SPECIFICATIONS FOR NICHIA GREEN LED

www.DataSheet4U.com No. STSE-CG7075A SPECIFICATIONS FOR NICHIA GREEN LED MODEL : NSPG320C NICHIA CORPORATION -0- www.DataSheet4U.com Nichia STSE-CG7075A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 35 110 5 123 -30 ~ + 85 -40 ~ +100 265°C for 10sec. (Ta=25°C) Unit mA mA V mW °C °C IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=20[mA] VR= 5[V] IF=20[mA] IF=20[mA] IF=20[mA] Typ. (3.2) (7000) 0.170 0.700 (Ta=25°C) Max. Unit 3.5 V 50 µA mcd - (3) Ranking Item Luminous Intensity Rank W Rank V Rank U Symbol Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] Min. 7800 5520 3920 (Ta=25°C) Max. Unit 11000 mcd 7800 mcd 5520 mcd Luminous Intensity Measurement allowance is ± 10%. Color Ranks x y 0.14 0.64 Rank G 0.14 0.22 0.74 0.74 0.22 0.64 x y 0.21 0.65 (IF=20mA,Ta=25°C) Rank H 0.21 0.28 0.28 0.73 0.73 0.65 Color Coordinates Measurement allowance is ± 0.01. One delivery will include up to two color ranks and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. -1- www.DataSheet4U.com Nichia STSE-CG7075A 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Resin(Mold) : Leadframe : Epoxy Resin Ag plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after packaging in anti-electrostatic bags. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 6 for 2006, 7 for 2007 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity B for Nov. ) -2- www.DataSheet4U.com Nichia STSE-CG7075A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat Solderability Temperature Cycle Moisture Resistance Cyclic Terminal Strength (bending test) Terminal Strength (pull test) High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Standard Test Method JEITA ED-4701 300 302 JEITA ED-4701 300 303 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 400 401 JEITA ED-4701 400 401 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260 ± 5°C, 10sec. 3mm from the base of the epoxy bulb Tsld=235 ± 5°C, (using flux) 5sec. Note 1 time 1 time over 95% 100 cycles 10 cycles No noticeable damage No noticeable damage 1000hrs. 1000hrs. 1000hrs. 1000hrs. 500hrs. 1000hrs. Number of Damaged 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Load 5N (0.5kgf) 0° ~ 90° ~ 0° bend 2 times Load 10N (1kgf) 10 ± 1 sec. Ta=100°C Ta=60°C, RH=90% Ta=-40°C Ta=25°C, IF=35mA 60°C, RH=90%, IF=20mA Ta=-30°C, IF=20mA (2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=20mA U.S.L.*) Reverse Current IR VR=5V U.S.L.*) Luminous Intensity IV IF=20mA L.S.L.**) 0.7 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level Criteria for Judgement Min. Max. 1.1 2.0 -3- w w w . D a t a S h e e t 4 U . c o m Nichia STSE-CG7075A 7.CAUTIONS (1) Lead Forming · When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Do not use the base of the leadframe as a fulcrum during lead forming. · Lead forming should be done before soldering. · Do not apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. · When mounting the LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. (2) Storage · The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Nichia and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. · Nichia LED leadframes are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. · Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. (3) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) -4- www.DataSheet4U.com Nichia STSE-CG7075A (4) Soldering Conditions · Nichia LED leadframes are silver plated copper alloy. This substance has a low thermal coefficient (easily conducts heat). Careful attention should be paid during soldering. · Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is recommended. · Recommended soldering conditions Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position Dip Soldering 120°C Max. 60 seconds Max. 260°C Max. 10 seconds Max. No lower than 3 mm from the base of the epoxy bulb. Hand Soldering 350°C Max. Temperature 3 seconds Max. Soldering Time No closer than 3 mm from the Position base of the epoxy bulb. · Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs. · A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. · Dip soldering should not be done more than one time. · Hand soldering should not be done more than one time. · Do not apply any stress to the lead particularly when heated. · The LEDs must not be repositioned after soldering. · After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. · Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin. · When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. · Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. (5) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. (6) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as