Gate Drive DIP 8 pin OPIC Photocoupler

www.DataSheet4U.com PC923L0NSZ Series PC923L0NSZ Series High Speed, Gate Drive DIP 8 pin ∗OPIC Photocoupler ■ Description PC923L0NSZ Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Input-output isolation voltage(rms) is 5.0 kV, High speed response (tPHL, tPLH : MAX. 0.5 µs). ■ Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC923L) 2. Approved by VDE (VDE0884) (as an option), file No. 87446 (as model No. PC923L) 3. Package resin : UL flammability grade (94V-0) ■ Features 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO1P, IO2P : 0.6 A) 4. High speed response (tPHL, tPLH : MAX. 0.5 µs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. −15kV/µs, CML : MIN. 15kV/µs) 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV) ■ Applications 1. IGBT/MOSFET gate drive for inverter control ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A06001EN Date Nov. 28. 2003 © SHARP Corporation PC923L0NSZ Series ■ Internal Connection Diagram 8 7 6 5 1 2 3 Interface 4 NC Anode Cathode NC 5 6 7 8 O1 O2 GND VCC Tr.1 Tr.2 Amp. 1 2 3 4 ■ Truth table Input ON OFF O2 Terminal output High level Low level Tr. 1 ON OFF Tr. 2 OFF ON ■ Outline Dimensions 1. Through-Hole [ex. PC923L0NSZ] 1.2±0.3 SHARP mark "S" 8 7 6 5 (Unit : mm) 2. Through-Hole (VDE0884 option) [ex. PC923L0YSZ] 1.2±0.3 SHARP mark "S" 8 7 6 5 0.85±0.2 0.85±0.2 6.5±0.5 4 1 2 3 4 1 2 3 4 9.66±0.5 Primary side mark Date code 7.62±0.3 0.5TYP. 3.4±0.5 3.5±0.5 9.66±0.5 Primary side mark 6.5±0.5 VDE0884 Identification mark Date code 7.62±0.3 3.4±0.5 3.5±0.5 TYP. PC923L PC923L 0.5 Epoxy resin 0.26 θ ±0.1 Epoxy resin 0.26±0.1 θ θ:0 to 13˚ θ 2.54±0.25 0.5±0.1 2.54±0.25 θ 0.5±0.1 θ:0 to 13˚ Sheet No.: D2-A06001EN 2 PC923L0NSZ Series (Unit : mm) 3. SMT Gullwing Lead-Form [ex. PC923L0NIP] 4. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC923L0YIP] 1.2±0.3 SHARP mark "S" 6.5±0.5 8 7 6 5 1.2±0.3 SHARP mark "S" 8 7 6 5 0.85±0.2 0.85±0.2 4 1 2 3 ±0.5 4 9.66 Date code 1 2 3 ±0.5 4 9.66 Primary side mark 0.26±0.1 0.35±0.25 3.5±0.5 2.54±0.25 1.0+0.4 −0 Epoxy resin 10.0+0 −0.5 3.5±0.5 0.26±0.1 1.0+0.4 −0 2.54±0.25 1.0+0.4 −0 Epoxy resin 10.0+0 −0.5 Product mass : approx. 0.55g Sheet No.: D2-A06001EN 3 0.35±0.25 1.0+0.4 −0 7.62±0.3 Primary side mark 6.5±0.5 VDE0884 Identification mark Date code PC923L PC923L 7.62±0.3 PC923L0NSZ Series Date code (3 digit) 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M · · N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D 3rd digit Week of production Mark Week 1st 1 2nd 2 3rd 3 4th 4 5.6th 5 A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark P R S T U V W X A B C · · · repeats in a 20 year cycle Country of origin Japan Sheet No.: D2-A06001EN 4 PC923L0NSZ Series ■ Absolute Maximum Ratings Parameter Symbol *1 IF Forward current Input Reverse voltage VR Supply voltage VCC O1 output current IO1 *2 O1 Peak output current IO1P IO2 Output O2 output current *2 O2 Peak output current IO2P O1 output voltage VO1 *3 PO Power dissipation *4 Ptot Total power dissipation *5 Isolation voltage Viso (rms) Operating temperature Topr Storage temperature Tstg *6 Soldering temperature Tsol Rating 20 5 35 0.1 0.6 0.1 0.6 35 500 550 5.0 −40 to +85 −55 to +125 270 (Ta=25˚C) Unit mA V V A A A A V mW mW kV ˚C ˚C ˚C *1 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.10 *2 Pulse width≤0.15µs, Duty ratio : 0.01 *3, 4 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.11 *5 AC for 1minute, 40 to 60 %RH, f=60Hz *6 For 10s ■ Electro-optical Characteristics*7 Parameter Input Forward voltage Reverse current Terminal capacitance Supply voltage O1 Low level output voltage O2 High level output voltage O2 Low level output voltage O1 leak current O2 leak current High level supply current Low level supply current "Low→High" input threshold current Isolation resistance "Low→High" propagation delay time "High→Low" propagation delay time Rise time Fall time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) Symbol VF1 VF2 IR Ct VCC VO1L VO2H VO2L IO1L IO2L ICCH ICCL IFLH RISO tPLH tPHL tr tf CMH Conditions Ta=25˚C, IF=10mA Ta=25˚C, IF=0.2mA Ta=25˚C, VR=5V Ta=25˚C, V=0, f=1MHz − VCC1=12V, VCC2=−12V, IO1=0.1A, IF=5mA VCC=VO1=24V, IO2=−0.1A, IF=5mA VCC=24V, IO2=0.1A, IF=0 VCC=VO1=35V, IF=0 VCC=VO2=35V, IF=5mA VCC=24V, IF=5mA VCC=24V, IF=0 Ta=25˚C, VCC=24V VCC=24V Ta=25˚C, DC500V, 40 to 60%RH *9 *9 *8 Transfer characteristics Ta=25˚C, VCC=24V, IF=5mA RG=47Ω, CG=3 000pF Ta=25˚C, VCM=1.5kV(p-p) IF=5mA, VCC=24V, ∆VO2H=2.0V Ta=25˚C, VCM=1.5kV(p-p) IF=0, VCC=24V, ∆VO2L=2.0V (Unless otherwise specified Ta=Topr) MIN. MAX. Unit TYP. V − 1.75 1.6 − 1.2 V 1.5 µA − 10 − 60 pF − 150 − V 15 30 0.2 − 0.4 V 20 22 − V − 0.5 0.8 V − − 500 µA − − 500 µA − 1.3 3.0 mA − 1.3 3.0 mA 1.5 mA 3.0 0.3 mA − 5.0 0.2 10 11 Ω 5×10 − 10 0.3 µs − 0.5 0.3 µs − 0.5 µs 0.2 − 0.5 µs 0.2 − 0.5 -15 − − kV/µs Output Response time CML 15 − − kV/µs *7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 7 ) near the device, when it measures the transfer characteristics and the output side characteristics *9 O2 output terminal is set open *8 IFLH represents forward current when output goes from "Low" to "High" Sheet No.: D2-A06001EN 5 PC923L0NSZ Series ■ Model Line-up Lead Form SMT Gullwing Sleeve Taping Package 50pcs/sleeve 1 000pcs/reel −−−−−− Approved −−−−−− Approved −−−−−− Approved VDE0884 Model No. PC923L0NSZ PC923L0YSZ PC923L0NIZ PC923L0YIZ PC923L0NIP PC923L0YIP Through-Hole Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A06001EN 6 PC923L0NSZ Series Fig.1 Test Circuit for O1 Low Level Output Voltage 8 2 5 IF 3 7 PC923L 6 V VO1L VCC1 IO1 VCC2 IF 3 7 2 5 PC923L 6 VO2H V IO2 VCC Fig.2 Test Circuit for O2 High Level Output Voltage 8 Fig.3 Test Circuit for O2 Low Level Output Voltage 8 2 5 IF 3 7 PC923L 6 V VO2L IO2 VCC Fig.4 Test Circuit for O1 Leak Current 8 2 5 IF 3 7 PC923L 6 VCC A IO1L Fig.5 Test Circuit for O2 Leak Current 8 2 5 IF 3 7 PC923L 6 A IO2L VCC Fig.6 Test Circuit for High Level / Low Level Supply Current 8 2 5 IF 3 7 PC923L 6 A ICC VCC Sheet No.: D2-A06001EN 7 PC923L0NSZ Series Fig.7 Test Circuit for "Low→High" Input Threshold Current 8 2 5 IF Variable 3 7 PC923L 6 V VCC Fig.8 Test Circuit for Response Time 50% 8 2 VIN tr=tf=0.01µs Pulse width 5µs Duty ratio 50% 3 7 VOUT wave form tr tf 5 PC923L 6 RG VOUT VCC CG tPLH tPHL 90% 50% 10% VIN wave form Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage VCM (Peak) 8 A SW B 2 5 PC923L 6 3 7 + − V VO2 VCC CMH, VO2 wave form SW at A, IF=5mA CML, VO2 wave form SW at B, IF=0 ∆VO2L ∆VO2H VO2L GND VO2H VCM wave form GND VCM Sheet No.: D2-A06001EN 8 PC923L0NSZ Series Fig.10 Forward Current vs. Ambient Temperature 60 50 Forward current IF (mA) Fig.11 Power Dissipation vs. Ambient Temperature 600 Power dissipation PO, Ptot (mW) 500 400 300 200 PO Ptot 40 30 20 10 0 −40 −25 100 0 −40 −25 0 25 50 75 85 100 125 0 25 50 75 85 100 125 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Fig.12 Forward Current vs. Forward Voltage 100 Fig.13 "Low→High" Relative Input Threshold Current vs. Supply Voltage 120 Ta=25°C Relative input threshold current (%) 110 Forward current IF (mA) 10 0˚C Ta=85˚C 50˚C 25˚C −20˚C −40˚C 100 90 1 IFLH=100% at VCC=24V 80 0.1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 70 15 18 21 24 27 30 Forward voltage VF (V) Supply voltage VCC (V) Fig.14 "Low→High" Relative Input Threshold Current vs. Ambient Temperature 120 VCC=24V Relative input threshold current (%) 110 100 Fig.15 O1 Low Level Output Voltage vs. O1 Output Current 3 O1 low level output voltage VO1L (V) Ta=25°C VCC1=12V VCC2=−12V IF=5mA 2 90 IFLH=100% at Ta=25˚C 80 70 60 −40 1 −20 0 20 40 60 80 100 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Ambient temperature Ta (˚C) O1 output current IO1 (A) Sheet No.: D2-A06001EN 9 PC923L0NSZ Series Fig.16 O1 Low Level Output Voltage vs. Ambient Temperature 0.3 0.25 0.2 High output voltage drop (VO2H-VCC) (V) O1 low level output voltage VO1L (V) VCC1=12V VCC2=−12V IF=5mA IO2=0.1A Fig.17 O2 Output Voltage Drop vs. O2 Output Current 0 Ta=25°C VCC=VO1=24V IF=5mA −1 −2 0.15 −3 0.1 0.05 0 −40 −4 −5 0.0 −20 0 20 40 60 80 100 0.1 0.2 0.3 0.4 0.5 0.6 Ambient temperature Ta (°C) O2 output current IO2 (A) Fig.18 O2 High Level Output Voltage vs. Supply Voltage 30 O2 high level output voltage VO2H (V)