24 W BTL or 2 x 12 W stereo car radio power amplifier

INTEGRATED CIRCUITS DATA SHEET TDA1510AQ 24 W BTL or 2 x 12 W stereo car radio power amplifier Product specification File under Integrated Circuits, IC01 January 1992 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier GENERAL DESCRIPTION TDA1510AQ The TDA1510AQ is a class-B integrated output amplifier encapsulated in a 13-lead single in-line (SlL) plastic power package. Developed primarily for car radio application, the device can also be used to drive low impedance loads (down to 1,6 Ω). With a supply voltage (VP) of 14,4 V, an output power of 24 W can be delivered into a 4 Ω Bridge Tied Load (BTL), or when used as a stereo amplifier, 2 × 12 W into 2 Ω or 2 × 7 W into 4 Ω. Features • Flexibility − stereo as well as mono BTL • Low offset voltage at the output (important for BTL) • Load dump protection • A.C. short-circuit-safe to ground • Low number, small sized external components • Internal limiting of bandwidth for high frequencies QUICK REFERENCE DATA PARAMETER Supply voltage range: operating non-operating non-operating, load dump protection Repetitive peak output current Total quiescent current Stand-by current Switch-on current Input impedance Storage temperature range Crystal temperature PACKAGE OUTLINE TDA1510AQ: 13-lead SIL-bent-to-DIL; plastic power (SOT 141C); SOT141-6; 1996 Aug 01. pins 1, 2, 12 and 13 |ZI| Tstg Tc 1 −65 − − − − − + 150 150 MΩ °C °C IORM Itot Isb Iso − − − 0,15 − 75 − 0,35 4,0 120 2 0,80 A mA mA mA VP − − 45,0 V VP VP 6,0 − 14,4 − 18,0 28,0 V V CONDITIONS SYMBOL MIN. TYP. MAX. UNIT • High output power • Large useable gain variation • Good ripple rejection • Thermal protection • Low stand-by current possibility • High reliability. January 1992 2 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ Fig.1 Functional diagram; heavy lines indicate signal paths. January 1992 3 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage: operating non-operating non-operating, load dump protection Peak output current Total power dissipation Storage temperature range Crystal temperature see Fig.2 during 50 ms VP IOM Ptot Tstg Tc −65 − − − pin 10 VP VP − − CONDITIONS SYMBOL MIN. TDA1510AQ MAX. 18 28 45 6 + 150 + 150 V V V A UNIT °C °C Fig.2 Power derating curves. January 1992 4 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier HEATSINK DESIGN EXAMPLE The derating of the encapsulation requires the following external heatsink (for sine-wave drive): (Rth j-mb) = 3,5 K/W 24 W BTL (4 Ω) or 2 × 12 W stereo (2 Ω); maximum sine-wave dissipation = 12 W; Tamb = 65 °C (maximum): 150 – 65 R th h-a = --------------------- – 3,5 = 3,5 K/W 12 2 × 7 W stereo (4 Ω); maximum sine-wave dissipation = 6 W; Tamb = 65 °C (maximum): 150 – 65 R th h-a = --------------------- – 3,5 = 10,5 K/W 12 D.C. CHARACTERISTICS PARAMETER Supply voltage range Repetitive peak output current Total quiescent current Stand-by current Switch-on current V11 ≤ V10; note 1 CONDITIONS SYMBOL VP IORM Itot Isb Iso − − − 0,15 MIN. 6,0 − 75 − 0,35 TYP. 14,4 TDA1510AQ MAX. 18,0 4,0 120 2 0,80 V A UNIT mA mA mA January 1992 5 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier A.C. CHARACTERISTICS Tamb = 25 °C; VP = 14,4 V; f = 1 kHz; unless otherwise specified PARAMETER Bridge Tied Load application (BTL) Output power with bootstrap note 6; RL = 4 Ω VP = 13,2 V dtot = 0,5% dtot = 10% VP = 14,4 V dtot = 0,5% dtot = 10% Open loop voltage gain Closed loop voltage gain Frequency response Input impedance Noise output voltage (r.m.s. value) f = 20 Hz to 20 kHz RS = 0 Ω RS = 10 Ω RS = 10 kΩ; according to IEC 179 curve A Supply voltage ripple rejection D.C. output offset voltage between channels Power bandwidth −1 dB; dtot = 0,5% B − f = 100 Hz; note 5 Vn (rms) SVRR |∆V5-9| − 42 − 0,25 50 2 Vn (rms) Vn (rms) − − 0,2 0,35 note 2 at −3 dB; note 3 note 4 Po Po Go Gc fr |Zi| 15,5 20,0 − 39,5 − 1 18,0 24,0 75 40,0 − Po Po − − 15,0 20,0 CONDITIONS SYMBOL MIN. TYP. TDA1510AQ MAX. UNIT − − − − − 40,5 − W W W W dB dB Hz MΩ 20 to > 20 k − − 0,8 mV mV − − 50 mV dB mV 30 to > 40 k − Hz January 1992 6 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier PARAMETER Stereo application Output power; with bootstrap note 6; RL = 4 Ω VP = 13,2 V dtot = 0,5% dtot = 10% VP = 14,4 V dtot = 0,5% dtot = 10% RL = 2 Ω VP = 13,2 V dtot = 0,5% dtot = 10% VP = 14,4 V dtot = 0,5% dtot = 10% Output power; without bootstrap notes 6, 8 and 9 RL = 4 Ω VP = 14,4 V dtot = 10% Frequency response Supply voltage ripple rejection Channel separation Closed loop voltage gain Noise output voltage (r.m.s. value) f = 20 Hz to 20 kHz; RS = 0 Ω RS = 10 kΩ RS = 10 kΩ; according to IEC179 curve A Vn (rms) − 0,2 Vn (rms) Vn (rms) − − 0,15 0,25 notes 3 and 6 −3 dB note 5 f = 1 kHz RS = 10 kΩ; f = 1 kHz note 7 α Gc 40 39,5 50 40,0 SVRR − 50 fr − Po − 6 Po Po 7,75 10,0 9,0 12,0 Po Po − − 7,5 10,0 Po Po 4,5 6,0 5,5 7,0 Po Po − − 4,5 6,0 CONDITIONS SYMBOL MIN. TYP. TDA1510AQ MAX. UNIT − − − − W W W W − − − − W W W W − W Hz dB dB dB 40 to > 20 k − − − 40,5 − − mV mV − mV January 1992 7 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier Notes to the characteristics TDA1510AQ 1. If V11 > V10 then I11 must be < 10 mA. 2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components. 3. Frequency response externally fixed. 4. The input impedance in the test circuit (Fig.3) is typ. 100 kΩ. 5. Supply voltage ripple rejection measured with a source impedance of 0 Ω (maximum ripple amplitude 2 V). 6. Output power is measured directly at the output pins of the IC. 7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components. 8. A resistor of 56 kΩ between pins 3 and 7 is required for symmetrical clipping. 9. Without bootstrap the 100 µF capacitor between pins 5 and 6 and the 100 µF capacitor between pins 8 and 9 can be omitted. Pins 6 and 8 connected to pin 10. January 1992 8 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier APPLICATION INFORMATION TDA1510AQ (1) belongs to power supply. Fig.3 Test and application circuit; Bridge Tied Load (BTL). (1) belongs to power supply. Fig.4 Test and application circuit; stereo mode. January 1992 9 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) TDA1510AQ SOT141-6 non-concave x D Dh Eh view B: mounting base side d A2 B j E A L3 L Q c 1 Z e e1 bp w M 13 m e2 v M 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45 ISSUE DATE 92-11-17 95-03-11 January 1992 10 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA1510AQ The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the