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Part Number |
STB14NK60Z-1 |
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Manufacturer |
ST Microelectronics |
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Semiconductor DataSheet |
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DataSheet View |
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STP14NK60Z - STP14NK60ZFP STB14NK60Z/-1 - STW14NK60Z
N-CHANNEL 600V - 0.45Ω - 13.5A TO-220/FP-D²/I²PAK-TO-247 Zener-Protected SuperMESH™ MOSFET
Table 1: General Features
TYPE STP14NK60Z STP14NK60ZFP STB14NK60Z STB14NK60Z-1 STW14NK60Z
■ ■ ■ ■ ■ ■
Figure 1: Package
ID 13.5 13.5 13.5 13.5 13.5 A A A A A Pw 160 W 40 W 160 W 160 W 160 W Ω Ω Ω Ω Ω
VDSS 600 V 600 V 600 V 600 V 600 V
RDS(on) < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
3 1 2
3
TO-220
TO-220P
1
2
TYPICAL RDS(on) = 0.45 Ω EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED GATE CHARGE MINIMIZED VERY LOW INTRINSIC CAPACITANCES VERY GOOD MANUFACTURING REPEATIBILITY
3 2 1
TO-247
3 1
3 12
D²PAK
I²PAK
DESCRIPTION Figure 2: Internal Schematic Diagram The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to www.DataSheet4U.com pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products.
APPLICATIONS ■ HIGH CURRENT, HIGH SPEED SWITCHING ■ IDEAL FOR OFF-LINE POWER SUPPLIES, ADAPTORS AND PFC ■ LIGHTING
Table 2: Order Codes
Part Number STP14NK60Z STP14NK60ZFP STB14NK60ZT4 STB14NK60Z-1 STW14NK60Z Marking P14NK60Z P14NK60ZFP B14NK60Z B14NK60Z W14NK60Z Package TO-220 TO-220FP D²PAK I²PAK TO-247 Packaging TUBE TUBE TAPE & REEL TUBE TUBE
Rev. 4 September 2005 1/17
STP14NK60Z - STP14NK60ZFP - STB14NK60Z - STB14NK60Z-1 - STW14NK60Z
Table 3: Absolute Maximum ratings
Symbol Parameter Value
TO-220/D²PAK/I²PAK TO-247 TO-220FP
Unit
VDS VDGR VGS ID ID IDM ( ) PTOT
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate-source Voltage Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C Drain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor 13.5 8.5 54 160 1.28
600 600 ± 30 13.5 (*) 8.5 (*) 54 (*) 40 0.32 4000 4.5 --55 to 150 2500
V V V A A A W W/°C V V/ns V °C
VESD(G-S) Gate source ESD (HBM-C= 100pF, R= 1.5kΩ) dv/dt (1) VISO Tj Tstg Peak Diode Recovery voltage slope Insulation Winthstand Voltage (DC) Operating Junction Temperature Storage Temperature
( ) Pulse width limited by safe operating area
(1) ISD ≤ 13.5A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, T j ≤ T JMAX. (*) Limited only by maximum temperature allowed
Table 4: Thermal Data
TO-220/D²PAK/I²PAK TO-247 TO-220FP
Unit °C/W °C/W °C
Rthj-case Thermal Resistance Junction-case Max Rthj-amb Tl Thermal Resistance Junction-ambient Max Maximum Lead Temperature For Soldering Purpose
0.78 62.5 300
3.1 50
Table 5: Avalanche Characteristics
Symbol IAR EAS Parameter Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) Single Pulse Avalanche Energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) Max Value 12 300 Unit A mJ
Table 6: Gate-Source Zener Diode
Symbol BVGSO Parameter Gate source Breakdown Voltage Test Conditions Igs= ± 1 mA (Open Drain) Min. 30 Typ. Max. Unit V
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components.
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ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED) Table 7: On/Off
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) Parameter Drain-source Breakdown Voltage Zero Gate Voltage Drain Current (VGS = 0) Gate-body Leakage Current (VDS = 0) Gate Threshold Voltage Static Drain-source On Resistance Test Conditions ID = 1mA, VGS = 0 VDS = Max Rating VDS = Max Rating, TC = 125 °C VGS = ± 30V VDS = VGS, ID = 100 µA VGS = 10V, ID = 6 A 3 3.75 0.45 Min. 600 1 50 ±10 4.5 0.5 Typ. Max. Unit V µA µA µA V Ω
Table 8: Dynamic
Symbol gfs (1) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions VDS = 15 V, ID= 6 A VDS = 25V, f = 1 MHz, VGS = 0 Min. Typ. 11 2220 240 57 122 26 18 62 13 75 13.2 38.6 Max. Unit S pF pF pF pF ns ns ns ns nC nC nC
Coss eq. (3) Equivalent Output Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
VGS = 0V, VDS = 0V to 480V VDD = 300 V, ID = 6 A, RG= 4.7 Ω, VGS = 10 V (Resistive Load see, Figure 21) VDD = 480V, ID = 12 A, VGS = 10V (see, Figure 24)
Table 9: Source Drain Diode
Symbol ISD ISDM (2) VSD (1) trr Qrr IRRM trr Qrr IRRM Parameter Source-drain Current Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 12 A, VGS = 0 ISD = 12 A, di/dt = 100 A/µs VDD = 50 V, Tj = 25°C (see test circuit, Figure 22) ISD = 12 A, di/dt = 100 A/µs VDD = 50 V, Tj = 150°C (see test circuit, Figure 22) 490 4.7 19.3 664 6.8 20.5 Test Conditions Min. Typ. Max. 12 48 1.6 Unit A A V ns µC A ns µC A
(1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. (2) Pulse width limited by safe operating area. (3) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS
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STP14NK60Z - STP14NK60ZFP - STB14NK60Z - STB14NK60Z-1 - STW14NK60Z
Figure 3: .Safe Operating Area For TO-220/ D²PAK/I²PAK Figure 6: Thermal Impedance For TO-220/ D²PAK/I²PAK
Figure 4: Safe Operating Area For TO-220FP
Figure 7: Thermal Impedance For TO-220FP
Figure 5: Safe Operating Area For TO-247
Figure 8: Thermal Impedance For TO-247
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Figure 9: Output Characteristics Figure 12: Transfer Characteristics
Figure 10: Transconductance
Figure 13: Static Drain-source On Resistance
Figure 11: Gate Charge vs Gate-source Voltage
Figure 14: Capacitance Variations
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Figure 15: Normalized Gate Thereshold Voltage vs Temperature Figure 18: Normalized On Resistance vs Temperature
Figure 16: Source-Drain Forward Characteristics
Figure 19: Normalized BVDSS vs Temperature
Figure 17: Maximum Avalanche Energy vs Temperature
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Figure 20: Unclamped Inductive Load Test Circuit Figure 23: Unclamped Inductive Wafeform
Figure 21: Switching Times Test Circuit For Resistive Load
Figure 24: Gate Charge Test Circuit
Figure 22: Test Circuit For Inductive Load Switching and Diode Recovery Times
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In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA
mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0º 4.88 15 1.27 1.4 2.4 0.4 4º 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch
3
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TO-247 MECHANICAL DATA
mm. MIN. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 0.140 0.177 0.216 14.80 4.30 0.560 0.14 0.728 0.143 0.216 TYP MAX. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 MIN. 0.19 0.086 0.039 0.079 0.118 0.015 0.781 0.608 0.214 0.582 0.17 inch TYP. MAX. 0.20 0.102 0.055 0.094 0.134 0.03 0.793 0.620
DIM. A A1 b b1 b2 c D E e L L1 L2 øP øR S
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D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992
TAPE MECHANICAL DATA
DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956
BASE QTY 1000
* on sales type
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TO-220 MECHANICAL DATA
DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154
øP
Q
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TO-220FP MECHANICAL DATA
mm. MIN. 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 16 28.6 9.8 2.9 15.9 9 3 30.6 10.6 3.6 16.4 9.3 |