Description
RI-RFM-008B, RI-ACC-008B www.ti.com SCBS850 – MARCH 2001 SERIES 2000 HIGH PERFORMANCE REMOTE ANTENNA RFM AND TUNING MODULE FEATURES • • • • • • Best in Class Performance Through Patented HDX Technology High Power Output Extended Antenna Induction Range Reader Antenna Distance Up to 120 Meters Proven In Harsh Industrial Environments Easy To Install And Use APPLICATIONS • • • • • Access Control Vehicle Identification Container Tracking Asset Management Waste Management www.DataSheet4U.com DESCRIPTION The Texas Instruments’ low-frequency (LF) reader provides all the functionality required to communicate with Texas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. The RI-RFM-008B radio frequency power module is capable driving the RI-ACC-008B, which then forms the resonant circuit with the antenna. The distance between the antenna - RI-ACC-008B combination and the reader (RI-RFM-008B + control module) can be extended up to 120 meters when connected by a symmetrical twinax cable. The RI-ACC-008B radio frequency power module is capable driving a variety of antennas with extended inductance ranges from 8µH to 80µH including TI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C and RI-ANT-S02C stick antennas. The RI-RFM-008 is designed to be connected to control modules RI-CTL-MB2A (RS232 interface) or RI-CTL-MB6A (RS422/485 interface) which provide the interface to connect a host system, power supply connectors and additional I/O’s. The RI-RFM-008B module in combination with a control module and the RI-ACC-008B is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. The Series 2000 High Performance Remote Antenna RFM together with the Antenna Tuning Module supports the use of antennas installed at a distance of up to 120 meters. It is the interface between the 134.2 kHz HDX/FSK transponder and the Data Processing Unit. It sends an energizing signal to the transponder, modulates the RF signal to send data to the transponder, receives the identification signal and processes it for digital decoding. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001, Texas Instruments Incorporated RI-RFM-008B, RI-ACC-008B SCBS850 – MARCH 2001 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) RI-RFM-008B Operating Temperature Storage Temperature (1) –25 to +70 –40 to +85 RI-ACC-008B –25 to +70 –40 to +85 UNIT °C °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) RI-RFM-008B Power Supply 7 to 24 Vdc, regulated RI-ACC-008B — OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER Relative Humidity RF Transmit Frequency Transponder Types Antenna Tuning Range Antenna Resonance Voltage Dimensions (L × W × H) Weight Cable (RFM to tuning-board) PART NUMBER RI-RFM-008B 134.2 134.2 kHz HDX/FSK Determined by the tuning-board Max. 380 Vpeak (83 × 93 × 44) ± 1 160 Symmetrical shielded cable (twin-ax) 8 to 80 µH Max. 280 / 400 Vpeak (depending on the configured inductance range) (115 × 70 × 27) ± 1 162 mm g RI-ACC-008B < 97% non-condensing, IEC 68-2-30 Test Db, 21 cycles kHz UNIT 2 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 31-Jan-2007 PACKAGING INFORMATION Orderable Device RI-RFM-008B-00 (1) Status (1) ACTIVE Package Type Package Drawing Pins Package Eco Plan (2) Qty 1 1 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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