Low-Voltage CMOS Quad 2-Input NAND Gate

www.DataSheet4U.com MOTOROLA SEMICONDUCTOR TECHNICAL DATA Low-Voltage CMOS Quad 2-Input NAND Gate With 5V-Tolerant Inputs The MC74LCX00 is a high performance, quad 2–input NAND gate operating from a 2.7 to 3.6V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5V allows MC74LCX00 inputs to be safely driven from 5V devices. Current drive capability is 24mA at the outputs. MC74LCX00 LOW–VOLTAGE CMOS QUAD 2–INPUT NAND GATE • • • • • • Designed for 2.7 to 3.6V VCC Operation 5V Tolerant Inputs — Interface Capability With 5V TTL Logic LVTTL Compatible LVCMOS Compatible 24mA Balanced Output Sink and Source Capability 14 1 D SUFFIX PLASTIC SOIC CASE 751A–03 Near Zero Static Supply Current (10µA) Substantially Reduces System Power Requirements • Latchup Performance Exceeds 500mA • ESD Performance: Human Body Model >2000V; Machine Model >200V Pinout: 14–Lead (Top View) VCC 14 A2 13 B2 12 O2 11 A3 10 B3 9 O3 8 14 1 M SUFFIX PLASTIC SOIC EIAJ CASE 965–01 14 1 SD SUFFIX PLASTIC SSOP CASE 940A–03 14 1 A0 2 B0 3 O0 4 A1 5 B1 6 O1 7 GND 1 DT SUFFIX PLASTIC TSSOP CASE 948G–01 LOGIC DIAGRAM A0 B0 A1 B1 A2 B2 A3 B3 1 3 2 4 6 5 13 11 12 10 8 9 O3 O2 O1 O0 PIN NAMES Pins An, Bn On Function Data Inputs Outputs FUNCTION TABLE Inputs An L L H H Bn L H L H Outputs On H H H L 11/96 © Motorola, Inc. 1996 1 REV 1 MC74LCX00 ABSOLUTE MAXIMUM RATINGS* Symbol VCC VI VO IIK IOK Parameter DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current Value –0.5 to +7.0 –0.5 ≤ VI ≤ +7.0 –0.5 ≤ VO ≤ VCC + 0.5 –50 –50 +50 IO ICC IGND TSTG DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current Per Ground Pin Storage Temperature Range ±50 ±100 ±100 –65 to +150 Note 1. VI < GND VO < GND VO > VCC Condition Unit V V V mA mA mA mA mA mA °C * Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. 1. Output in HIGH or LOW State. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO IOH IOL IOH IOL TA ∆t/∆V Supply Voltage Input Voltage Output Voltage (HIGH or LOW State) Parameter Operating Data Retention Only Min 2.0 1.5 0 0 Typ 3.3 3.3 Max 3.6 3.6 5.5 VCC –24 24 –12 12 –40 0 +85 10 Unit V V V mA mA mA mA °C ns/V HIGH Level Output Current, VCC = 3.0V – 3.6V LOW Level Output Current, VCC = 3.0V – 3.6V HIGH Level Output Current, VCC = 2.7V – 3.0V LOW Level Output Current, VCC = 2.7V – 3.0V Operating Free–Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V DC ELECTRICAL CHARACTERISTICS TA = –40°C to +85°C Symbol VIH VIL VOH Characteristic HIGH Level Input Voltage (Note 2.) LOW Level Input Voltage (Note 2.) HIGH Level Output Voltage Condition 2.7V ≤ VCC ≤ 3.6V 2.7V ≤ VCC ≤ 3.6V 2.7V ≤ VCC ≤ 3.6V; IOH = –100µA VCC = 2.7V; IOH = –12mA VCC = 3.0V; IOH = –18mA VCC = 3.0V; IOH = –24mA VOL LOW Level Output Voltage 2.7V ≤ VCC ≤ 3.6V; IOL = 100µA VCC = 2.7V; IOL= 12mA VCC = 3.0V; IOL = 16mA VCC = 3.0V; IOL = 24mA 2. These values of VI are used to test DC electrical characteristics only. VCC – 0.2 2.2 2.4 2.2 0.2 0.4 0.4 0.55 V Min 2.0 0.8 Max Unit V V V MOTOROLA 2 LCX DATA BR1339 — REV 3 MC74LCX00 DC ELECTRICAL CHARACTERISTICS (continued) TA = –40°C to +85°C Symbol II ICC ∆ICC Characteristic Input Leakage Current Quiescent Supply Current Condition 2.7V ≤ VCC ≤ 3.6V; 0V ≤ VI ≤ 5.5V 2.7 ≤ VCC ≤ 3.6V; VI = GND or VCC 2.7 ≤ VCC ≤ 3.6V; 3.6 ≤ VI ≤ 5.5V Increase in ICC per Input 2.7 ≤ VCC ≤ 3.6V; VIH = VCC – 0.6V Min Max ±5.0 10 ±10 500 Unit µA µA µA µA AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500Ω) Limits TA = –40°C to +85°C VCC = 3.0V to 3.6V Symbol tPLH tPHL Parameter Propagation Delay Input to Output Waveform 1 Min 1.5 1.5 Max 5.2 5.2 VCC = 2.7V Max 6.0 6.0 Unit ns tOSHL Output–to–Output Skew 1.0 ns tOSLH (Note 3.) 1.0 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol VOLP Characteristic Dynamic LOW Peak Voltage (Note 4.) Condition VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V Min Typ 0.8 Max Unit V VOLV Dynamic LOW Valley Voltage (Note 4.) VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V 0.8 V 4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Parameter Input Capacitance Output Capacitance Power Dissipation Capacitance Condition VCC = 3.3V, VI = 0V or VCC VCC = 3.3V, VI = 0V or VCC 10MHz, VCC = 3.3V, VI = 0V or VCC Typical 7 8 25 Unit pF pF pF LCX DATA BR1339 — REV 3 3 MOTOROLA MC74LCX00 2.7V An, Bn 1.5V 1.5V 0V tPHL On 1.5V tPLH VOH 1.5V VOL PROPAGATION DELAYS tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 1. AC Waveforms VCC PULSE GENERATOR RT DUT CL RL CL = 50pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) Figure 2. Test Circuit MOTOROLA 4 LCX DATA BR1339 — REV 3 MC74LCX00 OUTLINE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F –A – 14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –B – 1 7 P7 PL 0.25 (0.010) M B M G C R X 45° F SEATING PLANE D 14 PL K M M B S J 0.25 (0.010) T A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7° 0° 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 7° 0° 0.228 0.244 0.010 0.019 M SUFFIX PLASTIC SOIC EIAJ PACKAGE CASE 965–01 ISSUE O NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.056 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P c b 0.13 (0.005) M A1 0.10 (0.004) LCX DATA BR1339 — REV 3 5 MOTOROLA MC74LCX00 OUTLINE DIMENSIONS SD SUFFIX PLASTIC SSOP PACKAGE CASE 940A–03 ISSUE B 14X K REF 0.12 (0.005) M T U S V S 0.25 (0.010) N L/2 L PIN 1 IDENT 1 14 8 M B 7 N F DETAIL E 0.20 (0.008) M T U S J 0.076 (0.003) –T– SEATING PLANE C D G H DETAIL E DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948G–01 ISSUE O 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M T U S V S N 2X L/2 14 8 L PIN 1 IDENT. 1 7 B –U– N F DETAIL E K K1 J J1 0.15 (0.006) T U S A –V– SECTION N–N –W– C 0.10 (0.004) –T– SEATING PLANE D G H DETAIL E MOTOROLA 6 ÉÉÉÉ ÇÇÇÇ ÉÉÉÉ ÇÇÇÇ K1 SECTION N–N M A –V– –U– K J1 NOTES: 6 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 9 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 10 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION. 11 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 12 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.07 6.33 5.20 5.38 1.73 1.99 0.05 0.21 0.63 0.95 0.65 BSC 1.08 1.22 0.09 0.20 0.09 0.16 0.25 0.38 0.25 0.33 7.65 7.90 0_ 8_ INCHES MIN MAX 0.238 0.249 0.205 0.212 0.068 0.078 0.002 0.008 0.024 0.037 0.026 BSC 0.042 0.048 0.003 0.008 0.003 0.006 0.010 0.015 0.010 0.013 0.301 0.311 0_ 8 _ –W– 0.25 (0.010) NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCE