CMOS Low Iq LDO

Part  Number NCP699
Manufacturer ON Semiconductor
Semiconductor DataSheet

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NCP699 150 mA CMOS Low Iq LDO with Enable in TSOP−5 The NCP699 series of fixed output LDO’s are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP699 series features a very low ground current of 40 mA, independent of load current. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, internal resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP699 has been designed to be used with low cost capacitors. The device is housed in the micro−miniature TSOP−5 surface mount package. Standard voltage versions are 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, and 5.0 V. Other voltages are available in 100 mV steps. Features http://onsemi.com MARKING DIAGRAM TSOP−5 (SOT23−5, SC59−5) SN SUFFIX CASE 483 5 xxx AYWG G 1 5 1 • • • • • • • • • • • • • Enable Control (Active High, Supports Sub 1−Volt Logic) Very Low Ground Current of 40 mA Typical Low Dropout Voltage of 340 mV at 150 mA, and 3.0 V Vout Multiple Fixed Output Voltage Option Output Voltage Accuracy of 2.0% Operating Temperature Range of −40°C to 85°C Stable with 1 mF Ceramic or Tantalum Capacitors www.DataSheet4U.com These are Pb−Free Devices xxx A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS Vin 1 2 3 (Top View) 4 N/C 5 Vout Typical Applications Cellular Phones Battery Powered Consumer Products Hand−Held Instruments Camcorders and Cameras Printers and Office Equipment Gnd Enable ORDERING INFORMATION Battery or Unregulated Voltage Vout Cin 1 mF + 1 2 3 4 5 + Cout 1 mF See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. ON OFF This device contains 86 active transistors Figure 1. Typical Application Diagram © Semiconductor Components Industries, LLC, 2007 1 March, 2007 − Rev. 1 Publication Order Number: NCP699/D NCP699 Á ÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. 1 2 3 4 5 Pin Name Vin Description Positive power supply input voltage. Power supply ground. Gnd Enable N/C This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. No internal connection. Vout Regulated output voltage. MAXIMUM RATINGS Rating Input Voltage Enable Voltage Output Voltage Power Dissipation Operating Junction Temperature Operating Ambient Temperature Storage Temperature Symbol Vin Enable Vout PD TJ TA Tstg Value 2.1 to 6.0 −0.3 to Vin +0.3 −0.3 to Vin +0.3 Internally Limited −40 to +125 −40 to +85 −55 to +150 Unit V V V W °C °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch−up capability (85°C) "200 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Junction−to−Ambient PSIJ−Lead 2 NOTE: Symbol RqJA Test Conditions 1 oz Copper Thickness, 100 mm2 1 oz Copper Thickness, 100 mm2 Typical Value 250 68 Unit °C/W °C/W Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. http://onsemi.com 2 NCP699 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C, unless otherwise noted.) Characteristic Output Voltage (Iout = 10 mA, TA = −40°C to 85°C) 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V Line Regulation (Iout = 10 mA) 1.5 V−4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V) 4.5 V−5.0 V (Vin = 5.5 V to 6.0 V) Load Regulation (Iout = 1.0 mA to 150 mA) Output Current Limit 1.5 V−3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Dropout Voltage (Iout = 150 mA, Measured at Vout = Vout(nom) −3.0%) 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V Disable Current (TA = −40°C to 85°C) (Enable Input = 0 V) Ground Current (TA = −40°C to 85°C) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) Output Short Circuit Current (Vout = 0 V) 1.5 V−3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Output Voltage Noise (f = 100 Hz to 100 kHz) Iout = 30 mA, Cout = 1 mF Ripple Rejection (f = 120 Hz, 15 mA) (f = 1.0 kHz, 15 mA) Enable Input Threshold Voltage (TA = −40°C to 85°C) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Output Voltage Temperature Coefficient 3. Maximum package power dissipation limits must be observed. T *TA PD + J(max) RqJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. Symbol Vout 1.455 1.746 2.425 2.744 2.94 3.234 4.900 Regline − − − 150 150 Vin−Vout − − − − − − − DIS − IGND − Iout(max) 150 150 Vn − RR − − Vth(en) 0.95 − − − − "100 − 0.3 − 55 50 − − V 100 − dB 300 300 600 600 mVrms 40 90 mA 0.03 1.0 mA 690 570 400 360 340 320 240 750 620 450 420 400 360 300 mA 1.0 1.0 0.3 240 240 3.0 3.0 0.8 − − mV 1.5 1.8 2.5 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.856 3.06 3.366 5.100 mV/V Min Typ Max Unit V Regload Io(nom.) mV/mA mA TC ppm/°C http://onsemi.com 3 NCP699 TYPICAL CHARACTERISTICS 450 VDD, DROPOUT VOLTAGE (mV) Vout, OUTPUT VOLTAGE (V) 400 350 300 250 200 150 100 50 0 −60 −40 −20 0 20 40 Vin = 4.0 V Vout = 3.0 V Iout = 150 mA 60 80 100 3.015 Vin = 6.0 V 3.010 Vin = 4.0 V 3.005 3.000 2.995 Vout = 3.0 V Iout = 1.0 mA 2.990 −60 −40 −20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C) TEMPERATURE (°C) Figure 2. Dropout Voltage vs. Temperature Figure 3. Output Voltage vs. Temperature 43 Iq, QUIESCENT CURRENT (mA) 42 41 40 39 38 37 36 35 −60 −40 −20 0 20 40 Vin = 4.0 V Vout = 3.0 V Iout = 0 mA 60 80 100 Iq, QUIESCENT CURRENT (mA) 60 50 40 30 20 10 0 0 Vout = 3.0 V Iout = 0 mA TA = 25°C Cin = 1.0 mF Cout = 1.0 mF 1.0 2.0 3.0 4.0 5.0 6.0 7.0 TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 4. Quiescent Current vs. Temperature 60 Ignd, GROUND CURRENT (mA) 50 40 30 20 10 0 0 Vout = 3.0 V Iout = 30 mA TA = 25°C Cin = 1.0 mF Cout = 1.0 mF 1.0 2.0 3.0 4.0 5.0 6.0 7.0 70 60 RIPPLE REJECTION (dB) 50 40 30 20 10 0 100 Figure 5. Quiescent Current vs. Input Voltage Vin = 4.0 V Cout = 1.0 mF Iout = 30 mA 1.0k 10k FREQUENCY (Hz) 100k 1.0M Vin, INPUT VOLTAGE (V) Figure 6. Ground Pin Current vs. Input Voltage Figure 7. Ripple Rejection vs. Frequency http://onsemi.com 4 NCP699 TYPICAL CHARACTERISTICS 7 OUTPUT VOLTAGE NOISE (mV/ Hz) 6 5 4 3 2 1 0 10 100 1.0k 10k 100k 1.0M Vin = 4.0 V Cout = 1.0 mF Iout = 30 mA FREQUENCY (Hz) Figure 8. Output Noise Density Figure 9. Line Transient Response Figure 10. Load Transient Response 3.5 Vout, OUTPUT VOLTAGE (V) 3.0 2.5 Iout = 1.0 mA 2.0 150 mA 1.5 1.0 0.5 Figure 11. Turn−on Response TA = 25°C 0 0 1.0 2.0 3.0 4.0 5.0 6.0 Vin, INPUT VOLTAGE (V) Figure 12. Output Voltage vs. Input Voltage http://onsemi.com 5 NCP699 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power Dissipation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection The maximum total dissipation for which the regulator will operate within its specifications. Quiescent and Ground Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator




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