................................................... 9 9.1 SPI OPERATIONS ......................................................................................................... 9 9.1.1 9.1.2 9.1.3 SPI Modes ........................................................................................................................9 Dual Output SPI................................................................................................................9 Hold Function ...................................................................................................................9 Write Protect Features....................................................................................................10 9.2 10. WRITE PROTECTION.................................................................................................. 10 9.2.1 CONTROL AND STATUS REGISTERS................................................................................... 11 10.1 STATUS REGISTER .................................................................................................... 11 10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 BUSY............................................................................................................................11 Write Enable Latch (WEL) ............................................................................................11 Block Protect Bits (BP2, BP1, BP0)..............................................................................11 Top/Bottom Block Protect (TB) .....................................................................................11 Reserved Bits ...............................................................................................................11 Status Register Protect (SRP) ......................................................................................12 Status Register Memory Protection ..............................................................................13 Manufacturer and Device Identification.........................................................................14 Instruction Set (1) ...........................................................................................................15 Write Ensable (06h)......................................................................................................16 Write Disable (04h).......................................................................................................16 10.2 INSTRUCTIONS........................................................................................................... 14 10.2.1 10.2.2 10.2.3 10.2.4 -2- W25X10, W25X20, W25X40, W25X80 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 Read Status Register (05h) ..........................................................................................17 Write Status Register (01h) ..........................................................................................18 Read Data (03h) ...........................................................................................................19 Fast Read (0Bh) ...........................................................................................................20 Fast Read Dual Output (3Bh) .......................................................................................21 Page Program (02h) ...................................................................................................22 Sector Erase (20h) .....................................................................................................23 Block Erase (D8h) ......................................................................................................24 Chip Erase (C7h)........................................................................................................25 Power-down (B9h) ......................................................................................................26 Release Power-down / Device ID (ABh) .....................................................................27 Read Manufacturer / Device ID (90h) .........................................................................29 JEDEC ID (9Fh)..........................................................................................................30 11. ELECTRICAL CHARACTERISTICS (PRELIMINARY) (4) ....................................................... 31 11.1 Absolute Maximum Ratings (1) .................................................................................... 31 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 11.11 Operating Ranges......................................................................................................... 31 Endurance and Data Retention .................................................................................... 32 Power-up Timing and Write Inhibit Threshold .............................................................. 32 DC Electrical Characteristics ........................................................................................ 33 AC Measurement Conditions........................................................................................ 34 AC Electrical Characteristics ........................................................................................ 35 AC Electrical Characteristics (cont’d) ........................................................................... 36 Serial Output Timing ..................................................................................................... 37 Input Timing................................................................................................................. 37 Hold Timing ................................................................................................................. 37 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40 8-contact 6x5 WSON .................................................................................................... 41 8-contact 6x5 WSON Cont’d. ....................................................................................... 42 12. PACKAGE SPECIFICATION .................................................................................................... 38 12.1 12.2 12.3 12.4 12.5 13. 14. ORDERING INFORMATION (1)................................................................................................. 43 REVISION HISTORY ................................................................................................................ 44 -3- Publication Release Date: September 22, 2006 Preliminary - Revision I W25X10, W25X20, W25X40, W25X80 1. GENERAL DESCRIPTION The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X10/20/40/80 array is organized into 512/1024/2048/4096 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (secto