Low-Voltage CMOS Hex Inverter

www.DataSheet4U.com MC74LCX06 Low−Voltage CMOS Hex Inverter with Open Drain Outputs With 5 V − Tolerant Inputs http://onsemi.com The MC74LCX06 is a high performance hex inverter operating from a 2.3 V to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers. These LCX devices have open drain outputs which provide the ability to set output levels, or do active−HIGH AND or active−LOW OR functions. A VI specification of 5.5 V allows MC74LCX06 inputs to be safely driven from 5.0 V devices. Features MARKING DIAGRAMS 14 14 1 SOIC−14 D SUFFIX CASE 751A 1 14 LCX06 AWLYWW • • • • • • Designed for 2.3 V to 3.6 V VCC Operation 5.0 V Tolerant Inputs/Outputs LVTTL Compatible LVCMOS Compatible 24 mA Output Sink Capability 14 1 TSSOP−14 DT SUFFIX CASE 948G Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements • Latchup Performance Exceeds 500 mA LCX 06 ALYW • Wired−OR, Wired−AND • Output Level Can Be Set Externally Without Affecting Speed of Device • Functionally Compatible with LCX05 1 14 SOEIAJ−14 M SUFFIX CASE 965 1 1 74LCX06 ALYW • ESD Performance: Human Body Model >1500 V; Machine Model >200 V • Pb−Free Packages are Available* VCC 14 O3 12 14 A3 13 A4 11 O4 10 A5 9 O5 8 A WL, L Y WW, W = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION 1 A0 2 O0 3 A1 4 O1 5 A2 6 O2 7 GND See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Pinout: 14−Lead (Top View) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 1 January, 2005 − Rev. 7 Publication Order Number: MC74LCX06/D MC74LCX06 A0 A1 A2 A3 A4 A5 1 3 5 13 11 9 * * * * * * * OD 2 4 6 12 10 8 O0 O1 O2 O3 O4 O5 Table 1. PIN NAMES Pins An On Function Data Inputs Outputs Table 2. TRUTH TABLE An L H On Z L Figure 2. Logic Diagram MAXIMUM RATINGS Symbol VCC VI VO IIK IOK Parameter DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current Value −0.5 to +7.0 −0.5 ≤ VI ≤ +7.0 −0.5 ≤ VO ≤ +7.0 −50 −50 +50 IO ICC IGND TSTG DC Output/Sink Current DC Supply Current Per Supply Pin DC Ground Current Per Ground Pin Storage Temperature Range +50 ±100 ±100 −65 to +150 Output in HIGH or LOW State (Note 1) VI < GND VO < GND VO > VCC Condition Unit V V V mA mA mA mA mA mA °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. ORDERING INFORMATION Device MC74LCX06D MC74LCX06DG MC74LCX06DR2 MC74LCX06DR2G MC74LCX06DT MC74LCX06DTR2 MC74LCX06M MC74LCX06MEL Package SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* SOEIAJ−14 SOEIAJ−14 Shipping† 50 Units / Rail 50 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 96 Units / Rail 2500 / Tape & Reel 50 Units / Rail 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74LCX06 RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO IOL Supply Voltage Input Voltage Output Voltage LOW Level Output Current Sink Operating Free−Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V (HIGH or LOW State) VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −40 0 Parameter Operating Data Retention Only Min 2.0 1.5 0 0 Typ 2.5, 3.3 2.5, 3.3 Max 3.6 3.6 5.5 VCC +24 +12 +8 +85 10 Unit V V V mA TA Dt/DV °C ns/V DC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C) Symbol VIH Characteristic HIGH Level Input Voltage (Note 2) Condition 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.6 V VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.6 V VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC = 2.3 V; IOL= 8 mA VCC = 2.7 V; IOL= 12 mA VCC = 3.0 V; IOL = 16 mA VCC = 3.0 V; IOL = 24 mA II IOFF ICC DICC Input Leakage Current Power−Off Leakage Current Quiescent Supply Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V VCC = 0 V; VI or VO = 5.5 V 2.3 V ≤ VCC ≤ 3.6 V; VI = GND or VCC 2.3 V ≤ VCC ≤ 3.6 V; 3.6 ≤ VI ≤ 5.5 V Increase in ICC per Input 2.3 V ≤ VCC ≤ 3.6 V One Input at VIH = VCC − 0.6 V Min 1.7 2.0 0.7 0.8 0.2 0.3 0.4 0.4 0.55 ±5.0 10 10 ±10 500 mA mA mA mA mA V V Max Unit V 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C) VCC = 3.3 V ± 0.3 V CL = 50 pF Symbol tPLZ tPZL Parameter Propagation Delay Input to Output Min 0.8 0.8 Max 3.7 3.7 VCC= 2.7 V CL = 50 pF Min 1.0 1.0 Max 4.1 4.1 VCC = 2.5 V ± 0.2 V CL = 30 pF Min 0.8 0.8 Max 3.5 3.5 Unit ns ns DYNAMIC SWITCHING CHARACTERISTICS (TA = +25°C) Symbol VOLP VOLV Characteristic Dynamic LOW Peak Voltage (Note 3) Dynamic LOW Valley Voltage (Note 3) Condition VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V Min Typ 0.9 0.7 −0.8 −0.6 Max Unit V V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance Parameter Condition VCC = 3.3 V, VI = 0 V or VCC VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC Typical 7 8 25 Unit pF pF pF http://onsemi.com 3 MC74LCX06 VCC An Vmi Vmi 0V tPZL tPLZ Vmo On VLZ VOL PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Table 3. AC WAVEFORMS VCC Symbol Vmi Vmo VLZ 3.3 V $ 0.3 V 1.5 V 1.5 V VOL + 0.3 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V 2.5 V $ 0.2 V VCC / 2 VCC / 2 VOL + 0.15 V VCC 6 V or VCC × 2 PULSE GENERATOR RT DUT CL R1 RL GND Table 4. TEST CIRCUIT TEST tPZL, tPLZ Open Collector/Drain tPLH and tPHL tPZH, tPHZ SWITCH 6V 6V GND CL = 50 pF at VCC = 3.3 $ 0.3 V or equivalent (includes jig and probe capacitance) CL = 30 pF at VCC = 2.5 $ 0.2 V or equivalent (includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) http://onsemi.com 4 MC74LCX06 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− 14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 −B− P 7 PL 0.25 (0.010) M B M 1 7 G C R X 45 _ F −T− SEATING PLANE D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE O 14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 0.10 (0.004) 0.15 (0.006) T U S M TU S V S N 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B −U− N F DETAIL E K K1 J J1 0.15 (0.006) T U S A −V− SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E http://onsemi.com 5 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ MC74LCX06 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.