Low-Voltage CMOS Hex Buffer

www.DataSheet4U.com MC74LCX07 Low−Voltage CMOS Hex Buffer with Open Drain Outputs With 5 V−Tolerant Inputs The MC74LCX07 is a high performance hex buffer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers. These LCX devices have open drain outputs which provide the ability to set output levels, or do active−HIGH AND or active−LOW OR functions. A VI specification of 5.5 V allows MC74LCX07 inputs to be safely driven from 5.0 V devices. Features http://onsemi.com MARKING DIAGRAMS 14 14 1 SOIC−14 D SUFFIX CASE 751A 1 LCX07G AWLYWW • • • • • • Designed for 2.3 to 3.6 V VCC Operation 5.0 V Tolerant Inputs/Outputs LVTTL Compatible LVCMOS Compatible 24 mA Output Sink Capability 14 1 TSSOP−14 DT SUFFIX CASE 948G 1 14 LCX 07 ALYWG G Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements • Latchup Performance Exceeds 500 mA 14 SOEIAJ−14 M SUFFIX CASE 965 1 74LCX07 ALYWG • Wired−OR, Wired−AND • Output Level Can Be Set Externally Without Affecting Speed of Device • ESD Performance: Human Body Model >1500 V; Machine Model >200 V • Pb−Free Packages are Available* 14 1 VCC 14 A3 13 O3 12 A4 11 O4 10 A5 9 O5 8 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb−Free Package G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION 1 A0 2 O0 3 A1 4 O1 5 A2 6 O2 7 GND See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Pinout: 14−Lead (Top View) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 1 May, 2005 − Rev. 10 Publication Order Number: MC74LCX07/D MC74LCX07 A0 A1 A2 A3 A4 A5 1 3 5 13 11 9 * * * * * * * OD 2 4 6 12 10 8 O0 O1 O2 O3 PIN NAMES Pins An On Function Data Inputs Outputs TRUTH TABLE O4 O5 An L H On L Z Figure 2. Logic Diagram MAXIMUM RATINGS Symbol VCC VI VO IIK IOK Parameter DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current Value −0.5 to +7.0 −0.5 v VI v +7.0 −0.5 v VO v +7.0 −50 −50 +50 IO ICC IGND TSTG DC Output/Sink Current DC Supply Current Per Supply Pin DC Ground Current Per Ground Pin Storage Temperature Range +50 $100 $100 −65 to +150 Output in HIGH or LOW State (Note 1) VI < GND VO < GND VO > VCC Condition Unit V V V mA mA mA mA mA mA °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. ORDERING INFORMATION Device MC74LCX07D MC74LCX07DG MC74LCX07DR2 MC74LCX07DR2G MC74LCX07DT MC74LCX07DTG MC74LCX07DTR2 MC74LCX07DTR2G MC74LCX07M MC74LCX07MG MC74LCX07MEL MC74LCX07MELG Package SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* TSSOP−14* TSSOP−14* SOEIAJ−14 SOEIAJ−14 (Pb−Free) SOEIAJ−14 SOEIAJ−14 (Pb−Free) Shipping† 55 Units / Rail 55 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 96 Units / Rail 96 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 50 Units / Rail 50 Units / Rail 2000 Tape & Reel 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74LCX07 RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO IOH Supply Voltage Input Voltage Output Voltage HIGH Level Output Current (HIGH or LOW State) VCC= 3.0 V−3.6 V VCC= 2.7 V−3.0 V VCC= 2.3 V−2.7 V VCC= 3.0 V−3.6 V VCC= 2.7 V−3.0 V VCC= 2.3 V−2.7 V −40 0 Parameter Operating Data Retention Only Min 2.0 1.5 0 0 Typ 2.3 to 3.3 Max 5.5 5.5 5.5 5.5 −24 −12 −8 +24 +12 +8 +85 10 Unit V V V mA IOL LOW Level Output Current mA TA Dt/DV Operating Free−Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V °C ns/V DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol VIH Characteristic HIGH Level Input Voltage (Note 2) Condition 2.3 V v VCC v 2.7 V 2.7 V v VCC v 3.6 V VIL LOW Level Input Voltage (Note 2) 2.3 V v VCC v 2.7 V 2.7 V v VCC v 3.6 V VOL LOW Level Output Voltage 2.3 V v VCC v 3.6 V; IOL = 100 mA VCC = 2.3 V; IOL= 8 mA VCC = 2.7 V; IOL= 12 mA VCC = 3.0 V; IOL = 16 mA VCC = 3.0 V; IOL = 24 mA II IOFF ICC DICC Maximum Input Leakage Current Power−Off Leakage Current Maximum Quiescent Supply Current Increase in ICC per Input 2.3 V v VCC v 3.6 V, 0 V v VI v 5.5 V VCC = 0V, VO or VI = 5.5V 2.3 V v VCC v 3.6 V, VI= VCC or GND 2.3 V v VCC v3.6 V, 3.6 V vVI v5.5 V 2.3 V v VCC v 3.6 V 4.5 V v VCC v 5.5 V Min 1.7 2.0 0.7 0.8 0.2 0.3 0.4 0.4 0.55 $5 10 10 $10 500 1.0 mA mA mA mA mA V V Max Unit V 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS Limits TA= −405C to +855C VCC = 3.3 V $ 0.3 V CL= 50 pF Symbol tPLZ tPZL Parameter Propagation Delay Input to Output Min 0.5 0.5 Max 3.0 3.0 VCC= 2.7 V CL= 50 pF Min 0.8 0.8 Max 3.7 3.7 VCC = 2.5 V $ 0.2 V CL= 30 pF Min 0.8 0.8 Max 3.8 3.8 Unit ns ns DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol VOLP VOLV Characteristic Dynamic LOW Peak Voltage (Note 3) Dynamic LOW Valley Voltage (Note 3) Condition VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH =2.5 V, VIL = 0 V VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V Min Typ 0.9 0.7 −0.8 −0.6 Max Unit V V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. http://onsemi.com 3 MC74LCX07 CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance Parameter Condition VCC = 3.3 V, VI = 0 V or VCC VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC Typical 7 8 25 Unit pF pF pF VCC An Vmi Vmi 0V tPZL tPLZ Vmo On VLZ VOL PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1MHz; tW = 500 ns VCC Symbol Vmi Vmo VLZ 3.3 V $ 0.3 V 1.5 V 1.5 V VOL + 0.3 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V 2.5 V $ 0.2 V VCC/2 VCC/2 VOL + 015 V Figure 3. AC Waveforms VCC 6 V or VCC  2 PULSE GENERATOR RT DUT CL R1 RL GND TEST tPZL, tPLZ Open Collector/Drain tPLH and tPHL tPZH, tPHZ CL = CL = RL = RT = SWITCH 6V 6V GND 50 pF at VCC = 3.3 "0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 "0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 4 MC74LCX07 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− 14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 −B− P 7 PL 0.25 (0.010) M B M 1 7 G C R X 45 _ F −T− SEATING PLANE D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE A 14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ 0.10 (0.004) 0.15 (0.006) T U S M TU S V S N 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B −U− N F DETAIL E K K1 J J1 0.15 (0.006) T U S A −V− SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E DIM A B C D F G H J J1 K K1 L M http://onsemi.com 5 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ MC74LCX07 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CON