5-V DUAL RS-232 LINE DRIVER/RECEIVER

Part  Number MAX222
Manufacturer Texas Instruments
Semiconductor DataSheet

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MAX222 5 V DUAL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 D ESD Protection for RS-232 Bus Pins D D D D D D D − ±15-kV Human-Body Model Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Operates Up To 200 kbit/s Low Supply Current in Shutdown Mode . . . 2 µA Typical External Capacitors . . . 4 × 0.1 µF Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment DW OR N PACKAGE (TOP VIEW) NC C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 SHDN VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 description/ordering information The MAX222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). This device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. This device operates at data signaling rates up to 200 kbit/s and a maximum of 30-V/µs driver output slew rate. By using SHDN, all receivers can be disabled. ORDERING INFORMATION TA PACKAGE† PDIP (N) 0 C 70°C 0°C to 70 C SOIC (DW) PDIP (N) −40 C 85 C −40°C to 85°C SOIC (DW) Tube of 20 Tube of 20 Reel of 1000 Tube of 20 Tube of 20 Reel of 1000 ORDERABLE PART NUMBER MAX222CN MAX222CDW MAX222CDWR MAX222IN MAX222IDW MAX222IDWR MAX222C MAX222IN MAX222I TOP-SIDE MARKING MAX222CN † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  2004, Texas Instruments Incorporated POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 MAX222 5 V DUAL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION Function Tables EACH DRIVER INPUT DIN L H OUTPUT DOUT H L H = high level, L = low level EACH RECEIVER INPUT RIN L H Open OUTPUT ROUT H L H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) 12 DIN1 TTC/CMOS Inputs DIN2 13 ROUT1 TTC/CMOS Outputs ROUT2 18 SHDN 10 9 RIN2 14 RIN1 RS-232 Inputs 11 8 DOUT2 15 DOUT1 RS-232 Outputs 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX222 5 V DUAL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC − 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Short-circuit duration, DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Package thermal impedance, θJA (see Notes 2 and 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4 and Figure 4) MIN VCC VIH VIL VI TA Supply voltage Driver high-level input voltage Shutdown high-level input voltage Driver low-level input voltage Shutdown low-level input voltage Driver input voltage Receiver input voltage MAX222C Operating free-air temperature MAX222I NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. DIN SHDN DIN SHDN DIN 0 −30 0 −40 4.5 2 2 0.8 0.8 5.5 30 70 85 V °C NOM 5 MAX 5.5 UNIT V V V V V electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER ICC Supply current Shutdown supply current SHDN Shutdown input leakage current VCC = 5 V TEST CONDITIONS No load SHDN = VCC 3 kW on both inputs MIN TYP 4 15 2 50 ±1 MAX 10 mA µA µA UNIT NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 MAX222 5 V DUAL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL IIH IIL IOS‡ Ioff ro High-level output voltage Low-level output voltage Driver high-level input current Control high-level input current Driver low-level input current Control low-level input current Short-circuit output current Output leakage current Output resistance TEST CONDITIONS DOUT at RL = 3 kΩ to GND, DOUT at RL = 3 kΩ to GND, DIN = VCC SHDN = VCC DIN = 0 V SHDN = 0 V VCC = 5.5 V, VCC = 5.5 V, SHDN = GND, VCC, V+, and V− = 0 V, VO = 0 V VO = ±10 V VO = ±2 V ±7 DIN = GND DIN = VCC MIN 5 −5 TYP† 8 −8 5 0.01 −5 −0.01 ±22 ±0.01 300 10 M ±10 40 1 −40 −1 MAX UNIT V V µA A µA A mA µA W † All typical values are at VCC = 5 V, and TA = 25°C. ‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER Data rate tPLH (D) tPHL (D) tPHL (D) − tPLH (D) tsk(p) SR(tr) tET tDT Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Driver (+ to −) propagation delay difference Pulse skew§ Slew rate, transition region (see Figure 1) Driver output enable time (after SHDN goes high) Driver output disable time (after SHDN goes low) CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ, VCC = 5 V RL = 3 kΩ to 7 kΩ, See Figure 2 CL = 50 pF to 2500 pF 6 TEST CONDITIONS CL = 1000 pF, One DOUT switching, See Figure 1 See Figure 1 RL = 3 kΩ, See Figure 1 MIN 200 1.5 1.3 300 300 12 250 300 30 3.5 3.5 TYP† MAX UNIT kbit/s µs µs ns ns V/µs µs ns † All typical values are at VCC = 5 V and TA = 25°C. § Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX222 5 V DUAL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION SLLS590D − SEPTEMBER 2003 − REVISED AUGUST 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL VIT+ VIT− Vhys ri High-level output voltage Low-level output voltage Positive-going input threshold voltage Negative-going input threshold voltage Input hysteresis (VIT+ − VIT−) Input resistance VI = ±3 V to ±25 V TEST CONDITIONS IOH = −1 mA IOL = 3.2 mA VCC = 5 V VCC = 5 V MIN 3.5 TYP† VCC − 0.2 V 0.4 1.7 0.8 0.2 3 1.3 0.5 5 1 7 2.4 MAX UNIT V V V V V kW † All typical values are at VCC = 5 V, and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 3) PARAMETER tPLH (R) tPHL (R) tPHL (R) − tPLH (R) tsk(p) Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Receiver (+ to −) propagation delay difference Pulse skew‡ TEST CONDITIONS CL= 150 pF CL= 150 pF MIN TYP† 0.6 0.5 100 100 MAX 1 1 UNIT µs µs ns ns † All typical values are at VCC = 5 V




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