32M-Bit (4Mx8 / 2Mx16) CMOS Mask ROM



Part  Number KM23C32000C
Manufacturer Samsung Semiconductor
Semiconductor DataSheet

DataSheet View

www.DataSheet4U.com KM23C32000C 32M-Bit (2Mx16) CMOS MASK ROM FEATURES • 2,097,152x16 bit organization • Fast access time : 100ns(Max.) • Supply voltage : single +5V • Current consumption Operating : 50mA(Max.) Standby : 50µA(Max.) • Fully static operation • All inputs and outputs TTL compatible • Three state outputs • Package -. KM23C32000C : 42-DIP-600 CMOS MASK ROM GENERAL DESCRIPTION The KM23C32000C is a fully static mask programmable ROM organized 2,097,152x16 bit. It is fabricated using silicon-gate CMOS process technology. This device operates with a 5V single power supply, and all inputs and outputs are TTL compatible. Because of its asynchronous operation, it requires no external clock assuring extremely easy operation. It is suitable for use in program memory of microprocessor and data memory, character generator. The KM23C32000C is packaged in a 42-DIP. FUNCTIONAL BLOCK DIAGRAM PIN CONFIGURATION A20 . . . . . . . . A0 X BUFFERS AND DECODER MEMORY CELL MATRIX (2,097,152x16) A18 A17 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 A19 41 A8 40 A9 39 A10 38 A11 37 A12 36 A13 35 A14 34 A15 Y BUFFERS AND DECODER SENSE AMP. BUFFERS A3 A2 A1 A0 CE DIP 33 A16 32 A20 31 VSS 30 Q15 29 Q7 28 Q14 27 Q6 26 Q13 25 Q5 24 Q12 23 Q4 22 VCC . . . VSS OE CE OE CONTROL LOGIC Q0 Q15 Q0 Q8 Q1 Q9 Q2 Q10 Pin Name A0 - A 20 Q0 - Q15 CE OE VCC VSS Pin Function Address Inputs Data Outputs Chip Enable Output Enable Power (+5V) Ground Q3 Q11 KM23C32000C www.DataSheet4U.com KM23C32000C ABSOLUTE MAXIMUM RATINGS Item Voltage on Any Pin Relative to VSS Temperature Under Bias Storage Temperature Symbol VIN TBIAS TSTG Rating CMOS MASK ROM Unit V °C °C -0.3 to +7.0 -10 to +85 -55 to +150 NOTE : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS(Voltage reference to VSS, TA=0 to 70°C) Item Supply Voltage Supply Voltage Symbol VCC VSS Min 4.5 0 Typ 5.0 0 Max 5.5 0 Unit V V DC CHARACTERISTICS Parameter Operating Current Standby Current(TTL) Standby Current(CMOS) Input Leakage Current Output Leakage Current Input High Voltage, All Inputs Input Low Voltage, All Inputs Output High Voltage Level Output Low Voltage Level Symbol ICC ISB1 ISB2 ILI ILO VIH VIL VOH VOL IOH=-400µA IOL=2.1mA Test Conditions CE=OE=VIL, all outputs open CE=VIH, all outputs open CE=VCC, all outputs open VIN=0 to VCC VOUT=0 to VCC Min 2.2 -0.3 2.4 Max 50 1 50 10 10 VCC+0.3 0.8 0.4 Unit mA mA µA µA µA V V V V NOTE : Minimum DC Voltage(VIL) is -0.3V an input pins. During transitions, this level may undershoot to -2.0V for periods <20ns. Maximum DC voltage on input pins(VIH ) is VCC+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns. MODE SELECTION CE H L L OE X H L Mode Standby Operating Operating Data High-Z High-Z Dout Power Standby Active Active CAPACITANCE (TA=25°C, f=1.0MHz) Item Output Capacitance Input Capacitance Symbol COUT CIN Test Conditions VOUT=0V VIN=0V Min Max 12 12 Unit pF pF NOTE : Capacitance is periodically sampled and not 100% tested. www.DataSheet4U.com KM23C32000C CMOS MASK ROM AC CHARACTERISTICS(TA=0°C to +70°C,VCC=5V±10%, unless otherwise noted.) TEST CONDITIONS Item Input Pulse Levels Input Rise and Fall Times Input and Output timing Levels Output Loads Value 0.6V to 2.4V 10ns 0.8V and 2.0V 1 TTL Gate and C L=100pF READ CYCLE Item Read Cycle Time Chip Enable Access Time Address Access Time Output Enable Access Time Output or Chip Disable to Output High-Z Output Hold from Address Change Symbol tRC tACE tAA tOE tDF tOH 0 KM23C32000C-10 Min 100 100 100 50 20 0 Max KM23C32000C-12 Min 120 120 120 60 20 0 Max KM23C32000C-15 Min 150 150 150 70 30 Max Unit ns ns ns ns ns ns TIMING DIAGRAM READ ADD ADD1 tRC tACE ADD2 tDF(Note) CE tOE OE tOH DOUT VALID DATA VALID DATA tAA NOTE : tDF is defined as the time at which the outputs achieve the open circuit condition and is not referenced to VOH or VOL level. www.DataSheet4U.com KM23C32000C PACKAGE DIMENSIONS 42-DIP-600 CMOS MASK ROM (Unit : mm/inch) 0.25 +0.10 -0.05 0.010 +0.004 -0.002 #42 #22 #1 52.82 MAX 2.080 52.42±0.20 2.064±0.008 #21 3.91±0.20 0.154±0.008 5.08 0.200MAX 15.24 0.600 13.80±0.20 0.543±0.008 0~15° ( 0.81 ) 0.032 0.46±0.10 0.018±0.004 1.27±.10 0.050±0.004 2.54 0.100 3.1±0.30 0.122±0.012 0.38 MIN 0.015




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