(MAC97 Series) Sensitive Gate Triacs Silicon Bidirectional Thyristors

www.DataSheet4U.com MAC97 Series Preferred Device Sensitive Gate Triacs Silicon Bidirectional Thyristors Designed for use in solid state relays, MPU interface, TTL logic and any other light industrial or consumer application. Supplied in an inexpensive TO−92 package which is readily adaptable for use in automatic insertion equipment. Features http://onsemi.com • One−Piece, Injection−Molded Package • Blocking Voltage to 600 Volts • Sensitive Gate Triggering in Four Trigger Modes (Quadrants) for all possible Combinations of Trigger Sources, and especially for Circuits that Source Gate Drives • All Diffused and Glassivated Junctions for Maximum Uniformity of Parameters and Reliability • Pb−Free Packages are Available* MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Peak Repetitive Off-State Voltage (TJ = −40 to +110°C) (Note 1) Sine Wave 50 to 60 Hz, Gate Open MAC97A4 MAC97A6 MAC97A8 On-State RMS Current Full Cycle Sine Wave 50 to 60 Hz (TC = +50°C) Peak Non−Repetitive Surge Current One Full Cycle, Sine Wave 60 Hz (TC = 110°C) Circuit Fusing Considerations (t = 8.3 ms) Peak Gate Voltage (t v 2.0 ms, TC = +80°C) Peak Gate Power (t v 2.0 ms, TC = +80°C) Average Gate Power (TC = 80°C, t v 8.3 ms) Peak Gate Current (t v 2.0 ms, TC = +80°C) Operating Junction Temperature Range Storage Temperature Range Symbol VDRM, VRRM 200 400 600 IT(RMS) 0.6 A 1 ITSM 8.0 A 2 Value Unit V TRIACS 0.8 AMPERE RMS 200 thru 600 VOLTS MT2 G MT1 MARKING DIAGRAMS TO−92 (TO−226AA) CASE 029 STYLE 12 3 MAC 97Ax AYWWG G I2t VGM PGM PG(AV) IGM TJ Tstg 0.26 5.0 5.0 0.1 1.0 −40 to +110 −40 to +150 A2s V W W A °C °C MAC97Ax = Device Code x = 4, 6, or 8 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT 1 2 3 Main Terminal 1 Gate Main Terminal 2 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Preferred devices are recommended choices for future use and best overall value. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 1 September, 2005 − Rev. 9 Publication Order Number: MAC97/D MAC97 Series THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient Maximum Lead Temperature for Soldering Purposes for 10 Seconds Symbol RqJC RqJA TL Max 75 200 260 Unit °C/W °C/W °C ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted; Electricals apply in both directions) Characteristic OFF CHARACTERISTICS Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) ON CHARACTERISTICS Peak On−State Voltage (ITM = ".85 A Peak; Pulse Width v 2.0 ms, Duty Cycle v 2.0%) Gate Trigger Current (Continuous dc) (VD = 12 Vdc, RL = 100 W) MT2(+), G(+) MT2(+), G(−) MT2(−), G(−) MT2(−), G(+) Gate Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 100 W) MT2(+), G(+) All Types MT2(+), G(−) All Types MT2(−), G(−) All Types MT2(−), G(+) All Types Gate Non−Trigger Voltage (VD = 12 V, RL = 100 W, TJ = 110°C) All Four Quadrants Holding Current (VD = 12 Vdc, Initiating Current = 200 mA, Gate Open) Turn-On Time (VD = Rated VDRM, ITM = 1.0 A pk, IG = 25 mA) DYNAMIC CHARACTERISTICS Critical Rate−of−Rise of Commutation Voltage (VD = Rated VDRM, ITM = .84 A, Commutating di/dt = .3 A/ms, Gate Unenergized, TC = 50°C) Critical Rate of Rise of Off−State Voltage (VD = Rated VDRM, TC = 110°C, Gate Open, Exponential Waveform dV/dt(c) − 5.0 − V/ms VTM IGT − − − − VGT − − − − VGD 0.1 .66 .77 .84 .88 − 2.0 2.0 2.0 2.5 − V − − − − 5.0 5.0 5.0 7.0 V − − 1.9 V mA IDRM, IRRM TJ = 25°C TJ = +110°C − − − − 10 100 mA mA Symbol Min Typ Max Unit IH tgt − − 1.5 2.0 10 − mA ms dv/dt − 25 − V/ms http://onsemi.com 2 MAC97 Series Voltage Current Characteristic of Triacs (Bidirectional Device) + Current Quadrant 1 MainTerminal 2 + Symbol VDRM IDRM VRRM IRRM VTM IH Parameter Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage Holding Current Quadrant 3 MainTerminal 2 − IH VTM IRRM at VRRM on state IH VTM off state + Voltage IDRM at VDRM Quadrant Definitions for a Triac MT2 POSITIVE (Positive Half Cycle) + (+) MT2 (+) MT2 Quadrant II (−) IGT GATE MT1 REF (+) IGT GATE MT1 REF Quadrant I IGT − (−) MT2 (−) MT2 + IGT Quadrant III (−) IGT GATE MT1 REF (+) IGT GATE MT1 REF Quadrant IV − MT2 NEGATIVE (Negative Half Cycle) All polarities are referenced to MT1. With in−phase signals (using standard AC lines) quadrants I and III are used. http://onsemi.com 3 MAC97 Series TC, MAXIMUM ALLOWABLE CASE TEMPERATURE (° C) 110 I T(RMS) , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (° C) T = 30° 60° DC 180° 70 60 50 40 30 0 a a = CONDUCTION ANGLE 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 a 120° 90° 110 100 90 80 70 60 50 40 30 20 IT(RMS), RMS ON−STATE CURRENT (AMPS) 0 a a = CONDUCTION ANGLE 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 a DC 180° 120° T = 30° 60° 90° 100 90 80 IT(RMS), RMS ON−STATE CURRENT (AMPS) Figure 1. RMS Current Derating Figure 2. RMS Current Derating P (AV), MAXIMUM AVERAGE POWER DISSIPATION (WATTS) 1.2 1.0 0.8 0.6 a a = CONDUCTION ANGLE 120° a DC 180° 6.0 4.0 TJ = 110°C 2.0 25°C 1.0 90° 0.2 T = 30° 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 60° ITM , INSTANTANEOUS ON-STATE CURRENT (AMP) 0.4 0.6 0.4 IT(RMS), RMS ON−STATE CURRENT (AMPS) 0.2 Figure 3. Power Dissipation 0.1 0.06 0.04 0.02 0.01 0.006 0.4 1.2 2.0 2.8 3.6 4.4 5.2 6.0 VTM, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) Figure 4. On−State Characteristics http://onsemi.com 4 MAC97 Series R (t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 I TSM , PEAK SURGE CURRENT (AMPS) 10 ZQJC(t) = RQJC(t) @ r(t) 0.1 5.0 3.0 2.0 TJ = 110°C f = 60 Hz CYCLE Surge is preceded and followed by rated current. 0.01 0.1 1.0 10 100 1S103 1S104 1.0 1.0 2.0 3.0 5.0 10 30 50 100 t, TIME (ms) NUMBER OF CYCLES Figure 5. Transient Thermal Response 100 IGT, GATE TRIGGER CURRENT (mA) VGT, GATE TRIGGER VOLTAGE (V) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 Figure 6. Maximum Allowable Surge Current Q4 Q3 Q2 Q1 10 Q4 Q3 Q2 Q1 1 0 −40 −25 −10 5 20 35 50 65 80 95 110 0.3 −40 −25 −10 5 20 35 50 65 80 95 110 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 7. Typical Gate Trigger Current versus Junction Temperature 100 10 Figure 8. Typical Gate Trigger Voltage versus Junction Temperature IL , LATCHING CURRENT (mA) 10 Q2 IH , HOLDING CURRENT (mA) MT2 Negative 1 MT2 Positive Q4 1 Q1 Q3 0 −40 −25 −10 5 20 35 50 65 80 95 110 0.1 −40 −25 −10 5 20 35 50 65 80 95 110 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 9. Typical Latching Current versus Junction Temperature Figure 10. Typical Holding Current versus Junction Temperature http://onsemi.com 5 MAC97 Series LL 200 VRMS ADJUST FOR ITM, 60 Hz VAC TRIGGER CHARGE CONTROL TRIGGER CONTROL MEASURE I RS 1N4007 CHARGE CS MT2 1N914 51 W G MT1 − ADJUST FOR + dV/dt(c) 200 V NON-POLAR CL Note: Component values are for verification of rated (dv/dt)c. See AN1048 for additional information. Figure 11. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dV/dt)c ORDERING & SHIPPING INFORMATION U.S. Europe Equivalent MAC97A6RL1 MAC97A6RL1G MAC97A8RLRM MAC97A8RLRMG MAC97A4 MAC97A4G MAC97A6 MAC97A6G MAC97A8 MAC97A8G MAC97A6RLRF MAC97A6RLRFG MAC97A6RLRP MAC97A6RLRPG MAC97A8RLRP MAC97A8RLRPG MAC97A8RL1 MAC97A8RL1G Shipping Radial Tape & Reel (2K/Reel) Radial Tape & Reel (2K/Reel) (Pb−Free) Radial Tape & Reel (2K/Reel) Radial Tape & Reel (2K/Reel) (Pb−Free) Bulk in Box (5K/Box) Bulk in Box (5K/Box) (Pb−Free) Bulk in Box (5K/Box) Bulk in Box (5K/Box) (Pb−Free) Bulk in Box (5K/Box) Bulk in Box (5K/Box) (Pb−Free) Radial Tape & Reel (2K/Reel) Radial Tape & Reel (2K/Reel) (Pb−Free) Radial Tape & Reel (2K/Reel) Radial Tape & Reel (2K/Reel) (Pb−Free) Radial Tape / Fan Fold Box (2K/Box) Radial Tape / Fan Fold Box (2K/Box) (Pb−Free) Description of TO92 Tape Orientation Flat side of TO92 & adhesive tape visible Flat side of TO92 & adhesive tape visible Flat side of TO92 & adhesive tape visible Flat side of TO92 & adhesive tape visible N/A, Bulk N/A, Bulk N/A, Bulk N/A, Bulk N/A, Bulk N/A, Bulk Round side of TO92 & adhesive tape on reverse side Round side of TO92 & adhesive tape on reverse side Round side of TO92 & adhesive tape on reverse side Round side of TO92 & adhesive tape on reverse side Round side of TO92 & adhesive tape visible Round side of TO92 & adhesive tape visible †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 MAC97 Series TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 L1 L F1 F2 P2 P1 P P2 D H1 W1 W T T2 T1 Figure 12. Device Positioning on Tape Specification Inches Symbol D D2 F1, F2 H H1 H2A H2B H4 H5 L L1 P P1