Class B Serial Transceiver

www.DataSheet4U.com Freescale Semiconductor Technical Data Document Number: MC33390 Rev 7.0, 11/2006 Class B Serial Transceiver The 33390 is a serial transceiver designed to provide bi-directional half-duplex communication meeting the automotive SAE Standard J1850 Class B Data Communication Network Interface specification. It is designed to interface directly to on-board vehicle microcontrollers and serves to transmit and receive data on a single-wire bus at data rates of 10.4 kbps using Variable Pulse Width Modulation (VPWM). The 33390 operates directly from a vehicle's 12 V battery system and functions in a logic fashion as an I/O interface between the microcontroller's 5.0 V CMOS logic level swings and the required 0 V to 7.0 V waveshaped signal swings of the bus. The bus output driver is short circuit current limited. Features • Designed for SAE J-1850 Class B Data Rates • Full Operational Bus Dynamics Over a Supply Voltage of 9.0 to 16 V • Ambient Operating Temperature of -40°C to 125°C • Interfaces Directly to Standard 5.0 V CMOS Microcontroller • BUS Pin Protected Against Shorts to Battery and Ground • Thermal Shutdown with Hysteresis • Voltage Waveshaping of Bus Output Driver • 40 V Max VBAT Capability • Pb-Free Packaging Designated by Suffix Code EF 33390 J-1850 SERIAL TRANSCEIVER D SUFFIX EF SUFFIX (PB-FREE) 98ASB42564B 8-LEAD SOICN ORDERING INFORMATION Device MC33390D/DR2 -40°C to 125°C MCZ33390EF/R2 8 SOICN Temperature Range (TA) Package VPWR 33390 +VBAT BUS LOAD Primary Node MCU SLEEP TX RX 4X/Loop GND Secondary Nodes Figure 1. 33390 Simplified Application Diagram Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2007. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM 33390 Bus Driver Voltage Regulator Thermal Shutdown VBAT SLEEP BUS 4.5 V Reference Waveshaping Filter Digital Output Driver 4X Enable Loopback TX RX Loss of Ground Protection LOAD 4X/LOOP GND Note This device contains approximately 400 active transistors and 250 gates. Figure 2. 33390 Simplified Internal Block Diagram 33390 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS SLEEP GND LOAD BUS 1 1 2 2 3 3 4 4 88 77 66 55 RX TX 4X/LOOP VBAT Figure 3. 33390 Pin Connections Table 1. 33390 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 9. Pin Number 1 2 3 4 5 6 7 8 Pin Name SLEEP GND LOAD BUS VBAT 4X/ LOOP TX RX Definition Enables the transceiver when Logic 1 and disables the transceiver when Logic 0. Device ground pin. Accommodates an external pull-down resistor to ground to provide loss of ground protection. Waveshaped SAE Standard J-1850 Class B transmitter output and receiver input. Provides device operating input power. Tristate input mode control; Logic 0 = normal waveshaping, Logic 1 = waveshaping disabled for 4X transmitting, high impedance = loopback mode. Serial data input (DI) from the microcontroller to be transmitted onto Bus. Bus received serial data output (DO) sent to the microcontroller. 33390 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings VBAT DC Supply Voltage Input I/O Pins (2) (1) Symbol VBAT VI/O(CPU) VBUS VESD1 VESD2 TSTG TA TJ TPPRT RθJ-A Value -0.3 to 40 -0.3 to 7.0 -2.0 to 16 Unit V V V V BUS and LOAD Outputs ESD Voltage (3) Human Body Model Machine Model Storage Temperature Operating Ambient Temperature Operating Junction Temperature Peak Package Reflow Temperature During Reflow (4), (5) Thermal Resistance (Junction-to-Ambient) ±2000 ±200 -65 to 150 -40 to 125 -40 to 150 Note 5. 180 °C °C °C °C °C / W Notes 1. An external series diode must be used to provide reverse battery protection of the device. 2. SLEEP, TX, RX, and 4X / LOOP are normally connected to a microcontroller. 3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 4. 5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 33390 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 7.0 V ≤ VBAT ≤ 16 V, -40°C ≤ TA ≤ 125°C, SLEEP = 5.0 V unless otherwise noted. Typical values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the pin. All negative currents are out of the pin. Characteristic POWER CONSUMPTION Operational Battery Current (RMS with Tx = 7.812 kHz Square Wave) BUS Load = 1380 Ω to GND, 3.6 nF to GND BUS Load = 257 Ω to GND, 20.2 nF to GND Battery Bus Low Input Current After SLEEP Toggle Low to High; Prior to Tx Toggling After Tx Toggle High to Low Sleep State Battery Current VSLEEP = 0 V BUS BUS Input Receiver Threshold (6) Threshold High (Bus Increasing until Rx ≥ 3.0 V) Threshold Low (Bus Decreasing until Rx ≤ 3.0 V) Threshold in Sleep State (SLEEP = 0 V) Hysteresis (VBUS(IH) - VBUS(IL), SLEEP = 0 V) BUS-Out Voltage (257 Ω ≤ RBUS(L) to GND ≤ 1380 Ω) 8.2 V ≤ VBAT ≤ 16 V, Tx = 5.0 V 4.25 V ≤ VBAT ≤ 8.2 V, Tx = 5.0 V Tx = 0 V BUS Short Circuit Output Current Tx = 5.0 V, -2.0 V ≤ VBUS ≤ 4.8 V BUS Leakage Current -2.0 V ≤ VBUS ≤ 0 V 0 V ≤ VBUS ≤ VBAT BUS Thermal Shutdown (7) Symbol Min Typ Max Unit mA IBAT (OP1) IBAT (OP2) – – 3.0 22.4 11.5 32 mA IBAT(BUS L1) IBAT(BUS L2) IBAT(SLEEP) – 38.2 65 – – 1.1 6.4 3.0 8.5 µA V VBUS(IH) VBUS(IL) BUSTH(SLEEP) VBUS(HYST) 4.25 – 2.4 0.1 3.9 3.7 3.0 0.2 – 3.5 3.4 0.6 V VBUS (OUT1) VBUS (OUT2) VBUS (OUT3) IBUS (SHORT) 60 129 170 µA IBUS (LEAK1) IBUS (LEAK2) -500 – -55 189 – 500 °C 150 TBUS (LI MHYS) 10 12 15 mA IBUS (LOSS) ILOAD (LOSS) – – 0.00 0.00 0.1 0.1 170 190 °C 6.25 VBAT - 1.6 – 6.9 – 0.27 8.0 VBAT 0.7 mA (Tx = 5.0 V, IBUS = -0.1 mA) TBUS (LIM) Increase Temperature until VBUS ≤ 2.5 V BUS Thermal Shutdown Hysteresis (8) TBUS (LIM) - TBUS (REEN) BUS and LOAD Current with Loss of VBAT or GND (IBAT = 0 µA) (see Figure 4) -18 V ≤ VBUS ≤ 9.0 V -18 V ≤ VLOAD ≤ 9.0 V Notes 6. Typical threshold value is the approximate actual occurring switch point value with VBAT = 13 V, TA = 25°C. 7. 8. Device characterized but not production tested for thermal shutdown. Device characterized but not production tested for thermal shutdown hysteresis. 33390 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions of 7.0 V ≤ VBAT ≤ 16 V, -40°C ≤ TA ≤ 125°C, SLEEP = 5.0 V unless otherwise noted. Typical values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the pin. All negative currents are out of the pin. Characteristic BUS (CONTINUED) LOAD Output IL = 6.0 mA Unpowered LOAD Output VBAT = 0 V, IL = 6.0 mA TX Tx Input Voltage Tx Input Logic Low Level Tx Input Logic High Level Tx Input Current VTx = 5.0 V VTx = 0 V LOOP 4X / LOOP Input Current V4X / LOOP = 0 V (Normal Mode) V4X / LOOP = 5.0 V (4X Mode) 4X / LOOP Input Threshold (Tx = 4096 Hz Square Wave) Normal Mode to Loopback Mode Loopback Mode to 4X Mode RX Rx Output Voltage Low VBUS = 0 V, IRx = 1.6 mA Rx Output Voltage High VBUS = 7.0 V, IRx = -200 µA Rx Output Current VRx = High; Short Circuit Protection Limits SLEEP SLEEP Input Current Symbol Min Typ Max Unit LON – LDIO 0.3 0.56 0.9 0.07 0.2 V V V VTx(IL) VTx(IH) – 3.5 – – 0.8 – µA ITx(IH) ITx(IL) 50 -2.0 106 0.23 200 2.0 µA I4X / LOOP(IL) I4X / LOOP(IH) -200 -200 -60 110 200 200 V V4X / LOOP(IL) V4X / LOOP(IH) 1.1 3.2 1.31 3.43 1.5 3.6 VRx (LOW) 0.01 VRx(HIGH) 4.25 IRx 2.0 3.67 8.0 4.58 4.75 0.18 0.4 V V mA µA ISLEEP (IL) ISLEEP (IH) – 1.0 -0.23 6.21 -2.0 20 VSLEEP = 0 V VSLEEP = 5.0 V 33390 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions of 7.0 V ≤ VBAT ≤ 16 V, -40°C ≤ TA ≤ 125°C, SLEEP = 5.0 V unless otherwise noted. Typical values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the pin. All negative currents are out of the pin. Characteristic BUS BUS Voltage Rise Time (9) (9.0 V ≤ VBAT ≤ 16 V, Tx = 7.812 kHz Square Wave) (see Figure 5) BUS Load = 3,300 pF and 1.38 kΩ to GND BUS Load = 16,500 pF and 300 Ω to GND BUS Voltage Fall Time (see Figure 5) (9) Symbol Min Typ Max Unit tRISE (BUS) 9.0 9.0 tFALL (BUS) 9.0 9.0 tPWD (BUS) 35 tPD (BUS) – 17.7 25 62 93 10.50 11.17 15 15 11.15 11.86 15 15 µs (9.0 V ≤ VBAT ≤ 16 V, Tx = 7.812 kHz S