Charging System Safety Circuit

® ISL9209 Data Sheet April 25, 2006 FN6274.0 Charging System Safety Circuit The ISL9209 is an integrated circuit (IC) optimized to provide a redundant safety protection to a Li-ion battery from failures of a charging system. The IC monitors the input voltage, the battery voltage, and the charge current. When any of the three parameters exceeds its limit, the IC turns off an internal P-channel MOSFET to remove the power from the charging system. In addition to the above protected parameters, the IC also monitors its own internal temperature and turns off the P-channel MOSFET when the temperature exceeds 140°C. Together with the battery charger IC and the protection module in a battery pack, the charging system using the ISL9209 has triple-level protection and is two-fault tolerant. The IC is designed to turn on the internal PFET slowly to avoid inrush current at power up but will turn off the PFET quickly when the input is overvoltage in order to remove the power before any damage occurs. The ISL9209 has a logic warning output to indicate the fault and an enable input to allow the system to remove the input power. Features • Fully Integrated Protection Circuit for Three Protected Variables • High Accuracy Protection Thresholds • User Programmable Over-Current Protection Threshold • Input Over-Voltage Protection in Less Than 1μs • High Immunity of False Triggering Under Transients • Warning Output to Indicate the Occurrence of Faults • Enable Input • Easy to Use • Thermal Enhanced TDFN Package • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Cell Phones • Digital Still Cameras • PDAs and Smart Phones Ordering Information PART NUMBER PART TEMP. (NOTE) MARKING RANGE (°C) ISL9209IRZ ISL9209IRZ-T 09Z 09Z -40 to 85 PACKAGE (Pb-Free) PKG. DWG. # • Portable Instruments • Desktop Chargers 12 Ld 4x3 TDFN L12.4x3A Related Literature • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” • Technical Brief TB379 “Thermal Characterization of Packaged Semiconductor Devices” • Technical Brief TB389 “PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages” 12 Ld 4x3 TDFN Tape and Reel NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Typical Application Circuit INPUT VIN OUT ISL6292 Battery Charger Pinout ISL9209 (4x3 TDFN) TOP VIEW C1 ISL9209 ILIM RILIM GND VB EN WRN RVB Battery Pack VIN VIN GND WRN NC NC 1 2 3 EPAD 4 5 6 12 NC 11 OUT 10 OUT 9 8 7 ILIM VB EN 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2006. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL9209 Absolute Maximum Ratings (Reference to GND) Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 30V Output and VB Pin (OUT, VB) (Note 1) . . . . . . . . . . . . . . . -0.3 to 7V Other Pins (ILIM, WRN, EN) . . . . . . . . . . . . . . . . . . . . . -0.3 to 5.5V ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3500V Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .350V Thermal Information Thermal Resistance (Typical, Note 2, 3) θJA (°C/W) θJC (°C/W) 4X3 TDFN Package . . . . . . . . . . . . . . . 41 3.5 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-40°C to 85°C Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3V to 5.5V Operating Current Range. . . . . . . . . . . . . . . . . . . . . . . . . 0A to 1.0A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The maximum voltage rating for the VB pin under continuous operating conditions is 5.5V. All other pins are allowed to operate continuously at the absolute maximum ratings. 2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 3. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications PARAMETER POWER-ON RESET Rising VIN Threshold POR Hysteresis VIN Bias Current VIN Bias Current PROTECTIONS Typical values are tested at VIN = 5V and 25°C Ambient Temperature, maximum and minimum values are guaranteed over the recommended operating conditions, unless otherwise noted. SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VPOR IVIN When enabled When disabled 2.45 0.75 30 125 0.9 60 3.0 1.05 100 V mV mA μA Input Overvoltage Protection (OVP) Input OVP Hysteresis Input OVP Falling Threshold Input OVP Propagation Delay Overcurrent Protection Overcurrent Protection Blanking Time Battery Overvoltage Protection Threshold Battery OVP Threshold Hysteresis Battery OVP Falling Threshold Battery OVP Blanking Time VB Pin Leakage Current Over Temperature Protection Rising Threshold Over Temperature Protection Falling Threshold LOGIC EN Input Logic HIGH EN Input Logic LOW EN Internal Pull Down Resistor WRN Output Logic Low WRN Output Logic High Leakage Current POWER MOSFET On Resistance VOVP 5.65 5.55 - 5.85 50 1.0 170 4.4 75 180 140 90 6.0 100 1 1.07 4.475 20 - V mV V μs A μs V mV V μs nA °C °C IOCP BTOCP VBOVP VVB = 3V, RILIM = 25kΩ 0.93 4.325 4.225 BTBOVP VVB = 4.4V - 1.5 100 Sink 5mA current - 200 0.35 - 0.4 400 0.8 1 V V kΩ V μA RDS(ON) Measured at 500mA, 4.3V < VIN < 5.5V - 250 450 mΩ 2 FN6274.0 April 25, 2006 ISL9209 Pin Descriptions VIN (Pin1, 2) The input power source. The VIN can withstand 30V input. VB (Pin 8) Battery voltage monitoring input. This pin is connected to the battery pack positive terminal via an isolation resistor. GND (Pin 3) System ground reference. ILIM (Pin 9) Overcurrent protection threshold setting pin. Connect a resistor between this pin and GND to set the OCP threshold. WRN (Pin 4) WRN is an open-drain logic output that turns LOW when any protection event occurs. OUT (Pin 10, 11) Output pin. NC (Pin 5, 6, 12) No connection and must be left floating. EPAD The exposed pad at the bottom of the TDFN package for enhancing thermal performance. Must be electrically connected to the GND pin. EN (Pin 8) Enable input. Pull this pin to low or leave it floating to enable the IC and force it to high to disable the IC. Typical Applications INPUT VIN OUT C1 ISL6292 Battery Charger PART ISL9209 ILIM VB EN GND WRN RVB Battery Pack DESCRIPTION 25kΩ 200kΩ to 1MΩ 1µF/16V X5R ceramic capacitor RILIM RVB C1 RILIM Block Diagram INPUT VIN Q1 Q2 POR Pre-reg Ref FET Driver Q3 ILIM RILIM CP2 EA OUT ISL6292 Battery Charger R1 0.8V CP1 R2 1.2V Q4 Q5 WRN GND R5 EN Logic CP3 R3 BUF VB R4 RVB FIGURE 1. BLOCK DIAGRAM 3 FN6274.0 April 25, 2006 ISL9209 Typical Operating Performance The test conditions for the Typical Operating Performance are: VIN = 5V, TA = 25°C, RILIM = 25.5kΩ, RVB = 200kΩ, Unless Otherwise Noted. VIN (2V/div) VIN (1V/div) OUT (1V/div) OUT (2V/div) Load Current (200mA/div) Time: 5ms/div WRN (5V/div) Time: 5μs/div FIGURE 2. CAPTURED WAVEFORMS FOR POWER-UP. THE OUTPUT IS LOADED WITH A 10Ω RESISTOR FIGURE 3. CAPTURED WAVEFORMS WHEN THE INPUT VOLTAGE STEPS FROM 5.5V TO 9.5V Time: 500ms/div VIN (2V/div) VIN (2V/div) OUT (2V/div) OUT (2V/div) WRN (5V/div) WRN (5V/div) Time: 5ms/div FIGURE 4. CAPTURED WAVEFORMS WHEN THE INPUT GRADUALLY RISES TO THE INPUT OVERVOLTAGE THRESHOLD FIGURE 5. TRANSIENT WHEN THE INPUT VOLTAGE STEPS FROM 6.5V TO 5.5V Time: 20s/div VIN (2V/div) VIN (1V/div) VB (1V/div) OUT (2V/div) ILIM (1V/div) WRN (5V/div) Time: 500μs/div OUT (1V/div) WRN (5V/div) FIGURE 6. TRANSIENT WAVEFORMS WHEN INPUT STEPS FROM ZERO TO 9V FIGURE 7. BATTERY OVERVOLTAGE PROTECTION. THE IC IS LATCHED OFF AFTER 16 COUNTS OF PROTECTION. VB VOLTAGE VARIES BETWEEN 4.3V TO 4.5V 4 FN6274.0 April 25, 2006 ISL9209 Typical Operating Performance The test conditions for the Typical Operating Performance are: VIN = 5V, TA = 25°C, RILIM = 25.5kΩ, RVB = 200kΩ, Unless Otherwise Noted. (Continued) Time: 200ms/div VIN (1V/div) OUT (1V/div) Load Current (500mA/div) WRN (5V/div) Time: 10ms/div VIN (1V/div) Load Current (500mA/div) OUT (1V/div) WRN (5V/div) FIGURE 8. POWER-UP WAVEFORMS WHEN OUTPUT IS SHORT-CIRCUITED FIGURE 9. ZOOMED-IN VIEW OF FIGURE 8 (BLUE: LOAD CURRENT; PINK: OUT PIN VOLTAGE) 1000 900 INPUT BIAS CURRENT (µA) 800 700 600 500 400 300 200 100 0 0 5 10 15 20 25 30 35 INPUT VOLTAGE (V) DISABLED ENABLED CURRENT (µA) 1000 900 800 700 600 500 400 300 200 100 0 -50 -20 10 40 70 100 130 30V/DISABLED 5V/DISABLED 4.3V/DISABLED 30V/ENABLED 4.3V/ENABLED 5V/ENABLED TEMPERATURE (°C) FIGURE 10. INPUT BIAS CURRENT vs INPUT VOLTAGE WHEN ENABLED AND DISABLED FIGURE 11. INPUT BIAS CURRENT AT DIFFERENT INPUT VOLTAGES WHEN ENABLED AND DISABLED 2.82 2.8 2.78 2.76 VPOR (V) 2.74 VOVP (V) 2.72 2.7 2.68 2.66 2.64 2.62 -50 -20 10 40 70 100 130 FALLING THRESHOLD 5.8 5.78 5.76 5.74 5.72 -50 -20 10 40