Stand-alone am Receiver ic

www.DataSheet4U.com DA9178.000 22 Apr, 2003 MAS9178 AM Receiver IC • • • • • • • DESCRIPTION The MAS9178 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz. Only a few external components are required for time signal receiver. The circuit has preamplifier, wide range automatic gain control, demodulator and output comparator built in. The output signal can be processed directly by an additional digital circuitry to extract the data from the received signal. The control for AGC (automatic gain control) can be used to switch AGC on or off if necessary. Unlike MAS1016A and MAS1016B, MAS9178 does not require AGC control procedure in WWVB and JJY systems. MAS9178A1 has differential input and internal 0.875 pF compensation capacitor for crystal shunt capacitance compensation. MAS9178A5 requires external compensation capacitor for crystal shunt capacitance compensation. It can be used with crystals that do not match with fixed 0.875 pF compensation capacitance of MAS9178A1. High Sensitivity Very Low Power Consumption Wide Supply Voltage Range Power Down Control Control for AGC On High Selectivity by Crystal Filter Fast Startup Feature FEATURES • • • • • • • • • Highly Sensitive AM Receiver, 0.4 µVRMS typ. Wide Supply Voltage Range from 1.1 V to 3.6 V Very Low Power Consumption Power Down Control Fast Startup Only a Few External Components Necessary Control for AGC On Wide Frequency Range from 40 kHz to 100 kHz High Selectivity by Quartz Crystal Filter APPLICATIONS • • Time Signal Receiver WWVB (USA), JJY (Japan), DCF77 (Germany) and MSF (UK) Receiver for ASK Modulated Data Signals BLOCK DIAGRAM QOP RFP AGC Amplifier RFM Demodulator & Comparator OUT QI QOM AON Power Supply/Biasing VDD VSS PDN AGC DEC 1 (8) www.DataSheet4U.com DA9178.000 22 Apr, 2003 PAD LAYOUT 1906 µm VSS RFM RFP PDN AON DEC 9178 A1 1778 µm VDD QOP QI QOM AGC OUT DIE size = 1.91 x 1.78 mm; PAD size = 100 x 100 µm except for VSS PAD size 104 x 112 µm Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in the center of VDD pad Pad Identification Power Supply Voltage Quartz Filter Output for Crystal Quartz Filter Input for Crystal and External Compensation Capacitor Quartz Filter Output for External Compensation Capacitor AGC Capacitor Receiver Output Demodulator Capacitor AGC On Control Power Down Input Positive Receiver Input Negative Receiver Input Power Supply Ground Name VDD QOP QI QOM AGC OUT DEC AON PDN RFP RFM VSS X-coordinate 0 µm 306 µm 549 µm 866 µm 1146 µm 1389 µm 1389 µm 1146 µm 829 µm 586 µm 269 µm 16 µm Y-coordinate 0 µm 19 µm 19 µm 19 µm 19 µm 19 µm 1428 µm 1428 µm 1428 µm 1428 µm 1428 µm 1407 µm Note 1 2 3 Notes: 1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 µA - at power down the output is pulled to VSS (pull down switch) 2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 3) PDN = VSS means receiver on; PDN = VDD means receiver off - Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up (PDN=VSS) i.e. at the falling edge of PDN signal. 2 (8) www.DataSheet4U.com DA9178.000 22 Apr, 2003 ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD-VSS VIN PMAX TOP TST Conditions Min -0.3 VSS-0.3 -20 -40 Max 5.0 VDD+0.3 100 70 120 Unit V V mW o C o C ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 1.4V, Temperature = 25°C Parameter Operating Voltage Current Consumption Stand-By Current Input Frequency Range Minimum Input Voltage Maximum Input Voltage Input Levels |lIN|<0.5 µA Output Current VOL<0.2 VDD;VOH >0.8 VDD Output Pulse Symbol VDD IDD IDDoff fIN VIN min VIN max VIL VIH |IOUT| T100ms T200ms T500ms T800ms Conditions VDD=3.6 V, Vin=0 µV VDD=1.4 V, Vin=0 µV Min 1.10 56 Typ 76 66 Max 3.60 95 0.1 100 1 0.2 VDD Unit V µA µA kHz µVrms mVrms V µA 40 0.4 20 0.8 VDD 5 1 µVrms ≤ VIN ≤ 20 mVrms 1 µVrms ≤ VIN ≤ 20 mVrms 1 µVrms ≤ VIN ≤ 20 mVrms 1 µVrms ≤ VIN ≤ 20 mVrms Fast Start-up Without Fast Start-up 50 150 400 700 500 800 12 3 50 140 230 600 900 ms ms ms ms s min ms Startup Time Output Delay Time TStart TDelay 100 3 (8) www.DataSheet4U.com DA9178.000 22 Apr, 2003 TYPICAL APPLICATION Note 1 Note 4 Optional Control for AGC on/hold QI QOM AON Demodulator & Comparator OUT Receiver Output QOP RFP Ferrite Antenna AGC Amplifier RFM Power Supply/Biasing VDD 1.4 V VSS PDN AGC CAGC + 10 µF DEC CDEC 47 nF Figure 1 Note 2 Note 3 Power Down / Fast Startup Control Application circuit of internal compensation capacitance version MAS9178A1. Note 1 CC_EXT=C0 Note 4 Optional Control for AGC on/hold AON Demodulator & Comparator OUT Receiver Output QOP RFP Ferrite Antenna QI QOM AGC Amplifier RFM Power Supply/Biasing VDD 1.4 V VSS PDN AGC CAGC + 10 µF DEC CDEC 47 nF Figure 2 Note 3 Note 2 Power Down / Fast Startup Control Application circuit of external compensation capacitance version MAS9178A5. 4 (8) www.DataSheet4U.com DA9178.000 22 Apr, 2003 TYPICAL APPLICATION (Continued) Note 1 Note 4 Optional Control for AGC on/hold QI QOM AON Demodulator & Comparator OUT Receiver Output QOP RFP Ferrite Antenna AGC Amplifier RFM Power Supply/Biasing VDD 1.4 V VSS PDN AGC CAGC + 10 µF DEC CDEC 47 nF Figure 3 Note 3 Note 2 Power Down / Fast Startup Control Dual band application circuit of external compensation capacitance version MAS9178A5. Note 1: Crystal The crystal as well as ferrite antenna frequencies are chosen according to the time-signal system (Table 1). The crystal shunt capacitance C0 should be matched as well as possible with the internal shunt capacitance compensation capacitor CC=0.875 pF of MAS9178A1. External compensation pad QOM is unconnected in MAS9178A1. MAS9178A5 does not have internal compensation capacitance CC and it requires use of external compensation capacitor CC_EXT. It must be connected between pins QOM and QI (see figure 2). CC_EXT should have equal value with crystal’s effective shunt capacitance C0. External compensation version MAS9178A5 should be used when fixed 0.875 pF compensation capacitance of MAS9178A1 does not match well with used crystal’s shunt capacitance. It should be noted that grounded crystal package has reduced shunt capacitance. This value is about 85% of floating crystal shunt capacitance. PCB traces of crystal and external compensation capacitance should be kept at minimum to minimize additional parasitic capacitance which can cause capacitance mismatching. In dual band receiver the crystals can be connected in parallel thus external compensation capacitor value CC_EXT must be sum of two crystals’ shunt capacitances. In dual band receiver it is also possible to connect other crystal from QOP pin and the other crystal from QOM pin to common QI pin (figure 3). In this circuit configuration no external compensation capacitor is required since the crystals compensate each other. Time-Signal System DCF77 MSF WWVB JJY Table 1 Location Antenna Frequency Recommended Crystal Frequency 77.503 kHz 60.003 kHz 60.003 kHz 40.003 kHz and 60.003 kHz Germany 77.5 kHz United Kingdom 60 kHz USA 60 kHz Japan 40 kHz and 60 kHz Time-Signal System Frequencies Note 2: AGC Capacitor The AGC and DEC capacitors must have low leakage currents due to very small 40 nA signal currents through the capacitors. The insulation resistance of these capacitors should be higher than 70 MΩ. Also probes with at least 100 MΩ==impedance should be used for voltage probing of AGC and DEC pins. Electrolyte capacitors cannot be used due to their large leakage current. Instead low leakage tantalum capacitor can be used as AGC capacitor. DEC capacitor can be low leakage chip capacitor. 5 (8) www.DataSheet4U.com DA9178.000 22 Apr, 2003 TYPICAL APPLICATION (Continued) Note 3: Power Down / Fast Startup Control Both power down and fast startup are controlled using the PDN pin. The device is in power down (turned off) if PDN = VDD and in power up (turned on) if PDN = VSS. Fast startup is triggered by the falling edge of PDN signal, i.e., controlling device from power down to power up. The startup time without using the fast startup control can be several minutes but with fast startup it is shortened typically to 12 s. Note 4: Optional Control for AGC On/Hold AON control pin has internal pull up which turns AGC circuit on all the time if AON pin is left unconnected. Optionally AON control can be used to hold and release AGC circuit. Stepper motor drive etc. can produce disturbing amount of noise which can shift the input amplifier gain to unoptimal level. This can be avoided by controlling AGC hold (AON=VSS) during stepper motor drive periods and releasing AGC (AON=VDD) when motors are not driven. 6 (8) www.DataSheet4U.com DA9178.000 22 Apr, 2003 SAMPLES IN SBDIL 20 PACKAGE VDD 1 NC 2 QOP 3 NC 4 QI 5 NC 6 QOM 7 NC 8 AGC 9 NC 10 9178Ax YYWW XXXXX.X 20 VSS 19 NC 18 RFM 17 RFP 16 NC 15 PDN 14 AON 13 DEC 12 NC 11 OUT Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number x =1, 5 Sample Version Number PIN DESCRIPTION Pin Name VDD NC QOP NC QI NC QOM NC AGC NC OUT NC DEC AON PDN NC RFP RFM NC VSS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Type P AO AI Function Positive Power Supply Quartz Filter Output for Crystal 1 Quartz Filter Input for Crystal and