STK10C68
STK10C68-M SMD#5962-93056 8K x 8 nvSRAM QuantumTrap™ CMOS Nonvolatile Static RAM
FEATURES
• 25ns, 35ns, 45ns and 55ns Access Times • STORE to Nonvolatile Elements Initiated by Hardware • RECALL to SRAM Initiated by Hardware or Power Restore • Automatic STORE Timing • 10mA Typical ICC at 200ns Cycle Time • Unlimited READ, WRITE and RECALL Cycles • 1,000,000 STORE Cycles to Nonvolatile Elements (Industrial/Commercial) • 100-Year Data Retention (Industrial/Commercial) • Commercial, Industrial and Military Temperatures • 28-Pin DIP, SOIC and LCC Packages
DESCRIPTION
The Simtek STK10C68 is a fast static RAM with a nonvolatile element incorporated in each static memory cell. The SRAM can be read and written an unlimited number of times, while independent nonvolatile data resides in Nonvolatile Elements. Data may easily be transferred from the SRAM to the Nonvolatile Elements (the STORE operation), or from the Nonvolatile Elements to the SRAM (the RECALL operation), using the NE pin. Transfers
from the Nonvolatile Elements to the SRAM (the RECALL operation) also take place automatically on restoration of power. The STK10C68 combines the high
performance and ease of use of a fast SRAM with nonvolatile data integrity. The STK10C68 features industry-standard pinout for nonvolatile RAMs. MIL-STD-883 and Standard Military Drawing (SMD #5962-93056) devices are available.
BLOCK DIAGRAM
QUANTUM TRAP 128 x 512 ROW DECODER
PIN CONFIGURATIONS
NE A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15
A5 A6 A7 A8 A9 A11 A12
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
STORE STATIC RAM ARRAY 128 x 512 RECALL
VCC W NC A8 A9 A11 G A10 E DQ7 DQ6 DQ5 DQ4 DQ3
28 - LCC
28 - DIP 28 - SOIC
INPUT BUFFERS
COLUMN I/O COLUMN DEC
STORE/ RECALL CONTROL
PIN NAMES
A0 - A12 W Address Inputs Write Enable Data In/Out Chip Enable Output Enable Nonvolatile Enable Power (+ 5V) Ground
A0 A1 A2 A3 A4 A10
G NE E W
DQ0 - DQ7 E G NE VCC VSS
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STK10C68
ABSOLUTE MAXIMUM RATINGSa
Voltage on Input Relative to Ground . . . . . . . . . . . . . .–0.5V to 7.0V Voltage on Input Relative to VSS . . . . . . . . . . –0.6V to (VCC + 0.5V) Voltage on DQ0-7 . . . . . . . . . . . . . . . . . . . . . . –0.5V to (VCC + 0.5V) Temperature under Bias . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W DC Output Current (1 output at a time, 1s duration) . . . . . . . . 15mA
Note a: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC CHARACTERISTICS
SYMBOL ICC b
1
(VCC = 5.0V ± 10%)
COMMERCIAL MIN MAX 85 75 65 N/A 3 10 27 23 20 N/A 750 ±1 ±5 2.2 VSS – .5 2.4 0.4 0 70 –40/-55 VCC + .5 0.8 2.2 VSS – .5 2.4 0.4 85/125 INDUSTRIAL/ MILITARY MIN MAX 90 75 65 55 3 10 28 24 21 20 1500 ±1 ±5 VCC + .5 0.8 mA mA mA mA mA mA mA mA mA mA µA µA µA V V V V °C tAVAV = 25ns tAVAV = 35ns tAVAV = 45ns tAVAV = 55ns All Inputs Don’t Care, VCC = max W ≥ (V CC – 0.2V) All Others Cycling, CMOS Levels tAVAV = 25ns, E ≥ VIH tAVAV = 35ns, E ≥ VIH tAVAV = 45ns, E ≥ VIH tAVAV = 55ns, E ≥ VIH E ≥ (V CC – 0.2V) All Others VIN ≤ 0.2V or ≥ (VCC – 0.2V) VCC = max VIN = VSS to VCC VCC = max VIN = VSS to VCC, E or G ≥ VIH All Inputs All Inputs IOUT = – 4mA IOUT = 8mA UNITS NOTES
PARAMETER
Average VCC Current
ICC c
2 3
Average VCC Current during STORE Average VCC Current at tAVAV = 200ns 5V, 25°C, Typical Average VCC Current (Standby, Cycling TTL Input Levels)
ICC b ISB d
1
ISB d
2
VCC Standby Current (Standby, Stable CMOS Input Levels) Input Leakage Current Off-State Output Leakage Current Input Logic “1” Voltage Input Logic “0” Voltage
IILK IOLK VIH VIL VOH VOL TA
Note a: Output Logic “1” Voltage
Output Logic “0” Voltage Operating Temperature
Note b: ICC and ICC are dependent on output loading and cycle rate. The specified values are obtained with outputs unloaded. 1 3 Note c: ICC is the average current required for the duration of the STORE cycle (tSTORE ) . 2 Note d: E ≥ VIH will not produce standby current levels until any nonvolatile cycle in progress has timed out.
AC TEST CONDITIONS
Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 3V Input Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 5ns Input and Output Timing Reference Levels . . . . . . . . . . . . . . . 1.5V Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Figure 1
5.0V
480 Ohms OUTPUT 255 Ohms
CAPACITANCEe
SYMBOL CIN COUT PARAMETER Input Capacitance Output Capacitance
(TA = 25°C, f = 1.0MHz)
MAX 8 7 UNITS pF pF CONDITIONS
∆V = 0 to 3V ∆V = 0 to 3V
30 pF INCLUDING SCOPE AND FIXTURE
Note e: These parameters are guaranteed but not tested.
Figure 1: AC Output Loading
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STK10C68
SRAM READ CYCLES #1 & #2
SYMBOLS NO. 1 2 3 4 5 6 7 8 9 10 11 #1, #2 tELQV tAVAVf tAVQVg tGLQV tAXQXg tELQX tEHQZh tGLQX tGHQZh tELICCHe tEHICCLd, e Alt. tACS tRC tAA tOE tOH tLZ tHZ tOLZ tOHZ tPA tPS PARAMETER Chip Enable Access Time Read Cycle Time Address Access Time Output Enable to Data Valid Output Hold after Address Change Chip Enable to Output Active Chip Disable to Output Inactive Output Enable to Output Active Output Disable to Output Inactive Chip Enable to Power Active Chip Disable to Power Standby 0 25 0 10 0 35 5 5 10 0 10 0 45 25 25 10 5 5 10 0 12 0 55 STK10C68-25 MIN MAX 25 35 35 15 5 5 12 0 12 STK10C68-35 MIN MAX 35 45 45 20 5 5 12 MIN
(VCC = 5.0V ± 10%)
STK10C68-45 MAX 45 55 55 25 STK10C68-55 MIN MAX 55 UNITS ns ns ns ns ns ns ns ns ns ns ns
Note f: W must be high during SRAM READ cycles and low during SRAM WRITE cycles. NE must be high during entire cycle. Note g: I/O state assumes E, G < VIL, W > VIH , and NE ≥ VIH; device is continuously selected. Note h: Measured + 200mV from steady state output voltage.
SRAM READ CYCLE #1: Address Controlledf, g
tAVAV ADDRESS tAXQX DQ (DATA OUT)
5 3 2
tAVQV DATA VALID
SRAM READ CYCLE #2: E Controlledf
tAVAV ADDRESS tELQV E
6 tELQX 1 1 1 2
tEHICCL
7
tEHQZ
G
8 tGLQX
tGLQV
4
tGHQZ
9
DQ (DATA OUT) tELICCH ICC
STANDBY 10 ACTIVE
DATA VALID
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STK10C68
SRAM WRITE CYCLES #1 & #2
NO. 12 13 14 15 16 17 18 19 20 21 SYMBOLS #1 tAVAV tWLWH tELWH tDVWH tWHDX tAVWH tAVWL tWHAX tWLQZh, i tWHQX #2 tAVAV tWLEH tELEH tDVEH tEHDX tAVEH tAVEL tEHAX Alt. tWC tWP tCW tDW tDH tAW tAS tWR tWZ tOW PARAMETER Write Cycle Time Write Pulse Width Chip Enable to End of Write Data Set-up to End of Write Data Hold after End of Write Address Set-up to End of Write Address Set-up to Start of Write Address Hold after End of Write Write Enable to Output Disable Output Active after End of Write 5 STK10C68-25 MIN 25 20 20 10 0 20 0 0 10 5 MAX STK10C68-35 MIN 35 25 25 12 0 25 0 0 13 5 MAX MIN 45 30 30 15 0 30 0 0 14 5
(VCC = 5.0V ± 10%)
STK10C68-45 MAX STK10C68-55 MIN 55 45 45 30 0 45 0 0 15 MAX UNITS ns ns ns ns ns ns ns ns ns ns
Note i: Note j:
If W is low when E goes low, the outputs remain in the high-impedance state. E or W must be ≥ VIH during address transitions. NE ≥ VIH.
SRAM WRITE CYCLE #1: W Controlledj
tAVAV ADDRESS tELWH E
14 19 12
tWHAX
18 tAVWL
tAVWH tWLWH
15 13
17
W
tDVWH DATA IN tWLQZ DATA OUT
PREVIOUS DATA HIGH IMPEDANCE 20 DATA VALID
16 tWHDX
tWHQX
21
SRAM WRITE CYCLE #2: E Controlledj
tAVAV ADDRESS tAVEL E
18 14 19 12
tELEH
tEHAX
tAVEH W tWLEH
15 16 13
17
tDVEH DATA IN DATA OUT
HIGH IMPEDANCE DATA VALID
tEHDX
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STK10C68
STORE INHIBIT/POWER-UP RECALL
NO. 22 23 24 25 SYMBOLS Standard tRESTORE tSTORE VSWITCH VRESET Power-up RECALL Duration STORE Cycle Duration Low Voltage Trigger Level Low Voltage Reset Level PARAMETER
(VCC = 5.0V + 10%)
STK10C68 MIN MAX 550 10 4.0 4.5 3.6 UNITS NOTES µs ms V V k
Note k:
tRESTORE starts from the time VCC rises above VSWITCH.
STORE INHIBIT/POWER-UP RECALL
VCC
5V 24 VSWITCH 25 VRESET
STORE INHIBIT
POWER-UP RECALL 22 tRESTORE DQ (DATA OUT)
POWER-UP RECALL
BROWN OUT STORE INHIBIT NO RECALL (VCC DID NOT GO BELOW VRESET)
BROWN OUT STORE INHIBIT NO RECALL (VCC DID NOT GO BELOW VRESET)
BROWN OUT STORE INHIBIT RECALL WHEN VCC RETURNS ABOVE VSWITCH
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STK10C68
MODE SELECTION
E H L L L L L L W X H L H L L H G X L X L H L H NE X H H L L L X MODE Not Selected Read SRAM Write SRAM Nonvolatile RECALLl Nonvolatile STORE No Operation POWER Standby Active Active Active ICC2 Active
Note l:
An automatic RECALL takes place at power up, starting when VCC exceeds 4.25V and taking tRESTORE.
STORE CYCLES #1 & #2
NO. 26 27 28 29 30 31 32 tNLWL tELWL tWLEL SYMBOLS #1 tWLQXm tWLNHn #2 tELQX tELNH Alt. tSTORE tWC STORE Cycle Time STORE Initiation Cycle Time Output Disable Set-up to NE Fall tGHEL tNLEL Output Disable Set-up to E Fall NE Set-up Chip Enable Set-up Write Enable Set-up PARAMETER
(VCC = 5.0V ± 10%)
MIN MAX 10 20 0 0 0 0 0 UNITS ms ns ns ns ns ns ns
tGHNL
Note m: Measured with W and NE both returned high, and G returned low. STORE cycles are inhibited below 4.0V. Note n: Once tWC has been satisfied by NE, G, W and E, the STORE cycle is completed automatically. Any of NE, G, W or E may be used to terminate the STORE initiation cycle. Note o: If E is low for any period of time in which W is high while G and NE are low