Description
RO-P-DS-3053 - - 6-Bit Digital Phase Shifter 7.0-12.0 GHz Preliminary Information MAPCGM0005-DIE Features ♦ ♦ ♦ ♦ ♦ 7.0-12.0 GHz GaAs MMIC Phase Shifter 6 Bit Digital Phase Shifter 7.0-12.0 GHz Operation 360º Coverage, LSB = 5.6º TTL Control Inputs Self-Aligned MSAG® MESFET Process Primary Applications ♦ Satellite Communication ♦ Military and Weather Radar Description The MAPCGM0005-Die is a 6-bit Phase Shifter with Parallel TTL Input Control. This product is fully matched to 50 ohms on both the input and output. The part has 360º of phase coverage with LSB of 5.6º. Each device is 100% RF tested on wafer to ensure performance compliance. The part is fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG®) MESFET Process. www.DataSheet4U.com Electrical Characteristics: T B = 40°C1, Z0 = 50Ω, VEE = -5V Parameter Bandwidth Insertion Loss Input VSWR, All States Output VSWR, All States RMS Phase Error RMS Phase Error, Calibrated Peak to Peak Gain Variation, All States Digital Driver Current Input Third Order Intercept Input 1-dB Compression Point Symbol f IL VSWR VSWR Typical 7.0-12.0 10 2.5:1 1.8:1 6 3 3 < 10 35 23 º º dB mA dBm dBm Units GHz dB φRMS φRMS ∆Gn IEE ITOI P1dB 1. TB = MMIC Base Temperature RO-P-DS-3053 - - 2/7 6-Bit Digital Phase Shifter Maximum Operating Conditions 1 Parameter Input Power Digital Driver Voltage Junction Temperature Storage Temperature Symbol PIN VEE TJ TSTG Absolute Maximum 30 -6.0 180 -55 to +150 MAPCGM0005-DIE Units dBm V °C °C 1. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may result in performance outside the guaranteed limits. Recommended Operating Conditions Characteristic Digital Driver Voltage Control Voltage Logic High Logic Low Symbol VEE V control pads 3 0 5 0 5 0.4 V V Min -5.2 Typ -5 Max -4.8 Unit V Operating Instructions This device is static and light sensitive. The digital circuitry operation can be impaired under high intensity light, e.g. microscope light. Please handle with care. To operate the device, follow these steps. 1. Power Up: Apply VEE = -5 V. 2. Apply Logic Voltages to control Circuits as listed in Recommended Operating Conditions 3. Power Down: Set VEE = 0 Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3053 - - 3/7 6-Bit Digital Phase Shifter 20 Insertion Loss Input VSWR 16 Output VSWR MAPCGM0005-DIE 6 5 Insertion Loss (dB) 12 4 8 3 4 2 0 7 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 1 Frequency (GHz) Figure 1. Reference State Insertion Loss, Input and Output VSWR vs. Frequency 20 15 10 5 0 -5 Average Error -10 -15 -20 7 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 RMS Error RMS Error, Calibrated Phase Shifter Error (°) Frequency (GHz) Figure 2. Phase Shifter Figures of Merit: Average Error vs Reference State, RMS Error and Calibrated RMS Error over All States Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. VSWR RO-P-DS-3053 - - 4/7 6-Bit Digital Phase Shifter 0 -40 -80 MAPCGM0005-DIE Relative Phase Shift (º) -120 -160 -200 -240 -280 -320 -360 -400 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Frequency (GHz) Figure 3. Relative Phase Shift vs Phase Shifter State 10 8 6 Gain Variation (dB) 4 2 0 -2 -4 -6 -8 -10 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Frequency (GHz) Figure 4. Relative Gain Change vs Phase Shifter State Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3053 - - 5/7 6-Bit Digital Phase Shifter 6 MAPCGM0005-DIE 5 Input VSWR 4 3 2 1 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Frequency (GHz) Figure 5. Input VSWR vs Phase Shifter State 6 5 Output VSWR 4 3 2 1 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Frequency (GHz) Figure 6. Output VSWR vs Phase Shifter State Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3053 - - 6/7 6-Bit Digital Phase Shifter MAPCGM0005-DIE Mechanical Information Chip Size: 2.923 x 2.054 x 0.075 mm 0.140mm. (115 x 81 x 3 mils) 0.773mm. 0.973mm. 2.787mm. 2.923mm. 1.173mm. 1.773mm. 1.373mm. 1.573mm. 1.973mm. 2.054mm. P5P6 VEE P180 P45 P22 P90 P11 G: DNG G : DNG 2.054mm. GND: G GND: G 1.914mm. GND: G GND: G GND: G GND: G GND: G 1.242mm. =20 W = 8 10 8 S = d i d i S = W = 8 10 8 = 2 0 W=8 S= 8 d=25 i GND: G W=12 S= 8 d=50 i W = 12 S =14 d = 50 i GND: G 12 = W =8 50 S = d i 6 =1 W = 10 08 S =1 d i GND: G GND: G GND: G GND: G 0 0 Figure 7. Die Layout Bond Pad Dimensions Pad G N : DG ND G G : Size (μ m) d i S = W = 850 = 12 GND: G GND: G RF (2) Digital Driver Voltage VEE (1) TTL Control (6) 100 x 200 125 x 125 125 x 125 Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. G : DNG i d = 50 S =14 W = 12 i d S = W = 108 =1610 GND: G G: DNG GND: G GNDG : G : DNG G: DNG GND: G i d S = W = 825 = 8 i d= S= 2 5 W = 88 8 = W =8 25 S = d i =8 W=8 S 25 d= i GND: G OUT 1.242mm. IN Size (mils) 4x8 5x5 5x5 RO-P-DS-3053 - - 7/7 6-Bit Digital Phase Shifter MAPCGM0005-DIE VDD 0.1 μF 100 pF CONTROL INPUTS P5P6 VEE P180 P22 P45 P90 P11 GND: G G ND: G 0 =28 8 W S ==10 d i d i W S= =10 =8 8 20 W= 8 S= 8 d =2 5 i W =1 2 S =1 4 d= 50 i W =1 2 S= 8 d =5 0 i GND: G 16 = W = 1008 S =1 d i GND: G G ND: G G ND: G GND: G Figure 8. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization. Assembly Instructions: Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Follow the manufacturer’s instructions. If solder is employed , use AuSn (80/20) 1-2 mil preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over ball bonds. Biasing Note: Must apply negative bias to VEE before applying positive bias to Control Pads. Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. GN G D: GN : G D d i WS == 50 = 8 12 12 = 8 W = 50 S d =i GND: G GND: G G : DNG RFIN GND: G G ND: G G : D NG G : D NG G: DNG G: DNG G: DNG GND: G GND: G GND: G GND: G i d =5 0 S =1 4 W =1 2 d i WS == 10 = 10 8 16 GND : G RFOUT GND: G Sd i W = = 25 =88 8 = 85 W == 2 Sd i GND: G d i S =2 W= 85 = 8 =8 W =85 S =2 d i OUT IN GND: G GND: G

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MAPCGM0005-DIE

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