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Part Number |
IXGP12N100AU1 |
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Manufacturer |
IXYS Corporation |
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Semiconductor DataSheet |
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DataSheet View |
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www.DataSheet4U.com
IGBT
Combi Pack
Preliminary Data Sheet
VCES IXGA/IXGP12N100U1 IXGA/IXGP12N100AU1 1000 V 1000 V
IC25 24 A 24 A
VCE(sat) 3.5 V 4.0 V
Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg Md Weight
Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MW Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 150 W Clamped inductive load, L = 300 mH TC = 25°C
Maximum Ratings 1000 1000 ±20 ±30 24 12 48 ICM = 24 @ 0.8 VCES 100 -55 ... +150 150 -55 ... +150 W °C °C °C V V V V A A A
TO-220AB(IXGP)
GC E
TO-263 AA (IXGA)
G
A
E
C (TAB)
Mounting torque with screw M3 Mounting torque with screw M3.5
0.45/4 Nm/lb.in. 0.55/5 Nm/lb.in. 4 300 g °C
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
Features • International standard packages JEDEC TO-220AB and TO-263AA • IGBT with antiparallel FRED in one package • Second generation HDMOSTM process • Low VCE(sat) - for minimum on-state conduction losses • MOS Gate turn-on - drive simplicity • Fast Recovery Expitaxial Diode (FRED) - soft recovery with low IRM Applications • AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies (UPS) • Switch-mode and resonant-mode power supplies Advantages • Easy to mount with one screw • Space savings (two devices in one package) • Reduces assembly time and cost • High power density
Symbol Test Conditions (TJ = 25°C, unless otherwise specified) BVCES VGE(th) ICES IC = 3 mA, VGE = 0 V IC = 250 mA, VGE = VGE VCE = 0.8, VCES VGE = 0 V IGES VCE(sat) VCE = 0 V, VGE = ±20 V IC = ICE90, VGE = 15 12N100 12N100A
Min. 1000 2.5 TJ = 25°C TJ = 125°C
Characteristic Values Typ. Max. V 5.5 300 3 ±100 3.5 4.0 V mA mA nA V V
IXYS reserves the right to change limits, test conditions, and dimensions.
95592A (3/97)
© 2000 IXYS All rights reserved
1-4
IXGA12N100U1 IXGA12N100AU1
Symbol Test Conditions (TJ = 25°C, unless otherwise specified) gfs Qg Qge Qgc td(on) t ri td(off) tfi Eoff td(on) t ri Eon td(off) tfi Eoff RthJC RthCK 0.25 Inductive load, TJ = 25°C IC = IC90, VGE = 15 V, L = 300 mH VCE = 800 V, RG = Roff = 120 W Remarks: Switching times may increase for VCE (Clamp) > 0.8 VCES, higher TJ or increased RG Inductive load, TJ = 125°C IC = IC90, VGE = 15 V, L = 300 mH VCE = 800 V, RG = Roff = 120 W Remarks: Switching times may increase for VCE (Clamp) > 0.8 VCES, higher TJ or increased RG 12N100A 12N100A 12N100 12N100A IC = IC90; VCE = 10 V, Pulse test, t £ 300 ms, duty cycle £ 2 % IC = IC90, VGE = 15 V, VCE = 0.5 VCES Characteristic Values Min. Typ. Max. 6 10 S
IXGP12N100U1 IXGP12N100AU1
TO-220 AB (IXGP) Outline
65 8 24 100 200 850 500
90 20 45
nC nC nC ns ns
1000 700
ns ns ns mJ ns ns mJ ns ns ns mJ mJ
Dim. A B C D E F G H J K M N Q R Millimeter Min. Max. 12.70 13.97 14.73 16.00 9.91 10.66 3.54 4.08 5.85 6.85 2.54 3.18 1.15 1.65 2.79 5.84 0.64 1.01 2.54 BSC 4.32 4.82 1.14 1.39 0.35 0.56 2.29 2.79 Inches Min. Max. 0.500 0.550 0.580 0.630 0.390 0.420 0.139 0.161 0.230 0.270 0.100 0.125 0.045 0.065 0.110 0.230 0.025 0.040 0.100 BSC 0.170 0.190 0.045 0.055 0.014 0.022 0.090 0.110
800 1000 4 6 100 200 1.1 900 950
12N100 1250 12N100A 8 12N100 10 1.25
K/W K/W
TO-263 AA (IXGA) Outline Reverse Diode (FRED) (T J = 25°C, unless otherwise specified) Symbol Test Conditions VF IF =8A, VGE = 0 V, Pulse test, t £ 300 ms, duty cycle d £ 2 % IRM t rr IF IF RthJC = IC90, VGE = 0 V, -diF/dt = 100 A/ms = 1 A, -di/dt = 50 A/ms, VR = 30 V TJ = 25°C 6.5 140 50 60 2.5 A ns ns K/W Characteristic Values Min. Typ. Max. 2.75 V
VR = 100 V, TJ = 125°C
Dim. A A1
Millimeter Min. Max. 4.06 2.03 0.51 1.14 0.46 1.14 8.64 7.11 9.65 6.86 2.54 14.61 2.29 1.02 1.27 0 0.46 4.83 2.79 0.99 1.40 0.74 1.40 9.65 8.13 10.29 8.13 BSC 15.88 2.79 1.40 1.78 0.38 0.74
Inches Min. Max. .160 .080 .020 .045 .018 .045 .340 .280 .380 .270 .100 .575 .090 .040 .050 0 .018 .190 .110 .039 .055 .029 .055 .380 .320 .405 .320 BSC .625 .110 .055 .070 .015 .029
Min. Recommended Footprint
b b2 c c2 D D1 E E1 e L L1 L2 L3 L4 R
© 2000 IXYS All rights reserved
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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IXGA12N100U1 IXGA12N100AU1
50 40
VGE = 15V TJ = 25°C 13V 11V
IXGP12N100U1 IXGP12N100AU1
100
TJ = 25°C
VGE = 15V
80
IC - Amperes
IC - Amperes
9V
13V
30 20
7V
60
11V
40
9V
10 0 0 2 4 6 8 10
20
7V
0
0
4
8
12
16
20
VCE - Volts
VCE - Volts
Figure 1. Saturation Voltage Characteristics
Figure 2. Extended Output Characteristics
50
TJ = 125°C
1.6
VGE = 15V 13V 11V VGE = 15V IC = 24A
VCE (sat) - Normalized
40
1.4 1.2
IC = 12A
IC - Amperes
30
9V
20
7V
1.0 0.8
IC = 6A
10 0 0 2 4 6 8 10
0.6 25
50
75
100
125
150
VCE - Volts
TJ - Degrees C
Figure 3. Saturation Voltage Characteristics
Figure 4. Temperature Dependence of VCE(sat)
1000
50
VCE = 10V
40 30
TJ = 125°C
Ciss
f = 1Mhz
Capacitance - pF
TJ = 25°C
IC - Amperes
Coss
100
20 10 0 2 4 6 8 10 12
Crss
10 0 5 10 15 20 25 30 35 40
VGE - Volts
VCE-Volts
Figure 5. Admittance Curves
© 2000 IXYS All rights reserved
Figure 6. Capacitance Curves 3-4
IXGA12N100U1 IXGA12N100AU1
1200
TJ = 125°C
IXGP12N100U1 IXGP12N100AU1
5
5
RG = 120
1000
t fi - nanoseconds
t fi - nanoseconds
1100
t fi
4
800
tfi
TJ = 125°C IC = 12A
4
E(OFF) - milliJoules
E(OFF) - millijoules
600
3
1000
E(OFF)
3
400
E(OFF)
2
900
2
200
1
800
0 5 10 15
1 20
0
0
30
60
90
120
0 150
IC - Amperes
RG - Ohms
Figure 7. Dependence of tfi and EOFF on IC.
15 12
Figure 8. Dependence of tfi and EOFF on RG.
100
24
IC = 30A VCE = 150V
IC - Amperes
TJ = 125°C
VGE - Volts
10
9 6 3 0 0 15 30 45 60 75
RG = 4.7 dV/dt < 5V/ns
1
0.1 0 200 400 600 800 1000
Qg - nanocoulombs
VCE - Volts
Figure 9. Gate Charge
1
D=0.5 D=0.2 D=0.1
Figure 10. Turn-off Safe Operating Area
ZthJC (K/W)
0.1
D=0.05 D=0.02 D=0.01 D = Duty Cycle
0.01
Single pulse
0.001 0.00001
0.0001
0.001
0.01
0.1
1
Pulse Width - Seconds
Figure 11. Transient Thermal Resistance
© 2000 IXYS All rights reserved
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