LCD Segment / Common Driver with Controller

SOLOMON SYSTECH SEMICONDUCTOR TECHNICAL DATA SSD1815B Advance Information LCD Segment / Common Driver with Controller CMOS SSD1815B is a single-chip CMOS LCD drivers with controllers for dot-matrix graphic liquid crystal display system. SSD1815B is capable to drive 132 Segments, 64 Commons and 1 icon line by its 197 high voltage driving output. SSD1815B display data directly from their internal 132 x 65 bits Graphic Display Data RAM (GDDRAM). Data/Commands are sent from common MCU through 8-bit Parallel or Serial Interface. The selection of whether 6800- or 8080-series compatible Parallel Interface or Serial Peripheral Interface is done by hardware pins configuration. SSD1815B embeds a DC-DC Converter, an On-Chip Bias Divider and an On-Chip Oscillator which reduce the number of external components. With the advanced design on minimizing power consumption and die/package layout, SSD1815B is suitable for any portable battery-driven applications requiring a long operation period with a compact size. This document contains information on a new product. Specifications and information herein and subject to change without notice. Copyright © 2001 SOLOMON Systech Limited Rev 1.6 07/2002 FEATURES Dot-matrix Display with separated Icon Line, 132 x 64 + 1 Icon Line Single Supply Operation, 2.4V ~ 3.5V Minimum -12.0V LCD Driving Output Voltage Low Current Sleep Mode On-Chip Voltage Generator or External LCD Driving Power Supply Selectable 2X / 3X / 4X On-Chip DC-DC Converter On-Chip Oscillator Programmable Multiplex ratio in dot-matrix display area, 1Mux ~ 64Mux On-Chip Bias Divider Programmable bias ratio, 1/4, 1/5, 1/6, 1/7, 1/8, 1/9 8-bit 6800-series Parallel Interface, 8-bit 8080-series Parallel Interface and Serial Peripheral Interface On-Chip 132 X 65 Graphic Display Data RAM Re-mapping of Row and Column Drivers Vertical Scrolling Display Offset Control 64 Level Internal Contrast Control External Contrast Control Programmable LCD Driving Voltage Temperature Coefficients Available in Gold Bump Die and TAB (Tape Automated Bonding) Package ORDERING INFORMATION Table 1 SSD1815B Ordering Information Ordering Part Number SSD1815BZ SSD1815BT SSD1815BT2 Seg Com Default Bias Package Form Gold Bump Die 70mm Folding TAB 48mm Folding TAB Reference Figure 2 on page 5 Figure 16 on page 32 Figure 18 on page 34 132 64 + 1 1/9, 1/7 SOLOMON Rev1.6 07/2002 SSD1815B 3 BLOCK DIAGRAM ROW0 ~ ROW63 ICONS SEG0~SEG131 HV Buffer Cell Level Shifter Level Selector V L6 V L5 V L4 V L3 V L2 V DD VF LCD Driving Voltage Generator 2X / 3X / 4X DC/DC Converter, Voltage Regulator, Bias Divider, Contrast Control, Temperature Compensation V EE V SS1 C3N C 1P C 1N C 2N C 2P V FS HPM IRS Display Data Latch MSTAT M Display Timing Generator DOF M/S CL CLS Oscillator GDDRAM 132 X 65 Bits Command Decoder V SS VDD Command Interface Parallel / Serial Interface RES P/S CS1 CS2 D/C E R/W C68/80 (RD) (WR) D7 D6 D 5 D 4 D 3 D 2 D 1 D0 (SDA) (SCK) Figure 1 SSD1815B Block Diagram SSD1815B 4 Rev 1.6 07/2002 SOLOMON PIN ARRANGEMENT IC ON S R OW0 R OW1 R OW2 R OW3 R OW4 R OW5 R OW6 R OW7 R OW8 R OW9 R OW10 R OW11 R OW12 R OW13 R OW14 R OW15 R OW16 R OW17 R OW18 R OW19 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 137 Cen ter : 3816.05, -305.2 Size: 100.1u x 10 0.1 u Center: 381 9.2 , -419.2 Size: 99 .75u x 99.7 5u 115 : : SEG110 SEG111 SEG112 SEG113 SEG114 SEG115 SEG116 SEG117 SEG118 SEG119 SEG120 SEG121 SEG122 SEG123 SEG124 SEG125 SEG126 SEG127 SEG128 SEG129 SEG130 SEG131 : : 268 1 ROW20 ROW21 : : ROW30 ROW31 VDD IRS VSS /HPM VDD P/S C68/80 VSS CLS M/S VDD NC NC VDD VDD VF VF VL6 VL6 VL6 VL5 VL5 VL4 VL4 VL4 VL3 VL3 VL3 VL2 VL2 VDD VDD VFS VFS VSS VSS C2P C2P C2P C2N C2N C2N C2N C1N C1N C1N C1P C1P C1P C3N C3N C3N C3N VEE VEE VEE VEE VSS1 VSS1 VSS1 VSS1 VSS VSS VSS VDD VDD VDD VDD D7 (SDA) D6 (SCK) D5 D4 D3 D2 D1 D0 VDD E(/RD) R/W(/WR) VSS D/C /RES VDD CS2 /CS1 VSS /DOF CL M MSTAT NC ICONS ROW63 ROW62 ROW61 : : ROW54 ROW53 Center: 370 1.0 75, -30 4.5 Ra dius: 50.925u Gold Bump Alignment Mark This alignment mark contains gold bump for IC bumping process alignment and IC identifications. No conductive tracks should be laid underneath this mark to avoid short circuit. Note: 1. This diagram showing Die Face Up view. 2. Coordinates and Size of all alignment marks are in unit um and w.r.t. center of the chip. Y Center: -38 80.6 25, 20 5.6 25 Size: 99 .75 u x 99.75u (0,0) Center: 389 .72 5, -201 .6 Radius: 27.125 u x Die Size: Die Thickness: Bump Pitch: Bump Height: 10.977mm X 1.912mm 550 +/-25um 76.2 um [Min] Nominal 18um Tolerance <4um within die <8um within lot PIN #1 Figure 2 SSD1815B Gold Bump Die Pin Assignment SOLOMON R OW32 R OW33 R OW34 R OW35 R OW36 R OW37 R OW38 R OW39 R OW40 R OW41 R OW42 R OW43 R OW44 R OW45 R OW46 R OW47 R OW48 R OW49 R OW50 R OW51 R OW52 Rev1.6 07/2002 SSD1815B 5 Table 2 SSD1815B Gold Bump Die Pad Coordinates PAD # NAME 1 ROW53 2 ROW54 3 ROW55 4 ROW56 5 ROW57 6 ROW58 7 ROW59 8 ROW60 9 ROW61 10 ROW62 11 ROW63 12 ICONS 13 NC 14 MSTAT 15 M 16 CL 17 /DOF 18 VSS 19 /CS1 20 CS2 21 VDD 22 /RES 23 D/C 24 VSS 25 R/W 26 E/RD 27 VDD 28 D0 29 D1 30 D2 31 D3 32 D4 33 D5 34 D6 35 D7 36 VDD 37 VDD 38 VDD 39 VDD 40 VSS 41 VSS 42 VSS 43 VSS1 44 VSS1 45 VSS1 46 VSS1 47 VEE 48 VEE 49 VEE 50 VEE 51 C3N 52 C3N 53 C3N 54 C3N 55 C1P 56 C1P 57 C1P 58 C1N 59 C1N 60 C1N Die Size: 10.977mm Bump Size: Pad # X [um] 1 - 12 43.5 13 - 103 61.7 104 - 115 43.5 X -4958.45 -4882.15 -4805.85 -4729.55 -4653.25 -4576.95 -4500.65 -4424.35 -4348.05 -4271.75 -4195.45 -4119.15 -4000.50 -3911.60 -3822.70 -3733.80 -3644.90 -3556.00 -3467.10 -3378.20 -3289.30 -3200.40 -3111.50 -3022.60 -2933.70 -2844.80 -2755.90 -2667.00 -2578.10 -2489.20 -2400.30 -2311.40 -2222.50 -2133.60 -2044.70 -1955.80 -1866.90 -1778.00 -1689.10 -1600.20 -1511.30 -1422.40 -1333.50 -1244.60 -1155.70 -1066.80 -977.90 -889.00 -800.10 -711.20 -622.30 -533.40 -444.50 -355.60 -266.70 -177.80 -88.90 0.00 88.90 177.80 X Y [um] 101.6 61.7 101.6 Y -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 1.912mm Pad # 116 - 136 PAD # 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 NAME C2N C2N C2N C2N C2P C2P C2P VSS VSS VFS VFS VDD VDD VL2 VL2 VL3 VL3 VL3 VL4 VL4 VL4 VL5 VL5 VL6 VL6 VL6 VF VF VDD VDD NC NC VDD M/S CLS VSS C68/80 P/S VDD /HPM VSS IRS VDD ROW31 ROW30 ROW29 ROW28 ROW27 ROW26 ROW25 ROW24 ROW23 ROW22 ROW21 ROW20 X 266.70 355.60 444.50 533.40 622.30 711.20 800.10 889.00 977.90 1066.80 1155.70 1244.60 1333.50 1422.40 1511.30 1600.20 1689.10 1778.00 1866.90 1955.80 2044.70 2133.60 2222.50 2311.40 2400.30 2489.20 2578.10 2667.00 2755.90 2844.80 2933.70 3022.60 3111.50 3200.40 3289.30 3378.20 3467.10 3556.00 3644.90 3733.80 3822.70 3911.60 4000.50 4119.15 4195.45 4271.75 4348.05 4424.35 4500.65 4576.95 4653.25 4729.55 4805.85 4882.15 4958.45 Y -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -771.93 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 -751.98 PAD # 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 NAME ROW19 ROW18 ROW17 ROW16 ROW15 ROW14 ROW13 ROW12 ROW11 ROW10 ROW9 ROW8 ROW7 ROW6 ROW5 ROW4 ROW3 ROW2 ROW1 ROW0 ICONS X 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 5285.18 Y -768.78 -692.48 -616.18 -539.88 -463.58 -387.28 -310.98 -234.68 -158.38 -82.08 -5.78 70.53 146.83 223.13 299.43 375.73 452.03 528.33 604.63 680.93 757.23 Y PIN268 (0,0) PIN 1 PIN137 x PIN115 Die Size: 10.977mm X 1.912mm Bump Height: - nominal: 18um - tolerance:<4um (within die) <6um (within wafer) <8um (within lot) Unit in um unless otherwise specified. X [um] 101.6 Y [um] 43.5 Pad # 137 - 268 X [um] 43.5 Y [um] 101.6 Pad # 269 - 289 X [um] 101.6 Y [um] 43.5 Gold bump width tolerance: +/- 3um. SSD1815B 6 Rev 1.6 07/2002 SOLOMON PAD # 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 NAME SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43 SEG44 SEG45 SEG46 SEG47 SEG48 SEG49 SEG50 SEG51 SEG52 SEG53 SEG54 SEG55 SEG56 SEG57 SEG58 SEG59 SEG60 SEG61 SEG62 SEG63 SEG64 SEG65 X 4997.65 4921.35 4845.05 4768.75 4692.45 4616.15 4539.85 4463.55 4387.25 4310.95 4234.65 4158.35 4082.05 4005.75 3929.45 3853.15 3776.85 3700.55 3624.25 3547.95 3471.65 3395.35 3319.05 3242.75 3166.45 3090.15 3013.85 2937.55 2861.25 2784.95 2708.65 2632.35 2556.05 2479.75 2403.45 2327.15 2250.85 2174.55 2098.25 2021.95 1945.65 1869.35 1793.05 1716.75 1640.45 1564.15 1487.85 1411.55 1335.25 1258.95 1182.65 1106.35 1030.05 953.75 877.45 801.15 724.85 648.55 572.25 495.95 419.65 343.35 267.05 190.75 114.45 38.15 Y