(HD64338xx) Single-Chip Microcomputer

www.DataSheet4U.com To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. 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Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. Hitachi Single-Chip Microcomputer H8/3887 Series H8/3887 HD6473887, HD6433887 H8/3886 HD6433886 H8/3885 HD6433885 H8/3884 HD6433884 H8/3883 HD6433883 H3/3882 HD6433882 H8/3847 Series H8/3847 HD6473847, HD6433847 H8/3846 HD6433846 H8/3845 HD6433845 H8/3844 HD6433844 H8/3843 HD6433843 H8/3842 HD6433842 Hardware Manual ADE-602-151A Rev. 2.0 4/8/99 Hitachi, Ltd. The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. List of Items Revised or Added for This Version Page Item Description Addition of H8/3847 Series Change in specification of operation speed Modification Addition Addition Addition Addition of description and modification of figure 1-1 Modification General modification 2 2 3 4 5 and 6 7 8 and 9 10 14 15 49 to 54 56 Table 1-1 Features / CPU Table 1-1 Features / Clock pulse generators Table 1-1 Features / Memory supply Table 1-1 Features / LCD drive power supply Table 1-1 Features / Product lineup 1.2 Internal Block Diagram Figure 1-2 and figure 1-3 Table 1-2 Pin Functions / Power source Modification pins Table 1-2 Pin Functions / LCD controller/driver 2.1.1 Features Figure 2-16 (1) to figure 2-16 (6) / Memory Map Figure 2-17 Data Size and Number of States for Access to and from On-Chip Peripheral Modules Addition Change in high-speed operation Modification Modification 89 Figure 4-2 Typical Connection to Crystal Modification Oscillator Table 4-1 Crystal Oscillator Parameters Modification 90 93 96 97 98 100 101 Figure 4-4 Typical Connection to Ceramic Oscillator Figure 4-9 Pin Connection when not Using Subclock Table 5-1 Operating Modes Figure 5-1 Mode Transition Diagram Table 5-2 Internal State in Each Operating Mode Bits 6 to 4 Bit 4 Modification Modification Addition of subsleep mode/watch mode descriptions Modification of mode transition condition (2) Modification Addition of Note Modification of description Page 104 106 109 111 119 131 151 167 169 170 175 Item 5.2 Sleep Mode 5.3.3 Oscillator Settling Timer after Standby Mode is Cleared 5.5 Subsleep Mode 5.7.1 Transition to Active (MediumSpeed) Mode Table 6-2 Socket Adapter Table 8-1 Port Functions Table 8-10 Port 3 Pin States Figure 8-9 Port 9 Pin Configuration 8.10.3 Pin Functions 8.10.4 Pin States Figure 8-12 Port C Pin Configuration 1. Port data register C (PDRC) Description Addition of description Modification of description Addition of description Addition of description Modification Modification of port 9 to port C Modification Modification Modification of description and table 8-27 Modification of description and table 8-28 Modification Addition of description Modification Modification of table Modification of table Addition and modification of description in note Modification Addition and modification of descriptions and table Addition of description in note Addition of description Modification Addition of description in notes Modification Addition of description in notes Modification Addition of description in notes Addition of description 198 202 203 227 239 250 260