Non-Reflective High Power SPDT Switch

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2176T5N NON-REFLECTIVE HIGH POWER SPDT SWITCH FOR WiMAX DESCRIPTION www.DataSheet4U.com The UPG2176T5N is a non-reflective (50Ω termination) GaAs MMIC high power SPDT (Single Pole Double Throw) switch for WiMAX. This device can operate from frequency 2.3 to 5.85 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package, and is suitable for high-density surface mounting. FEATURES • Control voltage • Low insertion loss : Vcont (H) = 2.5 to 5.0 V (3.0 V TYP.) : Vcont (L) = −0.3 to 0.3 V (0 V TYP.) : Lins1 = 0.45 dB TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.55 dB TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins3 = 0.70 dB TYP. @ f = 4.9 to 5.85 GHz, V • High isolation cont (H) = 3.0 V, Vcont (L) = 0 V : ISL1 = 27 dB TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 24 dB TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL3 = 21 dB TYP. @ f = 4.9 to 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • Power Handling : Pin (1 dB) = +37.0 dBm TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +37.0 dBm TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +37.0 dBm TYP. @ f = 4.9 to 5.85 GHz, V cont (H) = 3.0 V, Vcont (L) = 0 V • Small size : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm) APPLICATIONS • WiMAX and wireless LAN (IEEE802.11a/b/g/n) ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSON (Pb-Free) Marking G4Y Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel μPG2176T5N-E2 μPG2176T5N-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2176T5N-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PG10677EJ01V0DS (1st edition) Date Published July 2007 NS 2007 μPG2176T5N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 6 1 (Top View) 50 Ω 6 6 (Bottom View) 1 Pin No. 1 2 3 Pin Name Vcont1 INPUT Vcont2 OUTPUT2 GND OUTPUT1 G4Y Vcont1 High Low Parameter Parameter 2 5 2 5 5 2 4 5 6 3 4 3 50 Ω 4 4 3 www.DataSheet4U.com Remark Exposed pad : GND TRUTH TABLE Vcont2 Low High INPUT−OUTPUT1 ON OFF INPUT−OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Vcont Pin Pin Pin (OFF) PD TA Tstg Ratings −6.0 to +6.0 +38 +28 +20 150 −45 to +85 −55 to +150 Note Unit V dBm dBm dBm mW °C °C Switch Control Voltage Input Power (ON Port, peak) Input Power (ON Port, average) Input Power (OFF Port) Power Dissipation (average) Operating Ambient Temperature Storage Temperature Note ⏐Vcont1 − Vcont2⏐ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol fopt1 fopt2 fopt3 Switch Control Voltage (H) Switch Control Voltage (L) Vcont (H) Vcont (L) MIN. 2.3 3.3 4.90 +2.5 −0.3 TYP. − − − +3.0 0 MAX. 2.7 3.8 5.85 +5.0 +0.3 Unit GHz GHz GHz V V Operating Frequency 2 Data Sheet PG10677EJ01V0DS μPG2176T5N ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 (INPUT−OFF Port) Isolation 2 (INPUT−OFF Port) www.DataSheet4U.com Isolation 3 (INPUT−OFF Port) Isolation 4 (OUTPUT1−OUTPUT2) Isolation 5 (OUTPUT1−OUTPUT2) Isolation 6 (OUTPUT1−OUTPUT2) Input Return Loss 1 Input Return Loss 2 Input Return Loss 3 Output Return Loss 1 Output Return Loss 2 Output Return Loss 3 Unused Port Return Loss 1 Unused Port Return Loss 2 Unused Port Return Loss 3 1 dB Loss Compression Input Power Note (L) = 0 V, DC blocking capacitors = 8 pF, unless otherwise Symbol Lins1 Lins2 Lins3 ISL1 ISL2 ISL3 ISL4 ISL5 ISL6 RLin1 RLin2 RLin3 RLout1 RLout2 RLout3 URL1 URL2 URL3 Pin (1 dB) Test Conditions f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz f = 2.3 to 2.7 GHz f = 3.3 to 3.8 GHz f = 4.9 to 5.85 GHz MIN. − − − 24 21 18 22 20 17 10 10 10 10 10 10 10 10 10 +35.0 +35.0 +35.0 − − TYP. 0.45 0.55 0.70 27 24 21 25 23 20 15 15 15 15 15 15 15 15 15 +37.0 +37.0 +37.0 16 100 MAX. 0.70 0.80 0.95 − − − − − − − − − − − − − − − − − − 30 250 Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm Switch Control Current Switch Control Speed Icont tSW RF None 50% CTL to 90/10% RF μA ns Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB morethan that of the linear range. Data Sheet PG10677EJ01V0DS 3 μPG2176T5N EVALUATION CIRCUIT 8 pF 6 OUTPUT1 50 Ω Vcont1 1 000 pF 1 INPUT 8 pF 2 5 www.DataSheet4U.com Vcont2 1 000 pF 3 50 Ω 4 8 pF OUTPUT2 The application circuits and its parameters are for reference only, and are not intended for use in actual design-ins. 4 Data Sheet PG10677EJ01V0DS μPG2176T5N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) www.DataSheet4U.com Data Sheet PG10677EJ01V0DS 5 μPG2176T5N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow S o l d e r i n g C ond ition s Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 C on ditio n S ymb ol IR260 For soldering www.DataSheet4U.com Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Preheating temperature (package surface temperature) : 120°C or below Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) Caution Do not use different soldering methods together (except for partial heating). 6 Data Sheet PG10677EJ01V0DS μPG2176T5N • The information in this document is current as of July, 2007. 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