Irda 1.3 Data Compliant 115.2kb/s 3-5V Infrared Transceiver

Agilent HSDL-3000 # 007/017 IrDA® Data Compliant 115.2 kbps Infrared Transceiver Data Sheet Description The HSDL-3000 is a small form factor infrared (IR) transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Physical Layer Specifications 1.3 and is IEC 825-Class 1 eye safe. The HSDL-3000 can be shut down completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for battery-operated handheld products. The HSDL-3000 has two front packaging type options (HSDL3000#007/017). Both options have an integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance. HSDL-3000 Ordering Information Part Number HSDL-3000#007 HSDL-3000#017 Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3000 infrared transceiver module. You can contact them through your local sales representatives for www.DataSheet4U.com additional details. Applications • Data communication – PDAs – Notebooks – Printers • Mobile telecom – Cellular phones – Pagers – Smart phones • Digital imaging – Digital cameras – Photo-imaging printers • Electronic wallet • Medical and industry data collection Features • Fully compliant to IrDA 1.3 specifications: – 2.4 kbps to 115.2 kbps – Excellent nose-to-nose operation – Typical link distance > 1.5 m • Guaranteed temperature performance, –20 to 70 °C – Critical parameters are guaranteed over temperature and supply voltages • Low power consumption – Low shutdown current (10 nA typical) – Complete shutdown for TXD, RXD, and PIN diode • Small module size – 2.70 x 9.10 x 3.65 mm (HxWxD) • Withstands >100 mVp-p power supply ripple typically • VCC supply 2.7 to 5.5 volts • LED stuck-high protection • IEC 825-Class 1 eye safe • Designed to accommodate light loss with cosmetic windows Packaging Type Tape/Reel Strip Package Front View Front View Quantity 2500 10 Functional Block Diagram VCC (5) CX2 Pinout REAR VIEW CX1 GND (6) 6 5 4 3 2 1 RXD (3) HSDL-3xxx SD (4) SHIELD TXD (2) TRANSMITTER LEDA (1) R1 VCC I/O Pins Configuration Table Pin Symbol 1 2 3 4 5 6 – LED A TXD RXD SD VCC GND SHIELD Description LED Anode Notes Tied through external resistor, R1, to regulated V CC from 2.7 to 5.5 volts. Transmitter Data Input. Logic High turns on the LED. If held high longer than ~ 50 µs, the LED is turned www.DataSheet4U.com Active High. off. TXD must be either driven high or low. Do NOT float the pin. Output is a low pulse response when a light pulse is seen. Complete shutdown TXD, RXD, and PIN diode. Regulated, 2.7 to 5.5 volts. Connect to system ground. Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part. Receiver Data Output. Active Low. Shutdown. Active High. Supply Voltage Ground EMI Shield Recommended Application Circuit Components Component R1 Recommended Value 2.2 Ω ± 5%, 0.25 Watt, for 2.7 ≤ VCC ≤ 3.3 V operation 2.7 Ω ± 5%, 0.25 Watt, for 3.0 ≤ VCC ≤ 3.6 V operation 6.8 Ω ± 5%, 0.25 Watt, for 4.5 ≤ VCC ≤ 5.5 V operation 0.47 µF ± 20%, X7R Ceramic 6.8 µF ± 20%, Tantalum Marking Information The HSDL-3000#007/017 is marked “YYWW” on the shield where ‘YY’ indicates the unit’s manufacturing year, and ‘WW’ refers to the work week in which the unit is tested. CX1[1] CX2[2] Notes: 1. CX1 must be placed within 0.7 cm of HSDL-3000 to obtain optimum noise immunity. 2. In environments with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in ”HSDL-3000 Functional Block Diagram“on page 2. Caution: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken during handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD. 2 RECEIVER Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Storage Temperature Operating Temperature LED Supply Voltage Supply Voltage Output Voltage: RXD LED Current Pulse Amplitude Symbol TS TA VLED VCC VO ILED Min. –40 –20 0 0 –0.5 Max. 100 70 7 7 7 500 Units °C °C V V V mA ≤ 90 µs Pulse Width ≤ 20% Duty Cycle Conditions Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Logic Input Voltage for TXD Receiver Input Irradiance Logic High Logic Low Logic High Logic Low TXD Pulse Width (SIR) Receiver Data Rate Ambient Light Symbol TA VCC VIH VIL EIH EIL tTPW (SIR) 1.5 2.4 Min. –20 2.7 2/3 V CC 0 0.0036 Max. 70 5.5 VCC 1/3 V CC 500 0.3 Units °C V V V mW/cm2 µW/cm2 µs kbps For in-band signals ≤ 115.2 kbps[1] For in-band signals[1] tPW (TXD) = 1.6 µs at 115.2 kbps Conditions www.DataSheet4U.com 1.6 115.2 See Test Methods on page 16 for details. 3 Electrical & Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC set to 3.0 V unless otherwise noted. Parameter Receiver Viewing Angle Peak Sensitivity Wavelength RXD Output Voltage Logic High Logic Low RXD Pulse Width (SIR)[2] RXD Rise and Fall Times Receiver Latency Time[3] Receiver Wake Up Time[4] Transmitter Radiant Intensity Viewing Angle Peak Wavelength TXD Logic Levels High Low TXD Input Current High Low LED Current Shutdown Wakeup Time[5] Maximum Optical Pulse Width[6] TXD Rise and Fall Time (Optical) LED Anode on State Voltage IEH 2θ1/2 λp VIH VIL IH IL IVLED tTW tPW(Max) tr, tf VON (LEDA) –1 2/3 VCC 0 0.02 –0.02 20 30 25 44 30 875 www.DataSheet4U.com Symbol 2φ1/2 λp Min. 30 Typ. Max. Units ° Conditions 875 nm VOH VOL tRPW (SIR) tr, tf tL tRW VCC –0.2 0 1 25 25 18 75 VCC 0.4 7.5 100 50 100 V V µs ns µs µs mW/sr IOH = –200 µA, EI ≤ 0.3 µW/cm2 θ1/2 ≤ 15°, CL = 9 pF CL = 9 pF EI = 10 mW/cm2 ILEDA = 350 mA, θ1/2 ≤ 15°, TXD ≥ VIH, T A = 25°C 60 ° nm VCC 1/3 VCC 1 V V µA µA NA ns µs ns V ILEDA = 350 mA, V I (TXD) ≤ VIL VI ≥ VIH 0 ≤ VI ≤ VIL VI (SD) ≥ VIH, TA = 25°C 1 1000 100 50 600 2.2 4 Electrical & Optical Specifications (Continued) Parameter Transceiver Input Current High Low Supply Current Shutdown Idle Active IH IL ICC1 ICC2 ICC3 –1 0.01 -0.02 0.01 290 2 1 1 1 450 8 µA µA µA µA mA VI ≥ VIH 0 ≤ VI ≤ VIL VSD ≥ VCC – 0.5, TA = 25°C VI(TXD) ≤ VIL, EI = 0 VI(TXD) ≥ VIL Symbol Min. Typ. Max. Units Conditions Notes: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 2. For in-band signals 2.4 kbps to 115.2 kbps where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2. 3. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity. 4. Receiver wake up time is measured from VCC power on to valid RXD output. 5. Transmitter wake up time is measured from V CC power on to valid light output in response to a TXD pulse. 6. Maximum optical pulse width is defined as the maximum time that the LED will remain on. This is to prevent the long turn on time for the LED. 500 2.2 Ω 470 2.7 Ω 440 ILED (mA) ILED (mA) 500 470 440 IEH (mW/sr) www.DataSheet4U.com 110 100 90 80 70 60 50 40 1.80 220 260 300 340 380 420 460 500 ILED (mA) 410 6.8 Ω 380 350 320 290 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 VCC (V) 410 380 350 320 290 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 VON (LEDA) ILED vs. VCC. ILED vs. V ON (LEDA). IEH vs. ILED. 5 HSDL-3000#007 and HSDL-3000#017 Package Outline with Dimension and Recommended PC Board Pad Layout 9.10 ± 0.15 2.70 ± 0.15 1.35 2.65 1.25 2.60 5.80 1.55 0.70 2.95 3.65 1 2 3 4 5 6 PITCH 1.55 (5X) 0.425 www.DataSheet4U.com 0.60 (2 PLACES) DIMENSIONS HEIGHT: 2.70 ± 0.15 mm WIDTH: 9.10 ± 0.15 mm DEPTH: 3.65 ± 0.20 mm UNLESS OTHERWISE STATED, TOLERANCES ± 0.2 mm 0.55 0.65 (4 PLACES) RECOMMENDED LAND PATTERN 3.13 3.05 1.10 0.50 2.30 1.20 6 0.25 8.60 5 4 3 1.55 2 1 0.85 6 HSDL-3000#007 and HSDL-3000#017 Tape and Reel Dimensions 4.00 ± 0.10 5.00° (MAX.) POLARITY PIN 6: GND 123456 1.75 ± 0.10 1.13 ± 0.10 1.55 ± 0.05 + +0.10 3.46 0 +0.10 3.30 0 7.50 ± 0.10 16.00 ± 0.30 9.50 ± 0.10 PIN 1: VLED 0.40 ± 0.10 3.00 ± 0.10 8.00° (MAX.) 8.00 ± 0.10 MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE 3.40 ± 0.20 4.20 ± 0.20 PROGRESSIVE DIRECTION www.DataSheet4U.com (40 mm MIN.) EMPTY PARTS MOUNTED (40 mm MIN.) LEADER EMPTY (40 mm MIN.) "B" "C" 330 80 UNIT: mm QUANTITY 2500 DETAIL A DIA. 13.00 ± 0.50 R 1.00 2.00 ± 0.50 LABEL 21.00 ± 0.80 DETAIL A B C 16.40 + 2.00 0 2.00 ± 0.50 7 Moisture Proof Packaging The HSDL-3000 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Storage Conditions Storage Temperature Relative Humidity 10 °C to 30°C Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within two days if stored at the recommended storage conditions. If the parts have been removed from the bag for more than two days, the parts must be stored in a dry box. Baking If the parts are not stored in a dry environment, they must be baked before reflow process to prevent damage to parts. Baking should be done only once. www