LOW-NOISE VERTICAL DEFLECTION SYSTEM

TDA1175P LOW-NOISE VERTICAL DEFLECTION SYSTEM . . . . COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS ESD PROTECTED DESCRIPTION The TDA1175P is a monolithic integrated circuit in POWERDIP16 plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. PIN CONNECTIONS POWERDIP16 (Plastic Package) ORDER CODE : TDA1175P RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND GROUND POWER AMPLIFIER OUTPUT POWER AMPLIFIER SUPPLY VOLTAGE REGULATED VOLTAGE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 RAMP GENERATOR COMPENSATION AMP. INPUT GROUND GROUND OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT 1175P-01.EPS August 1995 1/8 TDA1175P BLOCK DIAGRAM + VS C4 DA FREQ P1 TDA1175P 11 OSCILLATOR 8 2 3 7 RH C9 VOLTAGE REGULATOR FLYBACK GENERATOR POWER AMPLIFIER 6 RG C8 YOKE C1 SYNC 10 SYNC CIRCUIT RAMP GENERATOR BUFFER STAGE PREAMPLIFIER 15 C5 C7 RE RD 4 5 12 13 TABS HEIGHT 9 C2 P2 RA 16 1 LINEARITY 14 P3 C3 RB RC C6 RF 1175P-02.EPS ABSOLUTE MAXIMUM RATINGS Symbol Vs V6, V7 V14 Io Io Io I3 I3 I10 Ptot Tstg, Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2ms Output Peak Current at f = 50Hz, t ≤ 10µs Output Peak Current at f = 50Hz, t > 10µs Pin 3 DC Current at V6 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5ms Pin 10 Current Power Dissipation : at Ttab = 90°C at Tamb = 70°C (free air) (1) Storage and Junction Temperature Parameter Value 35 60 + 10 – 0.5 2 2.5 1.5 100 1.8 ± 20 4.3 1 – 40, + 150 Unit V V V V A A A mA A mA 1175P-01.TBL 1175P-02.TBL W W °C THERMAL DATA Symbol R th (j-tab) Rth (j-amb) Parameter Thermal Resistance Junction-pin Thermal Resistance Junction-ambient Max. Max. Value 12 80 Unit °C/W °C/W(1) (1) Obtained with tabs soldered to printed circuit with minimized copper area. 2/8 TDA1175P ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. DC CHARACTERISTICS (Refer to the test circuits, VS = 35V) I2 I7 – I 11 – I 14 – I 16 – I 16 ∆I16 I16 Vs V1 V3 V6 V6L V6H V8 V9 Pin 2 Quiescent Current Pin 7 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Qiuescent output Voltage Output Saturation Voltage to Ground I1 = 1mA I3 = 10mA Vs = 10V, R1 = 1kΩ, R2 = 1kΩ Vs = 35V, R1 = 3kΩ, R2 = 1kΩ – I6 = 0.1A – I6 = 0.8A 4.1 8.2 I3 = 0 I6 = 0 V11 = 1V V14 = 1V V16 = 0 I9 = 20µA, V16 = 0 ∆V16 = 0 to 12V, I9 = 20µA 10 1 1.5 4.4 8.8 0.9 1.8 1.4 2.8 6.5 I9 = 20µA ∆Vs = 10 to 35V V10 ≤ 0.4V 2.20 6.6 6.7 6.8 1 2.27 18.5 7 8 0.1 1 0.02 20 0.2 14 17 1 10 0.3 21.5 1 35 1.4 2.5 4.7 9.4 1.2 2.2 2.1 3.1 6.9 7 2 2.35 mA mA µA µA µA µA % V V V V V V v V V V V mV/V V 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b 1b 1b 1a 1b 1a 1b 1b Output Saturation Voltage to Supply I6 = 0.1A I6 = 0.8A Regulated Voltage at Pin 8 Regulated Voltage at Pin 9 |∆V8| |∆V9| Regulated Voltage Drift with Supply , Voltage ∆VS ∆VS V14 Amplifier Input Reference Voltage AC CHARACTERISTICS (Refer to the AC test circuit, VS = 22V, f = 50Hz) Is I10 V6 tfly VON fo fOPER ∆f ∆f ∆VS |∆f| ∆T ab Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Operating Frequency Range Synchronization Range I10 = 0.5mA, C9 = 0.1µF (P1+R1) = 300kΩ Iy = 1APP Iy = 1APP Pin 11 Connected to GND (P1 + R1) = 300kΩ C9 = 0.1 µF 36 10 14 Iy = 1APP 0.5 45 0.7 18 43.5 120 30 140 2 mA mA V ms mVpp Hz Hz Hz 2 2 2 2 2 2 2 2 Frequency Drift with Supply Voltage Vs = 10 to 35V Frequency Drift with tab Temperature Ttab = 40 to 120°C 0.005 0.01 Hz/V Hz/°C 2 2 1175P-03.TBL 3/8 TDA1175P Figure 1 : DC Test Circuits Figure 1a I3 +V S Figure 1b I2 +V S V3 I5 3 10 2 7 6 14 R1 2 11 8 V4 R2 1175P-03.EPS 7 TDA1175P 11 I8 1kΩ 1V - I9 1V 8V 9 16 TABS - I 12 TDA1175P 16 - I 12 100kΩ 9 14 TABS V7 - I 10 1V 1175P-04.EPS V6 Figure 1c +V S Figure 1d +V S 2 11 7 6 I4 2 11 7 6 V 4H TDA1175P 14 TABS TDA1175P 14 TABS V4L 4V 1175P-05.EPS I4 1V 1175P-06.EPS 4/8 TDA1175P Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1APP VS = 22V 0.1µF 100µF 7 1N4001 TABS 2 470µF 0.1µF 3.3Ω 6 3 220kΩ 15 100pF 5.6kΩ Yoke Ry = 10Ω Ly = 20mH 560Ω* SYNC. INPUT 10 470pF 1000µF TDA1175P 14 5.6kΩ 10µF 22kΩ 1 11 100kΩ 8 9 16 P1 100kΩ R1 47kΩ 220kΩ 100kΩ 0.1µF C9 0.1µF 0.1µF 1.8kΩ * on application only Figure 3 : Typical Application Circuit for VGA Monitor (RY = 10Ω, LY = 20mH, IY = 0.8APP) C9 3.3nF C10 560pF R12 220kΩ R13 3.3Ω C11 0.1µF 6 R11 2.7kΩ C12 470µF 50V VS (26V) C1 0.1µF C2 1000µF 35V D1 1N4007 7 15 2 C8 22µF 35V R7 27kΩ R14 220Ω 1/2W R1 3.3kΩ C3 100µF 35V 3 10 11 14 Y1 YOKE TDA1175P R8 1 47kΩ P3 50kΩ 8 9 16 4 5 12 13 C4 0.15µF R9 5.1kΩ V.LIN R6 56kΩ R10 0.82Ω R2 82kΩ P1 100kΩ V. FREQ R5 200kΩ C5 1.8nF P2 220kΩ V. SIZE R4 1MΩ C6 0.1µF C7 0.1µF R3 240kΩ 5/8 1175P-08.EPS 1175P-07.EPS 120kΩ 910kΩ 1Ω TDA1175P Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale) V-SIZE V-FREQ C9 C12 C18 R12 P1 P2 R6 R9 C6 R18 R2 C2 R11 C4 C11 R10 R1 D1 GN D VS C1 Y1 R8 C8 IC1 C3 R14 R7 P3 V.LIN R4 C7 C6 R8 R6 R BILL OF MATERIAL Item 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Qty 4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Reference C1, C6, C7, C11 C2 C3 C4 C5 C8 C9 C10 C12 D1 IC1 P1 P2 P3 R1 Part 0.1µF 1000µF 35V 100µF 35V 0.15µF 1.8nF 22µF 35V 3.3nF 560pF 470µF 50V 1N4007 TDA1175P 100kΩ POT 220kΩ POT 50kΩPOT 3.3kΩ Item 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Qty 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Reference R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 Y1 Part 82kΩ 240kΩ 1MΩ 200kΩ 56kΩ 27kΩ 47kΩ 5.1kΩ 0.82Ω 2.7kΩ 220kΩ 220Ω 1/2W YOKE 1175P-04.TBL 3.3Ω 6/8 1175P-09.EPS TDA1175P MOUNTING INSTRUCTION The Rth (j-a) can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 5) or to an external heatsink (Figure 6). The diagram of Figure 7 shows the maximum dissipable power Ptot and the Rth (j-a) as a function of the side ”I” of two equal square copper areas Figure 5 : Example of P.C. Board Copper Area having a thicknessof 35µ (1.4 mils). During soldering the pins temperature must not exceed 260°C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 6 : External Heatsink Mounting Example Figure 7 : Maximum Power Dissipation and Junction-ambient Thermal Resistance versus ”I” 1175P-10.EPS Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature 1175P-12.EPS 7/8 1175P-13.EPS 1175P-11.EPS TDA1175P PACKAGE MECHANICAL DATA 16 PINS - PLASTIC POWERDIP a1 I b Z B e3 e L b1 E D 16 9 F 1 8 Dimensions a1 B b b1 D E e e3 F i L Z Min. 0.51 0.85 0.38 Millimeters Typ. Max. 1.4 Min. 0.020 0.033 0.015 Inches Typ. Max. 0.055 0.5 0.5 20 8.8 2.54 17.78 7.1 5.1 3.3 1.27 0.020 0.020 0.787 0.346 0.100 0.700 DIP16PW.TBL 0.280 0.201 0.130 0.050 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1995 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8 PMDIP16W.EPS