To all our customers
Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp. Customer Support Dept. April 1, 2003
Cautions
Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
Hitachi 16-Bit Single-Chip Microcomputer
H8S/2138 Series H8S/2134 Series H8S/2138F-ZTAT™ H8S/2134F-ZTAT™ H8S/2132F-ZTAT™
H8S/2138 H8S/2137 H8S/2134 H8S/2133 H8S/2132 H8S/2130 HD6432138SW, HD6432138S HD6432137SW, HD6432137S HD6432134S HD6432133S HD6432132 HD6432130
H8S/2138F-ZTAT™ HD64F2138, HD64F2138V HD64F2138A, HD64F2138AV H8S/2134F-ZTAT™ HD64F2134, HD64F2134V HD64F2134A, HD64F2134AV H8S/2132F-ZTAT™ HD64F2132R, HD64F2132RV
ADE-602-144B Rev. 3.0 4/5/01 Hitachi, Ltd.
Hardware Manual
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Preface
The H8S/2138 Series and H8S/2134 Series comprise high-performance microcomputers with a 32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system configuration. The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen internal 16-bit general registers with a 32-bit configuration, and a concise and optimized instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes). Programs based on the high-level language C can also be run efficiently. Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available, providing a quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with frequently changing specifications. On-chip peripheral functions include a 16-bit free-running timer (FRT), 8-bit timer (TMR), watchdog timer (WDT), two PWM timers (PWM and PWMX), a serial communication interface (SCI, IrDA), host interface (HIF), D/A converter (DAC), A/D converter (ADC), and I/O ports. An I2C bus interface (IIC) can also be incorporated as an option. An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer without CPU intervention. The H8S/2138 Series has all the above on-chip supporting functions, and can also be provided with an IIC module as an option. The H8S/2134 Series comprises reduced-function versions, with fewer TMR channels, and no PWM, HIF, IIC, or DTC modules. Use of the H8S/2138 or H8S/2134 Series enables compact, high-performance systems to be implemented easily. The comprehensive PC-related interface functions and 16 × 8 matrix keyscan functions are ideal for applications such as notebook PC keyboard control and intelligent battery and power supply control, while the various timer functions and their interconnectability (timer connection), plus the interlinked operation of the I2C bus interface and data transfer controller (DTC), in particular, make these devices ideal for use in PC monitors. In addition, the combination of F-ZTAT™* and reduced-function versions is ideal for applications such as system units in which on-chip program memory is essential to meet performance requirements, product start-up times are short, and program modifications may be necessary after end-product assembly. This manual describes the hardware of the H8S/2138 Series and H8S/2134 Series. Refer to the H8S/2600 Series and H8S/2000 Series Programming Manual for a detailed description of the instruction set. Note: * F-ZTAT™ (Flexible-ZTAT) is a trademark of Hitachi, Ltd.
On-Chip Supporting Modules
Series Product names Bus cont
