MX family of microprocessors



Part  Number MC9328MX21S
Manufacturer Freescale Semiconductor
Semiconductor DataSheet

DataSheet View

Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9328MX21S Rev. 1.1, 04/2007 MC9328MX21S Package Information MC9328MX21S 266 MHz (MAPBGA–289) Ordering Information: See Table 1 on page 3 1 Introduction Contents 1 2 3 4 5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . .4 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Pin Assignment and Package Information . . .84 Document Revision History . . . . . . . . . . . . . . .87 www.DataSheet4U.com Freescale’s i.MX family of microprocessors has demonstrated leadership in the portable handheld market. Building on the success of the MX (Media Extensions) series, the i.MX21S (MC9328MX21S) provides a leap in performance with an ARM926EJ-S™ microprocessor core that provides accelerated Java support in addition to highly integrated system functions. The i.MX21S device addresses the needs of multiple markets with intelligent integrated peripherals, advanced ARM® processor core, and power management capabilities. The i.MX21S features the advanced and power-efficient ARM926EJ-S core operating at speeds up to 266 MHz and is part of a growing family of Smart Speed products that offer high performance processing optimized for lowest power consumption. On-chip modules such as an LCD controller, USB On-The-Go, 1-Wire® interface, and synchronous serial interfaces offer designers a rich suite of peripherals that can enhance many products. For cost sensitive applications, the NAND Flash controller allows the use of low-cost NAND Flash This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2005, 2006, 2007. All rights reserved. Introduction devices to be used as primary or secondary non-volatile storage. The on-chip error correction code (ECC) and parity checking circuitry of the NAND Flash controller frees the CPU for other tasks. WLAN, Bluetooth and expansion options are provided through PCMCIA/CF, USB, and MMC/SD host controllers. The device is packaged in a 289-pin MAPBGA. System Control JTAG/Multi-ICE® System Boot Clock Management Connectivity i.MX21S ARM9 Platform ARM926EJ-S I Cache D Cache Internal Control MAX MMU Bus Control Memory Control CSPI x 2 SSI x 2 I2C Audio Mux UART 1, 3, & 4 1-Wire FIRI USB OTG/ 1 Host Standard System I/O Timers x 3 PWM WDOG RTC GPIO DMAC Human Interface LCD Controller SLCD Controller Keypad Memory Interface SDRAMC WEIM NFC Memory Expansion MMC/SD x 2 PCMCIA/CF Figure 1. i.MX21S Functional Block Diagram 1.1 • • • • • • • • Conventions OVERBAR is used to indicate a signal that is active when pulled low: for example, RESET. Logic level one is a voltage that corresponds to Boolean true (1) state. Logic level zero is a voltage that corresponds to Boolean false (0) state. To set a bit or bits means to establish logic level one. To clear a bit or bits means to establish logic level zero. A signal is an electronic construct whose state conveys or changes in state convey information. A pin is an external physical connection. The same pin can be used to connect a number of signals. Asserted means that a discrete signal is in active logic state. — Active low signals change from logic level one to logic level zero. — Active high signals change from logic level zero to logic level one. Negated means that an asserted discrete signal changes logic state. — Active low signals change from logic level zero to logic level one. — Active high signals change from logic level one to logic level zero. This document uses the following conventions: • MC9328MX21S Technical Data, Rev. 1.1 2 Freescale Semiconductor Introduction • • LSB means least significant bit or bits, and MSB means most significant bit or bits. References to low and high bytes or words are spelled out. Numbers preceded by a percent sign (%) are binary. Numbers preceded by a dollar sign ($) or 0x are hexadecimal. 1.2 Reference Documentation The following documents are required for a complete description of the i.MX21S and are necessary to design properly with the device. Especially for those not familiar with the ARM926EJ-S processor the following documents are helpful when used in conjunction with this manual. ARM Architecture Reference Manual (ARM Ltd., order number ARM DDI 0100) ARM7TDMI Data Sheet (ARM Ltd., order number ARM DDI 0029) ARM920T Technical Reference Manual (ARM Ltd., order number ARM DDI 0151C) MC9328MX21S Product Brief (order number MC9328MX21SPB) The Freescale manuals are available on the Freescale Semiconductor Web site at http:// www.freescale.com. These documents may be downloaded directly from the Freescale Web site, or printed versions may be ordered. The ARM Ltd. documentation is available from http://www.arm.com. 1.3 Ordering Information Table 1. Ordering Information Part Order Number Package Size 289-lead MAPBGA 0.65mm, 14mm x 14mm 289-lead MAPBGA 0.65mm, 14mm x 14mm 289-lead MAPBGA 0.8mm, 17mm x 17mm 289-lead MAPBGA 0.8mm, 17mm x 17mm Package Type Lead-free Lead-free Lead-free Lead-free Operating Range 0°C–70°C -40°C–85°C 0°C–70°C -40°C–85°C Table 1 provides ordering information for the device. MC9328MX21SVK MC9328MX21SCVK MC9328MX21SVM MC9328MX21SCVM 1.4 Features The i.MX21S boasts a robust array of features that can support a wide variety of applications. Below is a brief description of i.MX21S features. • • ARM926EJ-S Core Complex Display and Video Modules — LCD Controller (LCDC) — Smart LCD Controller (SLCDC) Wireless Connectivity — Fast Infra-Red Interface (FIRI) Wired Connectivity — USB On-The-Go (USBOTG) Controller MC9328MX21S Technical Data, Rev. 1.1 Freescale Semiconductor 3 • • Signal Descriptions • • • — Three Universal Asynchronous Receiver/Transmitters (UARTx) — Two Configurable Serial Peripheral Interfaces (CSPIx) for High Speed Data Transfer — Inter-IC (I2C) Bus Module — Two Synchronous Serial Interfaces (SSI) with Inter-IC Sound (I2S) — Digital Audio Mux — One-Wire Controller — Keypad Interface Memory Expansion and I/O Card Support — Two Multimedia Card and Secure Digital (MMC/SD) Host Controller Modules Memory Interface — External Interface Module (EIM) — SDRAM Controller (SDRAMC) — NAND Flash Controller (NFC) — PCMCIA/CF Interface Standard System Resources — Clock Generation Module (CGM) and Power Control Module — Three General-Purpose 32-Bit Counters/Timers — Watchdog Timer — Real-Time Clock/Sampling Timer (RTC) — Pulse-Width Modulator (PWM) Module — Direct Memory Access Controller (DMAC) — General-Purpose I/O (GPIO) Ports — Debug Capability 2 Signal Descriptions Table 2 identifies and describes the i.MX21S signals. Pin assignment is provided in Section 4, “Pin Assignment and Package Information” and in the “Signal Multiplexing Scheme” table within the reference manual. The connections of the pins in Table 2 depends solely upon the user application, however there are a few factory test signals that are not used in a normal application. Following is a list of these signals and how they are to be terminated for proper operation of the i.MX21S processor: • CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects. • OSC26M_TEST: To ensure proper operation, leave this signal as no connect. • EXT_48M: To ensure proper operation, connect this signal to ground. • EXT_266M: To ensure proper operation, connect this signal to ground. • TEST_WB[2:0]: These signals are also multiplexed with GPIO PORT E as well as alternate keypad signals. If not utilizing these signals for GPIO functionality or for their other multiplexed function, then configure as GPIO input with pull up enabled, and leave as a no connect. • TEST_WB[4:3]: To ensure proper operation, leave these signals as no connects. MC9328MX21S Technical Data, Rev. 1.1 4 Freescale Semiconductor Signal Descriptions Table 2. i.MX21S Signal Descriptions Signal Name Function/Notes External Bus/Chip Select (EIM) A [25:0] D [31:0] EB0 EB1 EB2 EB3 OE CS [5:0] Address bus signals Data bus signals MSB Byte Strobe—Active low external enable byte signal that controls D [31:24], shared with SDRAM DQM0. Byte Strobe—Active low external enable byte signal that controls D [23:16], shared with SDRAM DQM1. Byte Strobe—Active low external enable byte signal that controls D [15:8], shared with SDRAM DQM2 and PCMCIA PC_REG. LSB Byte Strobe—Active low external enable byte signal that controls D [7:0], shared with SDRAM DQM3 and PCMCIA PC_IORD. Memory Output Enable—Active low output enables external data bus, shared with PCMCIA PC_IOWR. Chip Select—The chip select signals CS [3:2] are multiplexed with CSD [1:0] and are selected by the Function Multiplexing Control Register (FMCR) in the System Control chapter. By default CSD [1:0] is selected. DTACK is multiplexed with CS4. Active low input signal sent by flash device to the EIM whenever the flash device must terminate an ongoing burst sequence and initiate a new (long first access) burst sequence. Active low signal sent by flash device causing the external burst device to latch the starting burst address. Clock signal sent to external synchronous memories (such as burst flash) during burst mode. RW signal—Indicates whether external access is a read (high) or write (low) cycle. This signal is also shared with the PCMCIA PC_WE. DTACK signal—External input data acknowledge signal, multiplexed with CS4. Bootstrap BOOT [3:0] System Boot Mode Select—The operational system boot mode upon system reset is determined by the settings of these pins. To hardwire these inputs low, terminate with a 1 KΩ resister to ground. For a logic high, terminate with a 1 KΩ resistor to VDDA. Do not change the state of these inputs after power-up. Boot 3 should a




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