Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch

Click to see this datasheet in Simplified Chinese! FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch January 2007 FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch Features ■ ■ ■ General Description The FSUSB30 is a low-power, two-port, high-speed USB 2.0 switch. Configured as a double-pole double-throw (DPDT) switch, it is optimized for switching between two high-speed (480Mbps) sources or a Hi-Speed and FullSpeed (12Mbps) source. The FSUSB30 is compatible with the requirements of USB2.0 and features an extremely low on capacitance (CON) of 3.7pF. The wide bandwidth of this device (720MHz), exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk minimizes interference. The FSUSB30 contains special circuitry on the D+/ Dpins which allows the device to withstand an overvoltage condition when powered off. This device is also designed to minimize current consumption even when the control voltage applied to the S pin, is lower than the supply voltage (VCC). This feature is especially valuable to ultraportable applications such as cell phones, allowing for direct interface with the general purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers. ■ ■ ■ ■ Low On Capacitance, 3.7pF (typical) Low On Resistance, 6.5Ohm (typical) Low power consumption (1µA maximum) – 10µA maximum ICCT over an expanded control voltage range (VIN = 2.6V, VCC = 4.3V) Wide -3dB bandwidth, >720MHz 8KV ESD protection Power-Off protection when VCC = 0V; D+/ D- pins can tolerate up to 5.25V Packaged in: – Pb-Free 10-lead MicroPak™ (1.6 x 2.1mm) – Pb-Free 14-lead DQFN – Pb-Free 10-lead MSOP – Pb-Free 10-lead UMLP (1.4 x 1.8mm) Applications ■ Cell phone, PDA, Digital Camera, and Notebook LCD Monitor, TV, and Set-top Box Related Application Notes ■ AN-6022 Using the FSUSB30 / FSUSB31 to Comply with USB 2.0 Fault Condition Requirements Ordering Information Order Number FSUSB30L10X FSUSB30BQX FSUSB30MUX FSUSB30UMX Package Number MAC010A MLP014A MUA10A MLP010A Product Code Top Mark FJ USB30 FSUSB30 GJ Pb-Free Yes Yes Yes Yes Package Description 10-Lead MicroPak, 1.6 x 2.1mm 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide 10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm Pb-Free package per JEDEC J-STD-020B. Application Diagram 1D+ USB2.0 Controller Set Top Box (STB) CPU or DSP Processor 1D– D– 2D+ DVR or Mass Storage 2D– Controller Control S MicroPak™ is a trademark of Fairchild Semiconductor Corporation. VCC FSUSB30 D+ USB Connector OE © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 www.fairchildsemi.com FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch Connection Diagrams Pad Assignments for MicroPak HSD1– HSD2– OE Analog Symbol HSD1+ D+ D– HSD2+ HSD1– D– GND 9 8 7 6 VCC 10 5 HSD2– S OE Control 1 2 3 4 S HSD1+ (Top View) HSD2+ D+ Pin Descriptions Pin Name OE S 13 12 11 10 9 Pad Assignments for DQFN NC 1 Description Bus Switch Enable Select Input Data Ports No Connect VCC 14 S HSD1+ NC HSD2+ D+ 2 3 4 5 6 7 8 OE HSD1– NC HSD2– D– D+, D−, HSDn+, HSDn− NC Truth Table S X LOW HIGH OE HIGH LOW LOW Function Disconnect D+, D− = HSD1n D+, D− = HSD2n GND NC (Top Through View) Pin Assignment for MSOP S HSD1+ HSD2+ D+ GND VCC OE HSD1– HSD2– D– 1 10 2 3 4 9 8 7 5 6 (Top Through View) Pad Assignments for µMLP HSD1– 7 HSD2– 6 OE VCC Sel 8 9 10 5 4 D– GND D+ 1 2 3 HSD1+ (Top Through View) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 HSD2+ www.fairchildsemi.com 2 FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VCC VCNTRL VSW IIK IOUT TSTG ESD Supply Voltage DC Input Voltage (1) Parameter Minimum -0.5 -0.5 Maximum +4.6 +4.6 VCC + 0.3 VCC + 0.3 5.25 50 Unit V V V V V mA mA °C kV kV HSDnX DC Switch Voltage(1) DC Input Diode Current DC Output Current Storage Temperature Human Body Model All Pins I/O to GND D+,D- when VCC > 0 D+,D- when VCC = 0 0.5 0.5 -0.50 -50 -65 +150 8 8 Note: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.(2) Symbol VCC VIN VSW TA ΘJA Supply Voltage Parameter Control Input Voltage Switch Input Voltage Operating Temperature Thermal Resistance, 10 MicroPak Minimum 3.0 0 0 -40 Maximum 4.3 VCC VCC +85 250 Unit V V V °C °C/W Note: 2. Control input must be held HIGH or LOW and it must not float. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 www.fairchildsemi.com 3 FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch DC Electrical Characteristics All typical values are at 25°C unless otherwise specified. Symbol VIK VIH VIL IIN IOZ IOFF RON ΔRON Parameter Clamp Diode Voltage Input Voltage HIGH Input Voltage LOW Control Input Leakage OFF State Leakage Power OFF Leakage Current (D+, D–) Switch On Resistance(3) Delta RON(4) Conditions IIN = -18mA VCC (V) 3.0 3.0 to 3.6 4.3 3.0 to 3.6 4.3 TA = −40°C to +85°C Min. 1.3 1.7 0.5 0.7 -1.0 -2.0 -2.0 6.5 0.35 2.0 1.0 10.0 1.0 2.0 2.0 10.0 7.0 Typ. Max. -1.2 Unit V V V V V µA µA µA Ω Ω Ω Ω µA µA VSW = 0.0V to VCC 0 ≤ Dn, HSD1n, HSD2n ≤ VCC VSW = 0V to 4.3V, VCC = 0V VSW = 0.4V, ION = -8mA VSW = 0V, IO = 30mA at 25°C VSW = 0.4V, ION = -8mA VSW = 0.0V - 1.0V, ION = -8mA VCNTRL = 0.0V or VCC, IOUT = 0 VCNTRL (control input) = 2.6V 4.3 4.3 0 3.0 3.6 3.0 3.0 4.3 4.3 RON Flatness RON Flatness(3) ICC ICCT Quiescent Supply Current Increase in ICC Current per Control Voltage Notes: 3. Measured by the voltage drop between Dn, HSD1n, HSD2n pins at the indicated current through the switch. On resistance is determined by the lower of the voltage on the two ports. 4.Guaranteed by characterization. AC Electrical Characteristics All typical values are for VCC = 3.3V at 25°C unless otherwise specified. Symbol tON tOFF tPD tBBM OIRR Xtalk BW Parameter Turn-On Time S, OE to Output Turn-Off Time S, OE to Output Propagation Delay(4) Break-Before-Make Off Isolation (Non-Adjacent) Non-Adjacent Channel Crosstalk −3dB Bandwidth Conditions HD1n, HD2n = 0.8V, RL = 50Ω, CL = 5pF HD1n, HD2n = 0.8V, RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF, VIN = 0.8V f = 240MHz, RT = 50Ω RT = 50Ω, f = 240MHz RT = 50Ω, CL = 0pF RT = 50Ω, CL = 5pF VCC (V) 3.0 to 3.6 3.0 to 3.6 3.3 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 TA = −40°C to +85°C Min. Typ. 13.0 12.0 0.25 2.0 -30.0 -45.0 720 550 6.5 Max. 30.0 25.0 Unit ns ns ns ns dB dB MHz Figure Number Figure 8 Figure 8 Figure 6 Figure 7 Figure 9 Figure 12 Figure 13 Figure 11 © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 www.fairchildsemi.com 4 FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch USB Hi-Speed Related AC Electrical Characteristics Symbol tSK(O) tSK(P) Parameter Channel-to-Channel Skew(5) Skew of Opposite Transitions of the Same Output(5) Total Jitter(5) Conditions RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF, tR = tF = 500ps at 480 Mbps (PRBS = 215 − 1) VCC (V) 3.0 to 3.6 TA = −40°C to +85°C Min. Typ. 50 Max. Units ps Figure Number Figure 6 Figure 10 Figure 6 Figure 10 3.0 to 3.6 20 ps tJ 3.0 to 3.6 200 ps Note: 5. Guaranteed by characterization. Capacitance Symbol CIN CON COFF Parameter Control Pin Input Capacitance D1n, D2n, Dn On Capacitance D1n, D2n Off Capacitance Conditions VCC = 0V VCC = 3.3, OE = 0V VCC and OE = 3.3 TA = −40°C to +85°C Min. Typ. 1.5 3.7 2.5 Max. Units pF pF pF Figure Number Figure 15 Figure 14 Figure 15 © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 www.fairchildsemi.com 5 FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch Typical Characteristics Frequency Response 0 -1 -2 Gain (dB) -3 -4 -5 -6 -7 -8 1 10 100 Frequency (MHz) 1000 10000 CL = 0pF, VCC = 3.3V Figure 1. Gain vs. Frequency Frequency Response 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1 Off Isolation (dB) 10 Frequency (MHz) 100 1000 Figure 2. Off Isolation Frequency Response 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1 Crosstalk (dB) 10 Frequency (MHz) 100 VCC = 3.3V 1000 Figure 3. Crosstalk © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 www.fairchildsemi.com 6 FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch Test Diagrams VON FSUSB30 FSUSB30 HSDn Dn VIN GND Select VS = 0 to VCC RON = VON / ION GND ION NC IDn(OFF) A VIN Select GND VS = 0 or VCC Each switch port is tested separately. Figure 4. On Resistance Figure 5. Off Leakage FSUSB30 HSDn D+, D– VIN GND RS CL GND VSel GND RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). CL includes test fixture and stray capacitance. RL VOUT tRISE = 500ps 800mV Input: HSDn+, HSDn– 400mV VOH Output: D+, D– VOL tPLH 50% 90% 50% 1