Power Rectifier

MURB1620CT Preferred Device SWITCHMODE™ Power Rectifier D2PAK Power Surface Mount Package Designed for use in switching power supplies, inverters and as free wheeling diodes, these state-of-the-art devices have the following features: http://onsemi.com • • • • • • • • Package Designed for Power Surface Mount Applications Ultrafast 35 Nanosecond Recovery Times 175°C Operating Junction Temperature Epoxy Meets UL94, VO @ 1/8″ High Temperature Glass Passivated Junction Low Leakage Specified @ 150°C Case Temperature Short Heat Sink Tab Manufactured - Not Sheared! Similar in Size to Industrial Standard TO-220 Package ULTRAFAST RECTIFIER 16 AMPERES 200 VOLTS 1 4 3 Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL94, VO • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: www.DataSheet4U.com 260°C Max. for 10 Seconds Shipped 50 units per plastic tube Available in 24 mm Tape and Reel, 800 units per reel by adding a “T4” suffix to the part number Marking: U1620 Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) 4 1 3 D2PAK CASE 418B STYLE 3 MARKING DIAGRAM xx xxxxxxx AWLYWW xxxxx YWW MAXIMUM RATINGS (Per Leg) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 150°C) Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 150°C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) IFM Value 200 Unit V xx A WL Y WW IC Standard = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week 8.0 16 16 A A ORDERING INFORMATION IFSM 100 A Device MURB1620CT MURB1620CTT4 TJ, Tstg -65 to +175 °C Preferred devices are recommended choices for future use and best overall value. Package D2PAK D2PAK Shipping 50 Units/Rail 800/Tape & Reel © Semiconductor Components Industries, LLC, 2003 1 May, 2003 - Rev. 4 Publication Order Number: MURB1620CT/D MURB1620CT THERMAL CHARACTERISTICS (Per Leg) Rating Maximum Thermal Resistance, Junction to Case Maximum Thermal Resistance, Junction to Ambient (Note 1.) Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds Symbol RθJC RθJA TL Value 3 50 260 Unit °C/W °C/W °C ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 2.) (iF = 8 Amp, TC = 150°C) (iF = 8 Amp, TC = 25°C) Maximum Instantaneous Reverse Current (Note 2.) (Rated dc Voltage, TC = 150°C) (Rated dc Voltage, TC = 25°C) Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amp/µs) (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 Amp) 1. See Chapter 7 for mounting conditions 2. Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0% 100 50 20 10 5.0 2.0 1.0 0.7 0.3 0.1 0.2 0.4 0.6 0.8 vF, INSTANTANEOUS VOLTAGE (V) 1 1.2 TJ = 175°C 100°C 25°C I R, REVERSE CURRENT ( µ A) 1.0 K 400 100 20 4 1 0.2 100°C 25°C TJ = 175°C Symbol vF 0.895 0.975 iR 250 5 trr 35 25 ns µA Max Unit Volts i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 10 K 0.04 0.01 0 20 40 60 100 120 140 80 VR, REVERSE VOLTAGE (V) 160 180 200 Figure 1. Typical Forward Voltage, Per Leg I F(AV), AVERAGE POWER DISSIPATION (WATTS) Figure 2. Typical Reverse Current, Per Leg* 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 140 150 SQUARE WAVE DC PF(AV), AVERAGE POWER DISSIPATION (WATTS) RATED VR APPLIED RθJC = 3°C/W 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 9 10 SQUARE WAVE DC TJ = 175°C 160 170 TC, CASE TEMPERATURE (°C) 180 Figure 3. Current Derating Case, Per Leg Figure 4. Power Dissipation, Per Leg http://onsemi.com 2 MURB1620CT r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1 0.5 D = 0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.02 0.1 0.05 0.01 SINGLE PULSE P(pk) t2 Duty Cycle, D = t1/t2 TJ(pk) − TC = P(pk) ZθJC(t) t1 ZθJC(t) = r(t) RθJC D curves apply for power pulse train shown read time at T1 0.05 0.1 0.2 0.5 1 2 t, TIME (ms) 5 10 20 50 100 200 500 1K Figure 5. Thermal Response 1K C, CAPACITANCE (pF) 300 TJ = 25°C 100 30 10 1 10 VR, REVERSE VOLTAGE (V) 100 Figure 6. Typical Capacitance, Per Leg http://onsemi.com 3 MURB1620CT INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the interface between the board and the package. With the total design. The footprint for the semiconductor packages correct pad geometry, the packages will self align when must be the correct size to insure proper solder connection subjected to a solder reflow process. 0.33 8.38 0.42 10.66 0.04 1.016 0.12 3.05 0.67 17.02 0.24 6.096 inches mm D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(max) - TA RθJA into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 3.0 watts. PD = 175°C - 25°C = 3.0 watts 50°C/W The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values The 50°C/W for the D2PAK package assumes the recommended drain pad area of 158K mil2 on FR-4 glass epoxy printed circuit board to achieve a power dissipation of 3.0 watts using the footprint shown. Another alternative is to use a ceramic substrate or an aluminum core board such as Thermal Clad™. By using an aluminum core board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. GENERAL SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 5 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling * * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * * Due to shadowing and the inability to set the wave height to incorporate other surface mount components, the D2PAK is not recommended for wave soldering. http://onsemi.com 4 MURB1620CT RECOMMENDED PROFILE FOR REFLOW SOLDERING For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering the D2PAK to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189 °C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 RAMP" 200°C STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150°C STEP 5 STEP 6 STEP 7 STEP 4 HEATING VENT COOLING HEATING ZONES 3 & 6 ZONES 4 & 7 205° TO SPIKE" SOAK" 219°C 170°C PEAK AT SOLDER 160°C JOINT SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MAS