QUAD 2-INPUT OR GATE

www.DataSheet4U.com MC74AC32, MC74ACT32 Quad 2−Input OR Gate Features • Outputs Source/Sink 24 mA • ′ACT32 Has TTL Compatible Inputs • Pb−Free Packages are Available* MAXIMUM RATINGS Rating DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Symbol VCC Vin Vout Iin Iout ICC Tstg Value −0.5 to +7.0 −0.5 to VCC +0.5 −0.5 to VCC +0.5 ±20 ±50 ±50 −65 to +150 Unit V V V mA mA mA °C 14 1 14 1 http://onsemi.com PDIP−14 N SUFFIX CASE 646 SOIC−14 D SUFFIX CASE 751A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 14 1 TSSOP−14 DT SUFFIX CASE 948G VCC 14 13 12 11 10 9 8 14 1 SOEIAJ−14 M SUFFIX CASE 965 1 2 3 4 5 6 7 GND DEVICE MARKING INFORMATION See specific marking information in the device marking section on page 5 of this data sheet. Figure 1. Pinout: 14−Lead Packages Conductors (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 7 1 Publication Order Number: MC74AC32/D MC74AC32, MC74ACT32 RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout tr, tf Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current − High Output Current − Low VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V VCC @ 4.5 V VCC @ 5.5 V Parameter ′AC ′ACT Min 2.0 4.5 0 − − − − − − −40 − − Typ 5.0 5.0 − 150 40 25 10 8.0 − 25 − − Max 6.0 5.5 VCC − − − − − 140 85 −24 24 ns/V °C °C mA mA ns/V Unit V V tr, tf TJ TA IOH IOL 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS 74AC Symbol Parameter VCC (V) TA = +25°C Typ VIH Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 VOL Maximum Low Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 IIN IOLD IOHD ICC Maximum Input Leakage Current †Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 5.5 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.49 5.49 − − − 0.002 0.001 0.001 − − − − − − − 74AC TA = −40°C to +85°C Unit Conditions Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 ±0.1 − − 4.0 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 ±1.0 75 −75 40 V VOUT = 0.1 V or VCC − 0.1 V VOUT = 0.1 V or VCC − 0.1 V IOUT = −50 mA VIL V VOH V V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND mA mA mA mA *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 2 MC74AC32, MC74ACT32 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74AC Symbol Parameter VCC* (V) Min tPLH tPHL Propagation Delay Propagation Delay 3.3 5.0 3.3 5.0 1.5 1.5 1.5 1.5 TA = +25°C CL = 50 pF Typ 7.0 5.5 7.0 5.0 Max 9.0 7.5 8.5 7.0 74AC TA = −40°C to +85°C CL = 50 pF Min 1.5 1.0 1.0 1.0 Max 10.0 8.5 9.0 7.5 ns ns 3−5 3−5 Unit Fig. No. *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS 74ACT Symbol Parameter VCC (V) TA = +25°C Typ VIH VIL VOH Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 VOL Maximum Low Level Output Voltage 4.5 5.5 4.5 5.5 IIN DICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max. ICC/Input †Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 5.5 5.5 1.5 1.5 1.5 1.5 4.49 5.49 − − 0.001 0.001 − − − 0.6 − − − 74ACT TA = −40°C to +85°C Unit Conditions Guaranteed Limits 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 ±0.1 − − − 4.0 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 ±1.0 1.5 75 −75 40 V V V VOUT = 0.1 V or VCC − 0.1 V VOUT = 0.1 V or VCC − 0.1 V IOUT = −50 mA *VIN = VIL or VIH −24 mA IOH −24 mA IOUT = 50 mA *VIN = VIL or VIH 24 mA IOL 24 mA VI = VCC, GND VI = VCC − 2.1 V VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND V V V mA mA mA mA mA *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 3 MC74AC32, MC74ACT32 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74ACT Symbol Parameter VCC* (V) Min tPLH tPHL Propagation Delay Propagation Delay 5.0 5.0 1.0 1.0 TA = +25°C CL = 50 pF Typ − − Max 9.0 9.0 74ACT TA = −40°C to +85°C CL = 50 pF Min 1.0 1.0 Max 10.0 10.0 ns ns 3−6 3−6 Unit Fig. No. *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 20 Unit pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V http://onsemi.com 4 MC74AC32, MC74ACT32 MARKING DIAGRAMS PDIP−14 14 MC74AC32N AWLYYWWG 1 1 14 AC32G AWLYWW 1 SOIC−14 TSSOP−14 14 14 AC 32 ALYWG G 1 14 14 MC74ACT32N AWLYYWWG 1 1 14 AC32TG AWLYWW 1 14 ACT 32 ALYWG G 1 74ACT32 ALYWG 74AC32 ALYWG SOEIAJ−14 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb−Free Package G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device MC74AC32N MC74AC32NG MC74ACT32N MC74ACT32NG MC74AC32D MC74AC32DG MC74AC32DR2 MC74AC32DR2G MC74ACT32D MC74ACT32DG MC74ACT32DR2 MC74ACT32DR2G MC74AC32DTR2 MC74AC32DTR2G MC74ACT32DTR2 MC74ACT32DTR2G MC74AC32MEL MC74AC32MELG MC74ACT32MEL MC74ACT32MELG Package PDIP−14 PDIP−14 (Pb−Free) PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* TSSOP−14* TSSOP−14* SOEIAJ−14 SOEIAJ−14 (Pb−Free) SOEIAJ−14 SOEIAJ−14 (Pb−Free) 2500 Units / Reel 55 Units / Rail 2500 Units / Reel 55 Units / Rail Shipping† 25 Units / Rail 2000 Units / Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 5 MC74AC32, MC74ACT32 PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 A F N −T− SEATING PLANE L C H G D 14 PL K M J M DIM A B C D F G H J K L M N 0.13 (0.005) http://onsemi.com 6 MC74AC32, MC74ACT32 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C −T− SEATING PLANE R X 45 _ F D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 0.58 14X 14X 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MC74AC32, MC74ACT32 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V N S 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B −U− N F DETAIL E K 0.15 (0.006) T U S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL I