N-CHANNEL Power MOSFET

STB270N4F3 STI270N4F3 - STP270N4F3 N-channel 40V - 2.1mΩ - 160A - TO-220 - D2PAK - I2PAK STripFET™ Power MOSFET General features Type STB270N4F3 STI270N4F3 STP270N4F3 ■ ■ VDSS 40V 40V 40V RDS(on) <2.9mΩ <2.5mΩ <2.9mΩ ID 120A 160A 120A PTOT 330W 330W 1 3 2 3 12 330W TO-220 I²PAK 100% avalanche tested Standard threshold drive 3 Description This N-Channel enhancement mode MOSFET is the latest refinement of STMicroelectronics unique “Single Feature Size™“strip-based process with less critical alignment steps and therefore a remarkable manufacturing reproducibility. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and low gate charge. 1 D²PAK Internal schematic diagram Applications ■ High current, switching application – Automotive Order codes Part number STB270N4F3 STI270N4F3 STP270N4F3 Marking 270N4F3 270N4F3 270N4F3 Package D²PAK I²PAK TO-220 Packaging Tape & reel Tube Tube February 2007 Rev1 1/15 www.st.com 15 Contents STB270N4F3 - STI270N4F3 - STP270N4F3 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 4 5 6 Test circuit ................................................ 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Electrical ratings 1 Electrical ratings Table 1. Symbol VDS VGS ID(1) ID(1) IDM (2) Absolute maximum ratings Value Parameter TO-220/I²PAK Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25°C Drain current (continuous) at TC=100°C Drain current (pulsed) Total dissipation at TC = 25°C Derating factor 120 120 480 330 2.2 3.5 1 -55 to 175 40 ± 20 160 160 640 D²PAK V V A A A W W/°C V/n J °C Unit PTOT dv/dt(3) EAS(4) TJ Tstg Peak diode recovery voltage slope Single pulse avalanche energy Operating junction temperature Storage temperature 1. Current limited by package 2. Pulse width limited by safe operating area 3. ISD ≤ 120A, di/dt ≤ 200A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX 4. Starting Tj=25°C, Id =80A, Vdd=32V Table 2. Symbol Rthj-case Rthj-pcb (1) Thermal data Value Parameter TO-220/I²PAK Thermal resistance junction-case max Thermal resistance junction-pcb max Thermal resistance junction-ambient max Maximum lead temperature for soldering purpose (for 10 sec, 1.6mm from case) -62.5 300 0.45 35 --D²PAK °C/W °C/W °C/W °C Unit Rthj-a Tl 1. When mounted on 1inch² FR-4 board, 2 oz Cu. 3/15 Electrical characteristics STB270N4F3 - STI270N4F3 - STP270N4F3 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250µA, VGS= 0 VDS = Max rating, VDS = Max rating @125°C VGS = ±20V VDS= VGS, ID = 250µA TO-220 I²PAK D²PAK 2 2.5 2.1 Min. 40 10 100 ±200 Typ. Max. Unit V µA µA nA V mΩ mΩ IDSS IGSS VGS(th) 4 2.9 2.5 RDS(on) VGS= 10V, ID= 80A Table 4. Symbol gfs (1) Ciss Coss Crss Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge gate-drain charge Test conditions VDS =15V, ID = 80A Min. Typ. Max. 200 740 0 180 0 47 110 27 25 150 Unit S VDS =25V, f=1 MHz, VGS=0 pF pF pF nC nC nC Qg Qgs Qgd VDD=20V, ID = 160A VGS =10V (see Figure 13) 1. Pulsed: pulse duration=300µs, duty cycle 1.5% 4/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Electrical characteristics Table 5. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Test conditions VDD=20 V, ID= 80A, RG=4.7Ω, VGS=10V (see Figure 15) VDD=20 V, ID= 80A, RG=4.7Ω, VGS=10V (see Figure 15) Min. Typ. 22 180 Max. Unit ns ns Turn-off delay time Fall time 110 45 ns ns Table 6. Symbol Source drain diode Parameter D²PAK Test conditions Min Typ. Max 160 120 640 480 ISD=80A, VGS=0 ISD=160A, di/dt = 100A/µs, VDD=32V, Tj=150°C (see Figure 14) 70 225 3.2 1.5 Unit A A A A V ns nC A ISD Source-drain current TO-220 I²PAK D²PAK ISDM (1) Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current TO-220 I²PAK VSD(2) trr Qrr IRRM 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300µs, duty cycle 1.5% 5/15 Electrical characteristics STB270N4F3 - STI270N4F3 - STP270N4F3 2.1 Figure 1. Electrical characteristics (curves) Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Static drain-source on resistance Figure 6. Normalized BVDSS vs temperature 6/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Figure 7. Gate charge vs gate-source voltage Figure 8. Electrical characteristics Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Normalized on resistance vs temperature Figure 11. Source-drain diode forward characteristics 7/15 Test circuit STB270N4F3 - STI270N4F3 - STP270N4F3 3 Test circuit Figure 13. Gate charge test circuit Figure 12. Switching times test circuit for resistive load Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test switching and diode recovery times circuit Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform 8/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/15 Package mechanical data STB270N4F3 - STI270N4F3 - STP270N4F3 TO-220 MECHANICAL DATA DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154 øP Q 10/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. DIM. MIN. A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 TYP MAX. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 MIN. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 TYP. MAX. 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 inch 11/15 Package mechanical data STB270N4F3 - STI270N4F3 - STP270N4F3 D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0º 4.88 15 1.27 1.4 2.4 0.4 4º 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch 3 1 12/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Packaging mechanical data 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 13/15 Revision history STB270N4F3 - STI270N4F3 - STP270N4F3 6 Revision history Table 7. Date 07-Feb-2007 Revision history Revision 1 Initial release. Changes 14/15 STB270N4F3 - STI270N4F3 - STP270N4F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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