Double Hex Driver

NCV7708A Double Hex Driver The NCV7708A is a fully protected Hex−Half Bridge−Driver designed specifically for automotive and industrial motion control applications. The six low and high side drivers are freely configurable and can be controlled separately. This allows for high side, low side, and H−Bridge control. H−Bridge control provides forward, reverse, brake, and high impedance states. The drivers are controlled via a standard SPI interface. Features http://onsemi.com • • • • • • • • • • • • • • • • Ultra Low Quiescent Current Sleep Mode Six Independent High−Side and Six independent Low−Side Drivers Integrated Freewheeling Protection (LS and HS) Internal Upper and Lower Clamp Diodes Configurable as H−Bridge Drivers 0.5 A Continuous (1 A peak) Current RDS(on) = 0.8 W (typ) 5 MHz SPI Control SPI Valid Frame Detection Compliance with 5 V and 3.3 V Systems Overvoltage Lockout Undervoltage Lockout www.DataSheet4U.com Fault Reporting Current Limit Overtemperature Protection These are Pb−Free Devices* SOIC−28 DW SUFFIX CASE 751F MARKING DIAGRAM NCV7708A AWLYYWWG A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN CONNECTIONS 1 OUTL5 OUTH5 OUTH4 OUTL4 VS2 GND GND GND GND VS1 OUTL3 OUTH3 OUTH2 OUTL2 OUTH6 OUTL6 SI SCLK CSB GND GND GND GND VCC SO EN OUTL1 OUTH1 Typical Applications • Automotive • Industrial ORDERING INFORMATION Device NCV7708ADWG Package SOIC−28W (Pb−Free) Shipping † 26 Units/Rail NCV7708ADWR2G SOIC−28W (Pb−Free) 1000/ Tape & Reel *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 1 March, 2007 − Rev. 0 Publication Order Number: NCV7708A/D NCV7708A VS1 DRIVE 1 High−Side Driver Waveshaping VS EN ENABLE CP Charge Pump Control Logic BIAS POR Fault Detect SPI Control SO Fault VS OUTH1 VCC Low−Side Driver Waveshaping Under−load Overcurrent Thermal Warning/Shutdown OUTL1 SI SPI SCLK 16 Bit Logic and Latch VS OUTH2 DRIVE 2 CSB CP OUTL2 VS DRIVE 3 CP OUTH3 OUTL3 VS1 Undervoltage Lockout VS2 CP VS DRIVE 4 OUTL4 OUTH4 VS1 Overvoltage Lockout VS2 VS DRIVE 5 CP OUTH5 OUTL5 VS DRIVE 6 CP OUTH6 OUTL6 GND VS2 Figure 1. Block Diagram http://onsemi.com 2 NCV7708A PIN DESCRIPTION Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Symbol OUTL5 OUTH5 OUTH4 OUTL4 VS2 GND GND GND GND VS1 OUTL3 OUTH3 OUTH2 OUTL2 OUTH1 OUTL1 EN SO VCC GND GND GND GND CSB SCLK SI OUTL6 OUTH6 Description Output Low Side 5. Open drain output driver with internal reverse diode. Output High Side 5. Open source output driver with internal reverse diode. Drain connected to VS2. Output High Side 4. Open source output driver with internal reverse diode. Drain connected to VS2. Output Low Side 4. Open drain output driver with internal reverse diode. Voltage Power Supply input for the High−Side Output Drivers 4, 5, and 6. Ground. Ground. Ground. Ground. Voltage Power Supply input for the High−Side Output Drivers 1, 2, and 3, All Six Low−Side Pre Drivers, and All Six Charge Pumps. Output Low Side 3. Open drain output driver with internal reverse diode. Output High Side 3. Open source output driver with internal reverse diode. Drain connected to VS1. Output High Side 2. Open source output driver with internal reverse diode. Drain connected to VS1. Output Low Side 2. Open drain output driver with internal reverse diode. Output High Side 1. Open source output driver with internal reverse diode. Drain connected to VS1. Output Low Side 1. Open drain output driver with internal reverse diode. Enable. Input high wakes the IC up from a sleep mode. Serial Output. 16 bit serial communications output. Power supply input for Logic. Ground. Ground. Ground. Ground. Chip Select Bar. Active low serial port operation. Serial Clock. Clock input for use with SPI communication. Serial Input. 16 bit serial communications input. Output Low Side 6. Open drain output driver with internal reverse diode. Output High Side 6. Open source output driver with internal reverse diode. Drain connected to VS2. http://onsemi.com 3 NCV7708A MAXIMUM RATINGS Rating Power Supply Voltage (VS1, VS2) (DC) (AC), t < 500 ms, Ivsx > −2 A Output Pin OUTHx (DC) (AC – inductive clamping) Output Pin OUTLx (DC) (AC), t < 500 ms, IOUTLx > −2 A (AC Inductive Clamping) Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, VCC) Output Current (OUTL1, OUTL2, OUTL3, OUTL4, OUTL5, OUTL6, OUTH1, OUTH2, OUTH3, OUTH4, OUTH5, OUTH6) (DC) Vds = 12 V (DC) Vds = 20 V (DC) Vds = 40 V (AC) Vds = 12 V, (50 ms pulse, 1 s period) (AC) Vds = 20 V, (50 ms pulse, 1 s period) (AC) Vds = 40 V, (50 ms pulse, 1 s period) Electrostatic Discharge, Human Body Model, VS1, VS2, OUTx Electrostatic Discharge, Human Body Model, all other pins Electrostatic Discharge, Machine Model Operating Junction Temperature Storage Temperature Range Moisture Sensitivity Level MAX 235°C Processing Value Unit V −0.3 to 40 −1.0 V −0.3 to 40 −8.0 V −0.3 to 34 −1.0 48 −0.3 to 7.0 V A −1.5 to 1.5 −0.7 to 0.7 −0.25 to 0.25 −2.0 to 2.0 −0.9 to 0.9 −0.3 to 0.3 4.0 2.0 200 −40 to 150 −55 to 150 3 kV kV V °C °C − Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Test Conditions Typical Value Thermal Parameters SOIC 28−pin Package min−pad board (Note 1) Junction−to−Lead (psi−JL8, YJL8) or Pins 6−9, 20−23 Junction−to−Ambient (RqJA, qJA) 1. 1−oz copper, 240 2. 1−oz copper, 986 mm2 mm2 copper area, 0.062″ thick FR4. copper area, 0.062″ thick FR4. 10 73 1″−pad board (Note 2) 11 56 °C/W °C/W http://onsemi.com 4 NCV7708A ELECTRICAL CHARACTERISTICS (−40°C < TJ < 150°C, 5.5 V < VSx < 40 V, 3 V < VCC < 5.25 V, EN = VCC, unless otherwise specified) Characteristic GENERAL Supply Current (VS1 + VS2) Sleep Mode (Note 4) Supply Current (VS1) Active Mode Supply Current (VCC) − Sleep Mode (Note 4) VS1 = VS2 = 13.2 V, VCC = CSB = 5 V, EN = SI = SCLK = 0 V (−40°C to 85°C) EN = VCC, 5.5 V < VSx < 35 V No Load CSB = VCC, EN = SI = SCLK = 0 V (−40°C to 85°C) EN = CSB = VCC, SI = SCLK = 0 V EN = VCC, 5.5 V < VSx < 35 V No Load − 1.0 5.0 mA Test Conditions Min Typ Max Unit − − 2.0 1.0 4.0 2.5 mA mA Supply Current (VCC) − Active Mode Supply Current (VS2) Active Mode VCC Power−On−Reset Threshold VSx Undervoltage Detection Threshold VSx Undervoltage Detection Hysteresis VSx Overvoltage Detection Threshold VSx Overvoltage Detection Hysteresis Thermal Warning (Note 3) Thermal Warning Hysteresis (Note 3) Thermal Shutdown (Note 3) − − 2.60 1.5 0.5 2.80 4.6 − 37.5 3.5 145 30 175 1.20 3.0 1.0 3.00 5.1 400 40.0 5.5 170 − 195 − mA mA V V mV V V °C °C °C − VSx decreasing 4.2 100 VSx increasing 35.0 1.5 120 − 155 1.05 Ratio of Thermal Shutdown to Thermal Warning (Note 3) OUTPUTS Output High RDSon (source) Iout = −500 mA 8 V < Vs < 40 V 8 V < Vs < 40 V, T = 25°C 5.5 V < Vs ≤ 8 V 5.5 V < Vs ≤ 8 V, T = 25°C Iout = 500 mA 8 V < Vs < 40 V 8 V < Vs < 40 V, T = 25°C 5.5 V < Vs ≤ 8 V 5.5 V < Vs ≤ 8 V, T = 25°C OUTH(1−6) = 0 V, VSx = 40 V, VCC = 5 V OUTH(1−6) = 0 V, T = 25°C, VCC = 5 V OUTL(1−6) = 34 V, VCC = 5 V OUTL(1−6) = 34 V, VCC = 5 V, T = 25°C VCC = 5 V, Vsx = 13.2 V VCC = 5 V, Vsx = 13.2 V VCC = 5 V, Vsx = 13.2 V VCC = 5 V, Vsx = 13.2 V W − − − − − 0.8 − 2.0 2.0 1.3 4.0 − W − − − − −5.0 −1.0 − − −1.9 −5.0 1.0 10 10 − 0.8 − 2.0 − − − − −1.45 −3.0 1.45 25 25 2.0 1.2 4.0 − − − 5.0 1.0 −1.0 −2.0 1.9 50 50 mA mA Output Low RDSon (sink) Source Leakage Current Sink Leakage Current Overcurrent Shutdown Threshold (OUTHx) Current Limit (OUTHx) Overcurrent Shutdown Threshold (OUTLx) Overcurrent Shutdown Delay Time − Source Overcurrent Shutdown Delay Time − Sink 3. 4. 5. 6. A A A ms Thermal characteristics are not subject to production test. For temperatures above 85°C, refer to graphs for VSx and VCC Sleep Current vs. Temperature on page 13. Refer to “Typical High−Side Negative Clamp Voltage” graph on page 13. Not production tested. http://onsemi.com 5 NCV7708A ELECTRICAL CHARACTERISTICS (−40°C < TJ < 150°C, 5.5 V < VSx < 40 V, 3 V < VCC < 5.25 V, EN = VCC, unless otherwise specified) Characteristic OUTPUTS Current Limit (OUTLx) Under Load Detection Threshold (OUTLx) Under Load Detection Threshold (OUTHx) Under Load Detection Delay Time Power Transistor Body Diode Forward Voltage High−Side Clamping Voltage (Note 5) Low−Side Clamping Voltage Low−Side Clamping Energy Logic Inputs (EN, SI, SCLK, CSB) Input Threshold − High Input Threshold − Low Input Hysteresis Input Pulldown Current (EN, SI, SCLK) Sleep Mode (SI, SCLK) Input Pullup Current (CSB) Sleep Mode Input Capacitance (Note 6) Logic Output (SO) Output High Output Low Tri−state Leakage Tri−state Input Capacitance (Note 6) Timing Specifications High Side Turn On Time High Side Turn Off Time Low Side Turn On Time Low Side Turn Off Time High Side Rise Time High Side Fall Time Low Side Rise Time Low Side Fall Time Non−Overlap Time Non−Overlap Time 3. 4. 5. 6. Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W Vs = 13.2 V, Rload = 25 W High Side Turn Off To Low Side Turn On Low Side Turn Off To High Sid