LOW-NOISE TV VERTICAL DEFLECTION SYSTEM

TDA1170N LOW-NOISE TV VERTICAL DEFLECTION SYSTEM . . . COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS DESCRIPTION The TDA1170N is a monolithic integrated circuit in a 12-lead quad in-line plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. PIN CONNECTIONS FINDIP12 (Plastic Package) ORDER CODE : TDA1170N RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND POWER AMPLIFLIER OUTPUT POWER AMPLIFLIER SUPPLY VOLTAGE REGULATED VOLTAGE 1 2 3 12 11 10 RAMP GENERATOR COMPENSATION AMP. INPUT GROUND 4 5 6 9 8 7 OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT 1170N-01.EPS December 1992 1/8 TDA1170N BLOCK DIAGRAM + VS C4 DA FREQ 6 2 3 5 RH C9 P1 TDA1170N 9 OSCILLATOR VOLTAGE REGULATOR FLYBACK GENERATOR POWER AMPLIFLIER 4 C1 RG C8 SYNC 8 YOKE SYNC CIRCUIT RAMP GENERATOR BUFFER STAGE PREAMPLIFLIER 11 C5 C7 RE RD 7 TABS C2 P2 RA 12 1 LINEARITY 10 P3 C3 RB RC C6 RF 1170N-02.EPS HEIGHT ABSOLUTE MAXIMUM RATINGS Symbol VS V4, V5 V10 Io Io Io I3 I3 I8 Ptot Tstg, Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2msec Output Peak Current at f = 50Hz t ≤ 10µsec Output Peak Current at f = 50Hz t > 10µsec Pin 3 DC Current at V4 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5msec Pin 8 Current Power Dissipation : at Tab = 90°C at Tamb = 80°C (free air) Storage and Junction Temperature Parameter Value 35 60 + 10 – 0.5 2 2.5 1.5 100 1.8 ± 20 5 1 – 40, +150 Unit V V V V A A A mA A mA W W °C 1170N-01.TBL 1170N-02.TBL THERMAL DATA Symbol Rth j-tab R th j-amb Parameter Thermal Resistance Junction-tab Thermal Resistance Junction-ambient Max Max Value 12 70 Unit °C/W °C/W * * Obtained with tabs soldered to printed circuit with minimized copper area. 2/8 TDA1170N ELECTRICAL CHARACTERISTICS (Refer to the test circuits, VS = 35 V, Tamb = 25oC,unless otherwise specified) DC CHARACTERISTICS Symbol I2 I5 – I9 – I10 – I12 – I12 ∆I12 I12 Vs V1 V3 V4 Parameter Pin 2 Quiescent Current Pin 5 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Qiuescent output Voltage I1 = 1mA I3 = 10mA VS = 10V R1 = 1kΩ, R2 = 1kΩ VS = 35V R1 = 3kΩ, R2 = 1kΩ V4L V4H V6 V7 |∆V6| ∆V7 ; ∆VS ∆VS V10 R8 Output Saturation Voltage to Ground Output Saturation Voltage to Supply Regulated Voltage at Pin 6 Regulated Voltage at Pin 7 Regulated Voltage Drift with Supply Voltage Amplifier Input Reference Voltage Pin 8 Input Resistance V8 ≤ 0.4V I7 = 20µA ∆VS = 10 to 35V 2.07 1 – I4 = 0.1A – I4 = 0.8A I4 = 0.1A I4 = 0.8A 6.1 6.2 4.1 8.3 Test Conditions I3 = 0 I4 = 0 V9 = 1V V10 = 1V V12 = 0 I7 = 20µA, V12 = 0 ∆V12 = 0 to 12V, I7 = 20µA 10 1 300 4.4 8.8 0.9 1.9 1.4 2.8 6.5 6.6 1 2.2 2.3 18.5 Min. Typ. 7 8 0.1 1 0.02 20 0.2 Max. 14 17 1 10 0.3 21.5 1 35 1.4 450 4.75 9.45 1.2 2.3 2.1 3.2 6.9 7 Unit mA mA µA µA µA µA % V V mV V V V V V V V V mV/V V MΩ 1a 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b 1170N-03.TBL Fig. 1b 1b 1a 1b 1a 1b 1b 3/8 TDA1170N Figure 1 : DC Test Circuits Figure 1a Figure 1b I2 V3 I3 + Vs + Vs I5 2 3 2 5 5 8 TDA1170N 9 I8 7 1kΩ 12 TABS 10 4 9 R1 TDA1170N TABS 6 12 7 10 - I9 1V 8V - I12 R2 V4 V6 - I12 V7 - I10 1V 100kΩ 1170N-03.EPS 1V 1170N-04.EPS Figure 1c + Vs Figure 1d + Vs 2 5 I4 2 5 V4H 9 TDA1170N TABS 10 4 9 TDA1170N TABS 10 4 4V V4L 1V 1170N-05.EPS I4 1170N-06.EPS 4/8 TDA1170N ELECTRICAL CHARACTERISTICS (Refer to the AC test circuit, VS = 22V ; f = 50Hz ; Tamb = 25°C, unless otherwise specified) AC CHARACTERISTICS Symbol Is I8 V4 tfly VON fo ∆f ∆f ∆VS | ∆f | ∆Tab Parameter Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Sychronization Range Frequency Drift with Supply Voltage Frequency Drift with tab Temperature Iy = 1App Iy = 1App Pin 9 Connected to GND (P1 + R1) = 300kΩ, C2 = 0.1µF (P1 + R1) = 260kΩ, C2 = 0.1µF I8 = 0.5mA Vs = 10 to 35V Ttab = 40 to 120°C 14 0.005 0.01 42.2 48.5 Test Conditions Iy = 1App 500 45 0.7 40 Min. Typ. 140 Max. Unit mA µA V ms mVPP Hz Hz Hz 1170N-04.TBL 1170N-07.EPS Hz/V Hz/°C Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1App V S = 2.2V 1N4001 TABS 470µF 0.1µF 100µF 3 5 2 3.3Ω 0.1µF 4 Sync. Input 8 T D A 1 1 7 0 N 220kΩ 11 100pF 5.6kΩ 470pF 5.6kΩ 10 22kΩ µ YOKE Ry = 10Ω Ly = 20mH 1000µF 9 1 100kΩ P1 R1 6 7 47kΩ 100kΩ 1.8kΩ 0.1µF 0.1µF 1Ω C2 0.1µF 120kΩ 910kΩ 5/8 TDA1170N Figure 3 : Typical Application Circuit for Small Screen 90°TVC Set (RY = 15Ω, LY = 30mH, IY = 0.82 App) V S = 26V D1 1N4001 TABS C1 0.1µF C4 100 µF 3 C5 470µF 5 2 R8 3.3Ω 4 C10 0.1µF f sync = 50Hz C2 0.1µF 8 R1 4.7kΩ T D A 1 1 7 0 N R5 390kΩ C6 470pF 10 R6 18kΩ 1 P3 100kΩ R7 47kΩ C9 100pF R11 5.6kΩ R13 270Ω YOKE Ry = 15Ω Ly = 30mH R10 5.6kΩ C11 10µF C12 1000µF 9 P1 100kΩ R2 150kΩ 6 7 12 P2 100kΩ R3 100kΩ R4 680kΩ C7 0.1µF C8 0.1µF R9 1.5kΩ Figure 4 : P.C. Board and Components Layout of the Circuit of fig. 3 (1:1 scale) 6/8 1170N-09.TIF 1170N-08.EPS C3 0.15µF R12 1Ω TDA1170N MOUNTING INSTRUCTION During soldering the tab temperature must not exceed 260°C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. The junction to ambient thermal resistance can be Figure 5 : Example of P.C. Board Copper Area Used as Heatsink reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). The diagram of fig. 7 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side ”e” of two equal square copper areas having a thicknessof 35 µ (1.4 mil). Figure 6 : Example of External heatsink 1170N-10.EPS Figure 7 : Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus ”e” Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature 1170N-12.EPS 7/8 1170N-13.EPS 1170N-11.EPS TDA1170N PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP D G e4 A a1 I b c c1 e5 e6 e3 E2 E e E1 K D 12 7 1 6 F L M b1 Dimensions A a1 b b1 c c1 D E E1 E2 e e3 e4 e5 e6 F G I K L M Min. 3.8 1.5 0.55 0.3 Millimeters Typ. Max. 4.05 1.75 0.6 0.35 Min. 0.150 0.059 0.022 0.012 Inches Typ. Max. 0.159 0.069 0.024 0.014 1.32 0.94 19.2 16.8 4.86 10.11 2.29 17.43 7.27 12.35 6.3 7.8 6.1 2.5 2.5 17.2 19.9 17.6 5.56 10.81 2.79 18.13 7.97 13.05 7.1 8.6 6.5 2.9 3.1 0.756 0.661 0.191 0.398 0.090 0.686 0.286 0.486 0.248 0.307 0.240 0.098 0.098 0.052 0.037 0.677 0.783 0.693 0.219 0.426 0.110 0.714 0.314 0.514 0.280 0.339 0.256 0.114 2.54 17.78 7.62 7.62 12.7 9.8 0.100 0.700 0.300 0.300 0.500 0.386 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8 FINDIP.TBL PM-FDIP.EPS