Contact Monitoring and Dual Low-Side Protected Driver

Freescale Semiconductor Technical Data Document Number: MC33287 Rev. 5.0, 2/2007 Contact Monitoring and Dual Low-Side Protected Driver The 33287 interfaces between switch contacts and a microcontroller. Eight switch-to-battery (or switch-to-ground) sense monitor switch status. Additionally, two internal low-side switches are available to control inductive or capacitive loads. The 33287 has eight sense inputs (rated at 40 V) with thresholds ratiometric to VBAT. One sense input has a dedicated output for direct interfacing to the MCU and the remaining seven inputs are multiplexed interfaced to the MCU. The two low-side switch outputs are current limited to 535 mA and internally clamped to 50 V. Outputs also have independent overtemperature shutdown and diagnostic reporting. Features • • • • Eight High-Voltage Sense Inputs Direct Interfacing to Microcontroller Two Current Limited Low-Side Drivers Drivers Internally Overvoltage Clamped and Thermally Protected • 55 µA Standby Current • Pb-Free Packaging Designated by Suffix Code EG 33287 AUTOMOTIVE CONTACT MONITORING AND DUAL LOW-SIDE PROTECTED DRIVER DW SUFFIX EG SUFFIX (PB-FREE) 98ASB42343B 20-PIN SOICW ORDERING INFORMATION Device MC33287DW/R2 -40 to 125°C MCZ33287EG/R2 20 SOICW Temperature Range (TA) Package www.DataSheet4U.com GND Sense 5.0 V 33287 VBAT VDD1 IN0 IN1 AD0 AD1 AD2 OUT1 OUT7 CD1 OUTD1 CD2 OUTD2 GND MCU VDD2 VDD 8 Sense to GND or VBAT Inputs IN2 IN3 IN4 IN5 IN6 IN7 VBAT Sense Figure 1. Simplified Application Design Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2007. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM IN0 Internal Supply IN1 IN2 IN3 IN4 IN5 IN6 IN7 VDD2 VDD1 AD2 Multiplexer 8 to 1 and Diagnostic Logic DIAGD1 DIAGD2 OUT7 AD1 OUT1 AD0 Fault Detector OUTD1 Overtemperature Fault Detector Overtemperature OUTD2 Detection Control Current Limitation VDD2 Detection Control Current Limitation GND CD1 CD2 Figure 2. 33287 Simplified Internal Block Diagram 33287 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS VDD1 IN3 IN2 IN1 IN0 AD0 AD1 AD2 OUTD1 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VDD2 IN4 IN5 IN6 IN7 OUT7 OUT1 CD1 CD2 OUTD2 Figure 3. 33287 Pin Connections Table 1. 33287 Pin Definitions Pin Number Pin Name 1, 20 5, 4, 3, 2, 19, 18, 17, 16 6, 7, 8 9, 11 10 12, 13 14 15 VDD1, VDD2 IN0 – IN7 Formal Name Voltage Power Input 0 – 7 Definition These are high-voltage power supply 5.0 V pins (VBAT). These are high-voltage input pins. AD0 – AD2 OUTD1, OUTD2 GND CD1, CD2 OUT1 OUT7 Address Output Drain Ground Command Driver Output 1 Output 7 These pins are the addresses for mode and input selection. These two are output driver pins (drain). This pin in the ground for the logic and analog circuitry of the device. These are the two driver command pins. This is the output (multiplexed Output 1 = 0 to 6.0 V for IN0 to IN6 and DIAGD1 or DIAGD2) and DIAGD2 pins. This is the direct output from IN7 pin. 33287 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Power Supply Voltage Normal Operation (Steady-State) Load Dump Conditions Logic Supply Voltage (Continuous) Input Pin Voltage (1) ESD Voltage (2) Human Body Model Machine Model Operating Ambient Temperature Storage Temperature Power Dissipation (TA = 85°C) Peak Package Reflow Temperature During Reflow Thermal Resistance Junction-to-Ambient (3) (4) Symbol VDD1 Value Unit V 24 40 VDD2 VIN VESD1 VESD2 TA TSTG PD , TPPRT RθJ-A 7.0 40 V V V ±2000 ±200 -40 to 125°C -65 to 150 0.7 Note 4. 100 °C °C W °C °C/W Notes 1 With Serial Resistor ≥ 25 kΩ 2 ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 3. 4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 33287 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. STATIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 7.0 V ≤ VDD1 ≤ 18 V, 4.75 V ≤ VDD2 ≤ 5.25 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Extended limit is 5.0 V ≤ VDD1 ≤ 7.0 V and other parameters are full specification in this mode. Inputs IN1–IN7 and lowside drivers are still functional with down-graded characteristics. Characteristic SUPPLY VOLTAGE (VDD1 AND VDD2 PINS) Operational Supply Voltage Full Specification Extend Limit Operational Supply Voltage (Full Specification) Supply Current Standby Mode VDD1 ≤ 14 V VCD1 = VDD2, VCD2 = 0 V Supply Current in Drivers on Configuration (Full Specification) VCD1 = 0 V VCD2 = VDD2 OUTPUT DRIVERS CHARACTERISTICS (OUTD1 AND OUTD2 PINS) Output Resistance (Full Specification and TJ ≤ 130°C) Output Resistance (Extent Limit and TJ ≤ 130°C) Leakage Current (Internal Current Source) PROTECTION AND LEVEL DETECTION (OUTD1 AND OUTD2 PINS) Positive Output Clamp Output Current Limitation (130°C ≥ TJ) Output Fault Detector Level Overtemperature Detection (at 25°C by Function Simulation) INPUTS (CD1 AND CD2 PINS) Input Voltage Low Input Voltage High Hysteresis Input Current on Pin CD1 (Internal Pull-Up and CD1 Connected to Ground) Leakage Current on Pin CD1 (Internal Pull-Up Connected to VDD2) Input Current on Pin CD2 (Internal Pull Down CD2 Connected to VDD2) Leakage Current on Pin CD2 (Internal Pull-Up CD1 Connected to Ground) Notes 5 All INn and ADn inputs are connected to ground. VIL VIH VHST ICD1 ILEAK ICD2 ILEAK — 8.0 x VDD2 500 -100 -5.0 10 -5.0 — — 800 -30 — 30 — 4.0 x VDD2 — — -10 5.0 100 5.0 V V mV µA µA µA µA VCLAMP ILIM VFAULT TDETEC 40 300 2.0 145 50 535 2.75 160 60 750 3.5 175 V mA V °C RDS(ON) RDS(ON) ILEAK — — 1.0 1.40 — — 3.20 5.0 13 Ω Ω µs (5) (5) Symbol Min Typ Max Unit VDD1 V 7.0 5.0 12 — — 18 7.0 — V µA VDD2 4.75 IVDD1-0 — — 55 — 110 10 µA IVDD2-0 IVDD1-1 — — 250 650 1500 1500 IVDD2-1 33287 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. STATIC ELECTRICAL CHARACTERISTICS (continued) Characteristics noted under conditions 7.0 V ≤ VDD1 ≤ 18 V, 4.75 V ≤ VDD2 ≤ 5.25 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Extended limit is 5.0 V ≤ VDD1 ≤ 7.0 V and other parameters are full specification in this mode. Inputs IN1–IN7 and lowside drivers are still functional with down-graded characteristics. Characteristic INPUTS (IN0 TO IN7 PINS) Input Voltage Low (Full Specification) Input Voltage Low (Extended Limit) Input Voltage High (Full Specification and Extended Limit) Hysteresis (5.0 V < VDD1 < 16 V) Input Current (VIN < 16 V) Input Voltage Clamp (I = 100 µA) INPUTS (AD0, AD1, AND AD2 PINS) Input Voltage Low Input Voltage High Hysteresis Input Current OUTPUTS (OUT1 AND OUT7 PINS) Output Voltage Low (ILOAD = 2.0 mA) Output Voltage High (ILOAD = -2.0 mA) VOL VOH — 8.0 x VDD2 — — 2.0 x VDD2 — V V VIL VIH VHYS ILEAK — 8.0 x VDD2 500 -5.0 — — 750 — 4.0 x VDD2 — — 5.0 V V mV µA VIL VIL VIH VHYS ILEAK VINCLAMP — — 7.0 x VDD1 5.0 5.0 17 — — — 1.0 — 20 4.0 x VDD1 3.0 x VDD1 — — 5.0 23 V V V V µA V Symbol Min Typ Max Unit 33287 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. DYNAMIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic OUTPUT DRIVERS CHARACTERISTICS (OUTD1 AND OUTD2 PINS) Turn ON Delay Time Turn OFF Delay Time Output Rising Edge Output Falling Edge Difference Between Command Duration and Bit Duration tON tOFF tRISE tFALL ∆BIT — — — — -5.0 1.3 2.1 2.8 1.0 — 10 10 10 10 5.0 µs µs µs µs µs Symbol Min Typ Max Unit 33287 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS CD2 t tCOMMAND OUTD2 80% 50% ∆Bit = tCOMMAND- tBIT 80% tBIT 50% 20% tOFF tFALL Figure 4. Timing Characteristics VBAT 20% tON tRISE t R1 = 500 Ω C1 = 2.0 nF C2 = 250 pF CD1 OUTD1 R2 = 47 kΩ VBAT R1 = 500 Ω CD2 f = 5.0 kHz C1 = 2.0 nF C2 = 250 pF OUTD2 R2 = 47 kΩ Figure 5. Timing Test Configuration 33287 8 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 5. Drivers Function Table CD1 (6) High Level for Logic Signals Low Level for Logic Signals High Level for Logic Signals Low Level for Logic Signals CD2 (7) OUTD1 High Level for Drivers Outputs Low Level for Drivers Outputs Low Level for Drivers Outputs High Level for Drivers Outputs OUTD2 High Level for Drive