Description
NSR15ADXV6T1, NSR15ADXV6T5 Dual RF Schottky Diode These diodes are designed for analog and digital applications, including DC based signal detection and mixing applications. http://onsemi.com Features • • • • Low Capacitance (<1.0 pF) Low VF (390 mV Typical @ 1.0 mA) Low VFD (1.0 mV Typical @ 1.0 mA) These are Pb−Free Devices RF SCHOTTKY BARRIER DIODES 15 VOLTS, 30 mA Benefits • Reduced Parasitic Losses • Accurate Signal Measurement MAXIMUM RATINGS Rating Peak Reverse Voltage Forward Current Operating and Storage Temperature Range ESD Rating: Symbol VR IF TJ, Tstg Max 15 30 Unit V mA 6 5 4 1 2 3 −65 to °C www.DataSheet4U.com +150 6 1 MARKING DIAGRAM Class 1 per Human Body Model Class A per Machine Model Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 5RD SOT−563 CASE 463A 5R = Specific Device Code D = Date Code ORDERING INFORMATION Device NSR15ADXV6T1 NSR15ADXV6T5 Package SOT−563 SOT−563 Shipping† 4 mm pitch 4000 / Tape & Reel 2 mm pitch 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2004 1 June, 2004 − Rev. 3 Publication Order Number: NSR15ADXV6T1/D NSR15ADXV6T1, NSR15ADXV6T5 ELECTRICAL CHARACTERISTICS Characteristic Breakdown Voltage (IR = 10 mA) Reverse Leakage (VR = 1.0 V) Forward Voltage (IF = 1.0 mA) Forward Voltage (IF = 10 mA) Delta VF Capacitance (VF = 0 V, f = 1.0 MHz) Symbol VBR IR VF1 VF2 DVF CT Min 15 − − − − − Typ 20 2 390 530 1 0.8 Max − 50 415 680 15 1 Unit V nA mV mV mV pF 100 IF, FORWARD CURRENT (mA) 100 k IR, REVERSE CURRENT (nA) 10 k 10 25°C 125°C 75°C 1 125°C 0.1 −25°C 1k 75°C 100 25°C 10 1 0.01 0 0.1 0.2 0.3 0.4 0.5 VF, FORWARD VOLTAGE (V) 0.6 0.7 0 5 10 VR, REVERSE VOLTAGE (V) 15 Figure 1. Forward Current versus Forward Voltage at Temperatures Figure 2. Reverse Current versus Reverse Voltage 1 1000 RD, DYNAMIC RESISTANCE (W) 0 1 2 3 4 5 6 VR, REVERSE VOLTAGE (V) 7 8 CT, CAPACITANCE (pF) 0.9 100 0.8 0.7 10 0.6 0.5 1 0.1 1 10 IF, FORWARD CURRENT (mA) 100 Figure 3. Total Capacitance versus Reverse Voltage Figure 4. Dynamic Resistance versus Forward Current http://onsemi.com 2 NSR15ADXV6T1, NSR15ADXV6T5 DVF, FORWARD VOLTAGE DIFFERENTIAL (mV) DVF, FORWARD VOLTAGE DIFFERENCE (mV) IF, FORWARD CURRENT (mA) 100 IF, FORWARD CURRENT (mA) IF (left scale) 100 100 10 IF (left scale) 10 DVF (right scale) 1 10 10 1 1 DVF (right scale) 0.1 0.3 0.4 0.5 0.6 0.7 VF, FORWARD VOLTAGE (V) 0.8 0.1 1 0.1 0.175 0.275 0.225 VF, FORWARD VOLTAGE (V) 0.325 Figure 5. Typical VF Match at Mixer Bias Levels Figure 6. Typical VF Match at Detector Bias Levels 1 DC Bias = 3 mA 10 1 0.1 VDET, (Vdc) 0.01 0.001 RF IN 68 W 100 pF VO 4.7 kW VDET, (Vdc) 0.1 RF IN 0.01 3.3 nH 18 nH 100 pF VO 100 kW 0.0001 0.00001 0.001 −40 −35 −30 −25 −20 −15 −10 Pin, INPUT POWER (dBm) −5 0 0.000001 −20 −15 −10 5 10 15 −5 0 Pin, INPUT POWER (dBm) 20 25 30 Figure 7. Typical Output Voltage versus Input Power, Small Signal Detector Operating at 850 MHz Figure 8. Typical Output Voltage versus Input Power, Large Signal Detector Operating at 915 MHz 12 CONVERSION LOSS (dB) 10 9 8 7 6 −2 0 2 4 6 8 10 LOCAL OSCILLATOR POWER (dBm) 12 Figure 9. Typical Conversion Loss versus L.O. Drive, 2.0 GHz http://onsemi.com 3 NSR15ADXV6T1, NSR15ADXV6T5 PACKAGE DIMENSIONS SOT−563−6 CASE 463A−01 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 A −X− C K 4 6 5 1 2 3 B −Y− S D G 5 6 PL M J X Y 0.08 (0.003) DIM A B C D G J K S SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.0 0.0394 1.35 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches SOT−563 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 NSR15ADXV6T1/D

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NSR0320XV6T5

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