Thin Film Cascadable AMplifier

Part  Number PPA-1044
Manufacturer Agilent Technologies
Semiconductor DataSheet

DataSheet View

www.DataSheet4U.com H Avantek Products Thin-Film Cascadable Amplifier 20 to 1000 MHz Technical Data UTO/UTC/PPA 1044 Series Features • Frequency Range: 20 to 1000MHz • High Dynamic Range • Low Noise Figure: 2.5 dB (Typ) • Medium Power Output: +13.0 dBm (Typ) • Temperature Compensated • Surface Mount Option Description The 1044 Series is a high power thin-film bipolar RF amplifier using lossless feedback for low noise, high dynamic range and efficient operation; and active bias circuits to assure good temperature compensation and increased immunity to bias voltage variations. The 1044 Series amplifiers are available in three packages: the surface mount PlanarPak PP-38 (.375 in. x .375 in.) case, the TO-8 hermetic case and the connectorized TC-1 case. Pin Configuration UTO—TO-8T RF IN GROUND RFOUT V+ CASE GROUND UTC—TC-1 RF IN RF OUT V+ Applications • Wideband RF System Front End PPA—PP-38 V+ RF IN RF OUT GROUND Schematic V+ Maximum Ratings Parameter DC Voltage Continuous RF Input Power Operating Case Temperature Storage Temperature “R” Series Burn-In Temperature Maximum +17 Volts +13 dBm –55 to +125°C –62 to +150°C +125°C RFIN RFOUT Thermal Characteristics1 θJC Active Transistor Power Dissipation Junction Temperature Above Case Temperature MTBF (MIL-HDBK-217E, AUF @ 90°C) 105°C/W 256 mW 27°C 955,100 Hrs. Note 1: For further information, see Reliability Screening, Pub. 5963-3240E. Weight: (typical) PPA—0.5 grams; UTO—2.1 grams; UTC—21.5 grams www.DataSheet4U.com 2 Electrical Specifications1 (Measured in 50 Ω system @ +15 VDC nominal unless otherwise noted) Symbol Characteristic Typical Guaranteed Specifications TC = 25°C TC = 0 to 50°C TC = –55 to +85°C Unit MHz 20-1000 20-1000 20-1000 BW Frequency Range dB 10.0 11.0 9.0 Small Signal Gain (Min.) GP dB ±1.0 — ±0.5 ±1.0 Gain Flatness (Max.) dB 4.5 2.5 5.0 NF Noise Figure (Max.) 2 dBm +12.0 +13.0 +11.0 P1dB Power Output @ +1 dB Comp. (Min.) — 2.0:1 <1.8:1 — 2.0:1 Input VSWR (Max.) — 2.0:1 <1.8:1 2.0:1 Output VSWR (Max.) — dBm +22.0 +25.0 +21.0 Two Tone 3rd Order Intercept Point IP3 dBm — +35.0 IP2 — Two Tone 2nd Order Intercept Point dBm — +46.0 — HP2 One Tone 2nd Harmonic Intercept Point mA — 35 — ID DC Current Notes: 1. Both RF input and RF output pins are at DC ground — no blocking capacitor/PPA-1044 = Preliminary. 2. PPA-1044, Power Output = 12 dBm (typ) @ 25°C, 11.5 dBm from 0° to 50°C and 11.0 dBm from –55° to +85°C. Typical Performance Over Temperature (@ +15 VDC unless otherwise noted) Noise Figure, dB Key: +25°C +85°C -55°C Gain, dB Gain 12 5 4 Noise Figure 11 10 9 0 200 400 600 800 1000 Frequency, MHz +12 VDC & +15 VDC 3 2 20 200 400 600 800 Frequency, MHz 1000 1200 Power Output Power Output @ 1 dB Gain Compression, dBm 14 13 2.0 1.75 Input VSWR 2.0 1.75 Output VSWR VSWR 1.5 1.25 VSWR 0 200 400 600 800 1000 1.5 1.25 1.0 0 200 400 600 800 1000 12 +12 VDC 11 20 200 400 600 800 1000 1200 Frequency, MHz 1.0 Frequency, MHz Frequency, MHz Third-Order Intercept Point 29 55 50 45 40 20 200 400 600 800 1000 35 20 Second-Order Intercept Point 60 HP2, dBm Second-Harmonic Intercept Point IP3, dBm IP2, dBm 28 55 50 45 27 26 200 400 600 800 1000 20 200 400 600 800 1000 Frequency, MHz Frequency, MHz Frequency, MHz www.DataSheet4U.com 3 Automatic Network Analyzer Measurements (Typical production unit @ +25°C ambient) Numerical Readings FREQUENCY MHz VSWR IN GAIN dB PHASE DEGREES PHASE DEV GROUP DELAY ns Bias = 15.00 Volts VSWR OUT ISOLATION dB 100.0 200.0 300.0 400.0 500.0 600.0 700.0 800.0 900.0 1000.0 S-Parameters FREQUENCY MHz 1.13 1.20 1.27 1.31 1.30 1.24 1.18 1.02 1.23 1.51 11.12 11.02 11.01 11.04 11.12 11.19 11.21 11.24 11.04 10.69 168.56 152.79 137.45 123.61 109.58 95.25 80.12 63.73 46.58 28.83 –2.87 –2.76 –1.73 –.21 1.63 3.19 3.78 3.42 2.14 .28 .00 .43 .41 .39 .39 .41 .43 .47 .50 .52 1.17 1.28 1.41 1.49 1.54 1.52 1.45 1.35 1.30 1.40 16.40 16.39 16.56 16.64 16.66 16.52 16.47 16.44 16.33 16.44 Bias = 15.00 Volts S11 Mag Ang dB S21 Ang dB S12 Ang Mag S22 Ang 100.00 150.00 200.00 250.00 300.00 350.00 400.00 450.00 500.00 550.00 600.00 650.00 700.00 750.00 800.00 850.00 900.00 950.00 1000.00 1050.00 1100.00 1200.00 1300.00 1400.00 1500.00 .063 .075 .089 .108 .123 .130 .134 .132 .127 .114 .096 .075 .046 .011 .028 .072 .123 .173 .220 .269 .316 .390 .449 .486 .511 154.8 120.6 101.4 85.3 75.5 65.9 56.4 46.7 39.5 32.6 24.7 18.2 15.5 28.3 156.2 153.9 147.5 140.7 133.4 123.8 116.2 101.4 87.8 75.0 64.0 11.090 11.053 10.958 10.930 10.946 10.980 11.016 11.073 11.084 11.157 11.202 11.221 11.228 11.254 11.233 11.183 11.062 10.896 10.691 10.378 10.038 9.272 8.368 7.393 6.429 167.6 159.7 151.8 143.9 136.4 129.0 121.7 114.7 107.2 100.1 92.6 84.7 76.9 68.7 60.2 51.5 42.5 33.2 24.3 14.5 5.5 –11.7 –27.1 –41.8 –55.2 –16.592 –16.417 –16.537 –16.541 –16.639 –16.626 –16.607 –16.601 –16.583 –16.585 –16.565 –16.503 –16.470 –16.407 –16.406 –16.434 –16.370 –16.366 –16.460 –16.543 –16.648 –17.028 –17.369 –17.792 –18.261 169.3 161.1 152.8 146.0 139.5 132.6 126.4 120.6 114.3 108.4 102.1 96.5 90.3 84.4 77.7 71.0 64.7 58.1 51.8 45.4 38.8 26.0 14.3 3.8 –6.5 .077 .096 .124 .145 .164 .182 .193 .201 .207 .204 .199 .189 .176 .160 .144 .135 .136 .148 .174 .212 .251 .326 .393 .445 .484 141.1 114.7 100.4 88.3 79.6 71.7 65.0 58.7 53.1 48.6 44.9 41.8 40.5 41.8 46.0 53.9 65.3 75.0 82.9 85.8 86.3 82.0 74.7 67.0 60.0 www.DataSheet4U.com 4 Product Options UTO – 509R Model Number Prefix UTOUTMPPA- Screening Option Blank = No Screening R = R-Series Screening For more information on R-Series screening, see Reliability Screening, Pub. 5963-3240E. Model Number UTC – 509-1 Model Number Prefix UTCConnector Option For TC-1 case the only connector option available is the -1. The -1 option consists of a SMA Female connector on both the input and output (see note). Model Number Note: R-Series screening is not available in the TC-1 case as the case is non-hermetic. Case Drawings TO-8T .200 .017 +.002 - 001 .150 TYP .300 TYP GROUND 3 .50 .450 DIA DIA MAX .150 TYP 45 .031 .031 .22 MIN RF IN V+ 2 4 1 RF OUT GLASS RING .060 DIA TYP (3X) CASE GROUND APPROXIMATE WEIGHT 2.1 GRAMS NOTES (UNLESS OTHERWISE SPECIFIED): 1. DIMENSIONS ARE SPECIFIED IN INCHES 2. TOLERANCES: xx ± .02 xxx ± .010 www.DataSheet4U.com 5 Case Drawings TC-1 .820 1.000 RF IN RFOUT V+ .460 AGC (IF REQUIRED) .38 (2) PL PRODUCT MARKING AREA DC INPUT .890 .460 .500 .310 .350 .350 .310 .890 SMA JACK (FEMALE) (2) PL .640 .180 .19 .100 .24 GND .905 .250 .095 .570 2-56 UNC-2B x .15 DEEP THREADED INSERT (4) PL TYPICAL WEIGHT WITH CONNECTORS = 21.5 GRAMS NOTES: 1. THE TC-1 CASE IS A NON-HERMETIC CASE. 2. THE ONLY CONNECTOR OPTION AVAILABLE FOR THE TC-1 CASE IS THE –1, SMA FEMALE CONNECTORS AT BOTH INPUT AND OUTPUT PORTS. NOTES (UNLESS OTHERWISE SPECIFIED): 1. DIMENSIONS ARE SPECIFIED IN INCHES 2. TOLERANCES: xx ± .02 xxx ± .010 www.DataSheet4U.com H Case Drawings PP-38 .375 x .375 PLANARPAK SURFACE MOUNTED COMPONENTS .050 ± .010 (8) PLCS. .375 SQ. .010 (4) PLCS .150 ± .010 .015 4 .010 (4) PLCS. .040 (4) PLCS .040 1 C L .015 + .002 (4) PLCS 3 C L .010 R (4) PLCS. .030 (3) PLCS 2 .006 .004 "A" NOTE 5 .035R (4) PLCS DETAIL "A" TYPICAL WEIGHT 0.5 GRAMS NOTES (UNLESS OTHERWISE SPECIFIED): 1. DIMENSIONS ARE SPECIFIED IN INCHES 2. TOLERANCES: xxx ± .005 3. LEADS ARE FOR TESTING ONLY AND MAY BE TRIMMED FLUSH AT TIME OF INSTALLATION. 4. N/C = NOT CONNECTED 5. PIN 2 IS NOT AT GROUND POTENTIAL FOR PP-38M. IT LOOKS THE SAME AS PINS 1, 3, AND 4. PIN DESIGNATION CASE PP-38 PP-38M PP-38F 1 RFIN RF RFIN 2 GROUND LO GROUND 3 RFOUT IF RFOUT 4 V+ N/C GROUND Recommended Assembly Procedure 1. Chemically clean the PC board and the unit to be mounted using a vapor degreaser or acetone followed by an isopropol alcohol wash. Do not use ultrasonic cleaning. 2. Mask the backside of the PC board to prevent solder from reflowing through the plated thru-holes causing a rough ground plane surface. A suggested masking material is 2 mil thick Kapton® film with silicone adhesive back (Permacel part #P-222). 3. Apply solder cream (suggest Multicore SN62PRMAB3 or equivalent) using screen printing techniques or careful hand application. A layer 4 to 6 mils thick is adequate. 4. Reflow of the unit to the board may be done in many ways. Using a hot plate is one of the most simple. During reflow, pressure (with a clamping arrangement) on the unit is recommended, but not absolutely necessary. Absolute maximum reflow temperature is 260°C for not more than 10 seconds. 5. Chemically reclean the unit using the procedures given in step one. Make sure that a flux remover is used which is appropriate for the type of solder cream used (Multicore PC81 is the recommended flux remover for the above mentioned cream). It should be noted that there are many alternatives for component attachment. This procedure has been found to be simple and effective. For more detailed instructions on how to use PlanarPak Products, please see the application note “PlanarPak Users Information,” Pub.5963-3232E. For more information: United States* Europe* Far East/Australasia: (65) 290-6305 Canada: (416) 206-4725 Japan: (81 3) 3331-6111 *Call your local HP sales office listed in your telephone directory. Ask for a Components representative. Data Subject to Change Copyright © 1995 Hewlett-Packard Co. Printed in U.S.A. 5963-2514E (10/94)




New! The site which shares a electronic information

English     |     日本語     |     漢語     |     한국어     |     Netherlands     |     La France     |     L'Italia     |     Deutschland     |     Россия
This is a individually operated, non profit site.
If this site is good enough to show, please introduce this site to others...

It welcomes all helping each other.     Contact us     |    Mirror site : www.DataSheet4U.net     |     Link Exchange     |     Buy Components ?