HDLC Controller

www.DataSheet4U.com µPD72103A HDLC CONTROLLER µPD72103A © 1997 Document No. S10766EJ9V0UM00 (9th edition) Date Published March 1997 N CP(N) Printed in Japan www.DataSheet4U.com NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. www.DataSheet4U.com V25+ is a trademark of NEC Corporation. The export of this product from Japan is prohibited without governmental license. To export or re-export this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. The information in this document is subject to change without notice. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M7 96.5 www.DataSheet4U.com PREFACE Target users This manual describes the functions of the µPD72103A to engineers who will use the µPD72103A when designing application systems. Objective The objective of this manual is to describe the hardware functions of the µPD72103A, which includes the following components. Composition This manual can be broadly divided into the following sections. • General • Bus interface • Communication operations • Commands • Status • System configuration example • Example of µPD72103A’s operation sequence • Connecting HDLC controller to a Motorola system • Questions and answers about the µPD72103A • Command list • Status list Use This manual assumes that the reader has a general knowledge of electricity, logic circuits, and microcontrollers. • Users who would like to check commands → Read “CHAPTER 4 COMMAND LIST”. • Users who would like to learn about the µPD72103A’s functions → Read this manual in the order shown in the Table of Contents. • Users who have questions about the µPD72103A’s operations → Read “APPENDIX C Q&A”. www.DataSheet4U.com Legend Data representation weight : High-order digits are indicated at left and low-order digits at right. Active low representation Memory map address Note Caution Remark Number representation : xxx (pin or signal name is overlined) or xxxB (“B” is added after signal and pin names) : High order at low stage and low order at high stage (address 0H) : Explanation of Note in the text : Item deserving extra attention : Supplementary explanation to the text : Decimal number is xxxx Hexadecimal number is xxxxH Appendix C uses the following abbreviations for reference documentation. Data sheet User’s manual Application note → DS → UM → AN Related Documentation Document name Data Sheet S10189JNote User’s Manual This manual Application Note — µPD72103A The corresponding application note for this manual is the µPD72103 APPLICATION NOTE (IEA-713Note). In this application note, all references to the µPD72103 should be understood as referring to the µPD72103A. Note This document number is that of the Japanese version. www.DataSheet4U.com TABLE OF CONTENTS CHAPTER 1 GENERAL ............................................................................................................................ 1 1.1 Features ..................................................................................................................................... 1 1.2 Block Diagram .......................................................................................................................... 2 1.3 Internal Block Functions ......................................................................................................... 3 1.4 Pin Configuration (Top View) ................................................................................................. 4 1.5 Pin Functions ........................................................................................................................... 6 1.6 Initialization via Reset ........................................................................................................... 11 CHAPTER 2 BUS INTERFACE ..............................................................................................................13 2.1 Internal Registers ...................................................................................................................13 2.1.1 2.1.2 2.2.1 2.2.2 2.2.3 2.2.4 2.3.1 2.3.2 2.3.3 Control register ............................................................................................................................. 14 Internal status register .................................................................................................................. 15 Block transfers .............................................................................................................................. 16 Extension of active (low-level) width of MRD and MWR signals ................................................... 17 Basic timing of DMA ...................................................................................................................... 18 Address/data multiplexing ............................................................................................................. 20 Command issuance ...................................................................................................................... 23 Status report ................................................................................................................................. 25 Command chain funct