POWER SCHOTTKY RECTIFIER

www.DataSheet4U.com STPS745 Power Schottky rectifier Main product characteristics A K IF(AV) VRRM Tj (max) VF(max) 7.5 A 45 V 150° C 0.57 V NC A K Features and Benefits ■ ■ ■ ■ D2PAK STPS745G Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-220FPAC Insulating voltage = 2000 V DC Capacitance = 12 pF Avalanche capability specified K A A K ■ Description Single Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged either in TO-220AC, TO-220FPAC or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ’’‘ TO-220AC STPS745D TO-220FPAC STPS745FP March 2007 Rev 7 1/9 www.st.com 9 www.DataSheet4U.com Characteristics STPS745 1 Characteristics Table 1. Symbo l VRRM ’ Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage Value 45 20 TO-220AC / D2PAK TO-220FPAC Tc = 160° C Tc = 145° C 150 1 2 2700 -65 to + 175 175 10000 A A A Unit V A IF(RMS) RMS forward voltage IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Average forward current δ = 0.5 Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range 7.5 A tp = 10 ms Sinusoidal tp = 2 µs square F = 1 kHz tp = 100 µs square tp = 1 µs Tj = 25° C W °C °C V/µs Maximum operating junction temperature (1) Critical rate of rise of reverse voltage < 1 ------------------------Rth ( j – a ) thermal runaway condition for a diode on its own heatsink Table 2. Symbol Rth (j-c) Thermal resistances Parameter TO-220AC / D2PAK Junction to case TO-220FPAC 5.5 Value 3.0 °C/W Unit Table 3. Symbol IR(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 125° C VR = VRRM IF = 7.5 A IF = 15 A IF = 15 A 0.65 Min. Typ. Max. 100 5 0.5 15 0.57 0.84 0.72 V Unit µA mA VF(1) Forward voltage drop Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.020 IF2(RMS) 2/9 www.DataSheet4U.com STPS745 Characteristics Figure 1. PF(AV)(W) 6 5 4 3 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) 9 Average forward current versus ambient temperature (δ = 0.5) δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 8 7 Rth(j-a)=Rth(j-c) TO-220AC δ=1 TO-220FPAC 6 Rth(j-a)=15°C/W 5 4 Rth(j-a)=40°C/W 2 1 T 3 2 T IF(AV)(A) 0 0 1 2 3 4 5 6 7 δ=tp/T 8 9 tp 1 0 δ=tp/T 0 25 tp Tamb(°C) 50 75 100 125 150 175 10 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25°C) 0.01 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC and D2PAK) Figure 6. Non repetitive surge peak forwardcurrent versus overload duration (maximum values) (TO-220FPAC) IM(A) 120 100 80 60 40 20 0 1E-3 IM t IM(A) 80 70 60 50 TC=50°C TC=100°C TC=50°C 40 TC=100°C 30 20 IM TC=150°C TC=150°C t δ=0.5 t(s) 1E-2 1E-1 1E+0 10 0 1E-3 δ=0.5 t(s) 1E-2 1E-1 1E+0 3/9 www.DataSheet4U.com Characteristics STPS745 Figure 7. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220AC and D2PAK) Figure 8. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220FPAC) Zth(j-c)/Rth(j-c) 1.0 Zth(j-c)/Rth(j-c) 1.0 0.8 0.8 0.6 δ = 0.5 0.6 δ = 0.5 0.4 δ = 0.2 δ = 0.1 0.4 δ = 0.2 T 0.2 0.2 δ = 0.1 T Single pulse tp(s) 1E-3 1E-2 0.0 1E-4 δ=tp/T 1E-1 tp Single pulse tp(s) 1E-2 1E-1 1E+0 0.0 1E-3 δ=tp/T 1E+0 tp 1E+1 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C IR(µA) 5E+4 1E+4 Tj=150°C Tj=125°C 1E+3 Tj=100°C Tj=75°C 500 1E+2 Tj=50°C 1E+1 Tj=25°C 200 1E+0 VR(V) 1E-1 0 5 10 15 20 25 30 35 40 45 100 1 2 5 VR(V) 10 20 50 Figure 11. Forward voltage drop versus forward current (maximum values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm) Rth(j-a)(°C/W) 80 IFM(A) 100.0 Tj=125°C (typical values) 70 Tj=25°C 60 50 10.0 Tj=125°C 40 30 1.0 20 10 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(Cu)(cm²) 0 0 2 4 6 8 10 12 14 16 18 20 4/9 www.DataSheet4U.com STPS745 Package information 2 Package information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm D2PAK dimensions Dimensions Ref Millimeters Min. A A E L2 Table 4. Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 5/9 www.DataSheet4U.com Package information Table 5. TO-220FPAC dimensions Dimensions Ref Millimeters Min. A A H B STPS745 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 0.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 6/9 www.DataSheet4U.com STPS745 Table 6. TO-220AC dimensions Package information Dimensions Ref Millimeters Min. A H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 C D E F F1 F2 G 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 F1 L9 L4 F D G1 H2 L2 M E 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 L4 L5 L6 L7 L9 M Diam. G 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 www.DataSheet4U.com Ordering information STPS745 3 Ordering information Delivery mode Tube Tube Tape & reel Tube Ordering type STPS745D STPS745G STPS745G-TR STPS745FP Marking STPS745D STPS745G STPS745G STPS745FP Package TO-220AC Weight 1.86 g 1.48 g 1.48 g 1.9 g Base qty 50 50 1000 50 D2PAK D2PAK TO-220FPAC 4 Revision history Date Jul-2003 22-Mar-2007 Revision 6G 7 Last release. Removed ISOWATT package. Description of Changes 8/9 www.DataSheet4U.com STPS745 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this