(HSMP-389x / HSMP-489x) Pin Switch Diode

www.DataSheet4U.com Surface Mount RF PIN Switch Diodes Technical Data HSMP-389x Series HSMP-489x Series Features • Unique Configurations in Surface Mount Packages – Add Flexibility – Save Board Space – Reduce Cost • Switching – Low Capacitance – Low Resistance at Low Current • Low Failure in Time (FIT) Rate[1] • Matched Diodes for Consistent Performance • Better Thermal Conductivity for Higher Power Dissipation Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Pin Connections and Package Marking 1 2 3 6 5 4 Description/Applications The HSMP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically designed for use at frequencies which are much higher than the upper limit for conventional PIN diodes. Notes: 1. Package marking provides orientation, identification, and date code. 2. See “Electrical Specifications” for appropriate package marking. GUx www.DataSheet4U.com 2 Package Lead Code Identification, SOT-23/143 (Top View) SINGLE SERIES Package Lead Code Identification, SOT-323 (Top View) SINGLE SERIES Package Lead Code Identification, SOT-363 (Top View) UNCONNECTED TRIO 6 5 4 DUAL SWITCH MODEL 6 5 4 #0 COMMON ANODE #2 COMMON CATHODE B COMMON ANODE C COMMON CATHODE 1 2 3 1 2 3 L LOW INDUCTANCE SINGLE 6 5 4 R SERIES– SHUNT PAIR 6 5 4 #3 UNCONNECTED PAIR #4 DUAL ANODE E DUAL ANODE F 1 2 3 1 2 3 T HIGH FREQUENCY SERIES U 489B 6 5 4 #5 4890 1 2 3 V Absolute Maximum Ratings[1] TC = +25°C Symbol If PIV Tj Tstg θjc Parameter Forward Current (1 µs Pulse) Peak Inverse Voltage Junction Temperature Storage Temperature Thermal Resistance[2] Unit Amp V °C °C °C/W SOT-23/143 SOT-323/363 1 100 150 -65 to 150 500 1 100 150 -65 to 150 150 ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. www.DataSheet4U.com 3 Electrical Specifications, TC = 25°C, each diode Part Number HSMP3890 3892 3893 3894 3895 389B 389C 389E 389F 389L 389R 389T 389U 389V Test Conditions Package Marking Code G0 G2 [1] G3 [1] G4 [1] G5 [1] G0 [2] G2 [2] G3 [2] G4 [2] GL [2] S [2] Z [2] GU [2] GV [2] [1] Lead Code 0 2 3 4 5 B C E F L R T U V Configuration Single Series Common Anode Common Cathode Unconnected Pair Single Series Common Anode Common Cathode Unconnected Trio Dual Switch Mode Low Inductance Single Series-Shunt Pair High Frequency Series Pair Minimum Maximum Maximum Breakdown Series Resistance Total Capacitance Voltage VBR (V) RS (Ω) CT (pF) 100 2.5 0.30 VR = VBR Measure IR ≤ 10 µA IF = 5 mA f = 100 MHz VR = 5 V f = 1 MHz Notes: 1. Package marking code is white. 2. Package is laser marked. High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes Part Package Number Marking HSMP- Code[1] Configuration 489x GA Dual Anode Test Conditions Minimum Breakdown Voltage VBR (V) 100 VR = VBR Measure IR ≤ 10 µA Maximum Series Resistance R S (Ω) 2.5 IF = 5 mA Typical Total Capacitance C T (pF) 0.33 f = 1 MHz VR = 5 V Maximum Total Capacitance C T (pF) 0.375 VR = 5 V f = 1 MHz Typical Total Inductance L T (nH) 1.0 f = 500 MHz – 3 GHz Note: 1. SOT-23 package marking code is white; SOT-323 is laser marked. Typical Parameters at TC = 25°C Part Number HSMP389x Test Conditions Series Resistance R S (Ω) 3.8 IF = 1 mA f = 100 MHz Carrier Lifetime τ (ns) 200 IF = 10 mA IR = 6 mA Total Capacitance C T (pF) 0.20 @ 5 V www.DataSheet4U.com 4 HSMP-389x Series Typical Performance, TC = 25°C, each diode 100 TOTAL CAPACITANCE (pF) 0.55 INPUT INTERCEPT POINT (dBm) 120 115 110 105 100 95 90 85 0.50 0.45 0.40 0.35 0.30 0.25 1 GHz 0.20 0 4 8 12 16 20 1 MHz RF RESISTANCE (OHMS) Diode Mounted as a Series Attenuator in a 50 Ohm Microstrip and Tested at 123 MHz 10 1 0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) VR – REVERSE VOLTAGE (V) 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 1. Total RF Resistance at 25°C vs. Forward Bias Current. Figure 2. Capacitance vs. Reverse Voltage. Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current. Trr – REVERSE RECOVERY TIME (nS) 200 IF – FORWARD CURRENT (mA) 100 160 VR = –2V 120 10 1 80 VR = –5V 40 VR = –10V 0 10 15 20 25 30 0.1 0.01 125°C 25°C –50°C 0 0.2 0.4 0.6 0.8 1.0 1.2 FORWARD CURRENT (mA) VF – FORWARD VOLTAGE (V) Figure 4. Typical Reverse Recovery Time vs. Reverse Voltage. Figure 5. Forward Current vs. Forward Voltage. Typical Applications for Multiple Diode Products 1 2 3 3 2 1 1 2 “ON” “OFF” 1 0 0 2 +V –V 3 2 1 1 0 4 5 6 b1 b2 b3 RF in 4 5 6 RF out Figure 6. HSMP-389L used in a SP3T Switch. Figure 7. HSMP-389L Unconnected Trio used in a Dual Voltage, High Isolation Switch. w w w . D a t a S h e e t 4 U . c o m 5 Typical Applications for Multiple Diode Products (continued) 1 +V 0 2 0 +V “ON” “OFF” 1 6 5 4 1 RF out 6 5 4 1 RF in 2 3 1 RF out 2 3 RF in 2 Figure 8. HSMP-389L Unconnected Trio used in a Positive Voltage, High Isolation Switch. Figure 9. HSMP-389T used in a Low Inductance Shunt Mounted Switch. Bias Xmtr C Ant λ 4 C Rcvr Bias Xmtr bias Ant λ 4 Rcvr Bias Antenna Xmtr PA λ 4 HSMP-389V LNA HSMP-389U λ 4 Rcvr Figure 10. HSMP-389U Series/Shunt Pair used in a 900 MHz Transmit/Receive Switch. Figure 11. HSMP-389V Series/Shunt Pair used in a 1.8 GHz Transmit/Receive Switch. www.DataSheet4U.com 6 Typical Applications for Multiple Diode Products (continued) RF COMMON RF COMMON RF 1 RF 1 RF 2 RF 2 BIAS 1 BIAS 2 BIAS BIAS Figure 12. Simple SPDT Switch, Using Only Positive Current. Figure 13. High Isolation SPDT Switch, Dual Bias. RF COMMON BIAS RF COMMON RF 1 RF 2 RF 1 BIAS RF 2 Figure 14. Switch Using Both Positive and Negative Bias Current. Figure 15. Very High Isolation SPDT Switch, Dual Bias. www.DataSheet4U.com 7 Typical Applications for HSMP-489x Low Inductance Series Microstrip Series Connection for HSMP-489x Series In order to take full advantage of the low inductance of the HSMP-489x series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in Figure 17. 3 50 OHM MICROSTRIP LINES PAD CONNECTED TO GROUND BY TWO VIA HOLES Figure 18. Circuit Layout. Co-Planar Waveguide Shunt Connection for HSMP-489x Series Co-Planar waveguide, with ground on the top side of the printed circuit board, is shown in Figure 20. Since it eliminates the need for via holes to ground, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit. Co-Planar Waveguide Groundplane 1.5 nH 1.5 nH Center Conductor Groundplane 1 HSMP-489x 2 0.3 pF Figure 16. Internal Connections. 0.3 nH Figure 20. Circuit Layout. 0.3 nH 0.3 pF Figure 19. Equivalent Circuit. Figure 17. Circuit Layout. 0.75 nH Microstrip Shunt Connections for HSMP-489x Series In Figure 18, the center conductor of the microstrip line is interrupted and leads 1 and 2 of the HSMP-489x diode are placed across the resulting gap. This forces the 1.5 nH lead inductance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and increasing the maximum available attenuation. The 0.3 nH of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material. Figure 21. Equivalent Circuit. Equivalent Circuit Model HSMP-389x Chip* Rs Rj A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. 0.5 Ω Cj 0.12 pF* * Measured at -20 V RT = 0.5 + R j CT = CP + Cj 20 R j = 0.9 Ω I I = Forward Bias Current in mA * See AN1124 for package models www.DataSheet4U.com 8 Assembly Information 0.026 0.075 0.035 0.016 Figure 22. PCB Pad Layout, SOT-363. (dimensions in inches). 0.026 SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. Agilent’s diodes have been qualified to the time-temperature profile shown in Figure 26. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235°C. These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 0.07 0.035 0.016 Figure 23. PCB Pad Layout, SOT-323. (dimensions in inches). 0.037 0.95 0.037 0.95 0.079 2.0 250 TMAX 200 TEMPERATURE (°C) 0.035 0.9 0.031 0.