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Part Number |
FSUSB30 |
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Manufacturer |
Fairchild Semiconductor |
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Semiconductor DataSheet |
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DataSheet View |
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Click to see this datasheet in Simplified Chinese!
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
January 2007
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Features
■ ■ ■
General Description
The FSUSB30 is a low-power, two-port, high-speed USB 2.0 switch. Configured as a double-pole double-throw (DPDT) switch, it is optimized for switching between two high-speed (480Mbps) sources or a Hi-Speed and FullSpeed (12Mbps) source. The FSUSB30 is compatible with the requirements of USB2.0 and features an extremely low on capacitance (CON) of 3.7pF. The wide bandwidth of this device (720MHz), exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk minimizes interference. The FSUSB30 contains special circuitry on the D+/ Dpins which allows the device to withstand an overvoltage condition when powered off. This device is also designed to minimize current consumption even when the control voltage applied to the S pin, is lower than the supply voltage (VCC). This feature is especially valuable to ultraportable applications such as cell phones, allowing for direct interface with the general purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers.
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Low On Capacitance, 3.7pF (typical) Low On Resistance, 6.5Ohm (typical) Low power consumption (1µA maximum) – 10µA maximum ICCT over an expanded control voltage range (VIN = 2.6V, VCC = 4.3V) Wide -3dB bandwidth, >720MHz 8KV ESD protection Power-Off protection when VCC = 0V; D+/ D- pins can tolerate up to 5.25V Packaged in: – Pb-Free 10-lead MicroPak™ (1.6 x 2.1mm) – Pb-Free 14-lead DQFN – Pb-Free 10-lead MSOP – Pb-Free 10-lead UMLP (1.4 x 1.8mm)
Applications
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Cell phone, PDA, Digital Camera, and Notebook LCD Monitor, TV, and Set-top Box
Related Application Notes
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AN-6022 Using the FSUSB30 / FSUSB31 to Comply with USB 2.0 Fault Condition Requirements
Ordering Information
Order Number
FSUSB30L10X FSUSB30BQX FSUSB30MUX FSUSB30UMX
Package Number
MAC010A MLP014A MUA10A MLP010A
Product Code Top Mark
FJ USB30 FSUSB30 GJ
Pb-Free
Yes Yes Yes Yes
Package Description
10-Lead MicroPak, 1.6 x 2.1mm 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide 10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
1D+ USB2.0 Controller Set Top Box (STB) CPU or DSP Processor 1D– D– 2D+ DVR or Mass Storage 2D– Controller Control S
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
VCC
FSUSB30 D+ USB Connector
OE
© 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Connection Diagrams
Pad Assignments for MicroPak
HSD1– HSD2– OE
Analog Symbol
HSD1+ D+
D–
HSD2+ HSD1– D–
GND
9
8
7
6
VCC
10
5
HSD2– S OE Control
1
2
3
4
S
HSD1+
(Top View)
HSD2+
D+
Pin Descriptions
Pin Name
OE S
13 12 11 10 9
Pad Assignments for DQFN
NC
1
Description
Bus Switch Enable Select Input Data Ports No Connect
VCC
14
S HSD1+ NC HSD2+ D+
2 3 4 5 6 7 8
OE HSD1– NC HSD2– D–
D+, D−, HSDn+, HSDn− NC
Truth Table
S
X LOW HIGH
OE
HIGH LOW LOW
Function
Disconnect D+, D− = HSD1n D+, D− = HSD2n
GND NC (Top Through View)
Pin Assignment for MSOP
S HSD1+ HSD2+ D+ GND VCC OE HSD1– HSD2– D–
1
10
2 3 4
9 8 7
5
6
(Top Through View)
Pad Assignments for µMLP
HSD1–
7
HSD2–
6
OE VCC Sel
8 9 10
5 4
D– GND D+
1
2
3
HSD1+
(Top Through View)
© 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5
HSD2+
www.fairchildsemi.com 2
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC VCNTRL VSW IIK IOUT TSTG ESD Supply Voltage DC Input Voltage
(1)
Parameter
Minimum
-0.5 -0.5
Maximum
+4.6 +4.6 VCC + 0.3 VCC + 0.3 5.25 50
Unit
V V V V V mA mA °C kV kV
HSDnX DC Switch Voltage(1) DC Input Diode Current DC Output Current Storage Temperature Human Body Model All Pins I/O to GND D+,D- when VCC > 0 D+,D- when VCC = 0
0.5 0.5 -0.50 -50 -65
+150 8 8
Note: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.(2)
Symbol
VCC VIN VSW TA ΘJA Supply Voltage
Parameter
Control Input Voltage Switch Input Voltage Operating Temperature Thermal Resistance, 10 MicroPak
Minimum
3.0 0 0 -40
Maximum
4.3 VCC VCC +85 250
Unit
V V V °C °C/W
Note: 2. Control input must be held HIGH or LOW and it must not float.
© 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5
www.fairchildsemi.com 3
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
Symbol
VIK VIH VIL IIN IOZ IOFF RON ΔRON
Parameter
Clamp Diode Voltage Input Voltage HIGH Input Voltage LOW Control Input Leakage OFF State Leakage Power OFF Leakage Current (D+, D–) Switch On Resistance(3) Delta RON(4)
Conditions
IIN = -18mA
VCC (V)
3.0 3.0 to 3.6 4.3 3.0 to 3.6 4.3
TA = −40°C to +85°C Min.
1.3 1.7 0.5 0.7 -1.0 -2.0 -2.0 6.5 0.35 2.0 1.0 10.0 1.0 2.0 2.0 10.0 7.0
Typ.
Max.
-1.2
Unit
V V V V V µA µA µA Ω Ω Ω Ω µA µA
VSW = 0.0V to VCC 0 ≤ Dn, HSD1n, HSD2n ≤ VCC VSW = 0V to 4.3V, VCC = 0V VSW = 0.4V, ION = -8mA VSW = 0V, IO = 30mA at 25°C VSW = 0.4V, ION = -8mA VSW = 0.0V - 1.0V, ION = -8mA VCNTRL = 0.0V or VCC, IOUT = 0 VCNTRL (control input) = 2.6V
4.3 4.3 0 3.0 3.6 3.0 3.0 4.3 4.3
RON Flatness RON Flatness(3) ICC ICCT Quiescent Supply Current Increase in ICC Current per Control Voltage
Notes: 3. Measured by the voltage drop between Dn, HSD1n, HSD2n pins at the indicated current through the switch. On resistance is determined by the lower of the voltage on the two ports. 4.Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC = 3.3V at 25°C unless otherwise specified.
Symbol
tON tOFF tPD tBBM OIRR Xtalk BW
Parameter
Turn-On Time S, OE to Output Turn-Off Time S, OE to Output Propagation Delay(4) Break-Before-Make Off Isolation (Non-Adjacent) Non-Adjacent Channel Crosstalk −3dB Bandwidth
Conditions
HD1n, HD2n = 0.8V, RL = 50Ω, CL = 5pF HD1n, HD2n = 0.8V, RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF, VIN = 0.8V f = 240MHz, RT = 50Ω RT = 50Ω, f = 240MHz RT = 50Ω, CL = 0pF RT = 50Ω, CL = 5pF
VCC (V)
3.0 to 3.6 3.0 to 3.6 3.3 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6
TA = −40°C to +85°C Min. Typ.
13.0 12.0 0.25 2.0 -30.0 -45.0 720 550 6.5
Max.
30.0 25.0
Unit
ns ns ns ns dB dB MHz
Figure Number
Figure 8 Figure 8 Figure 6 Figure 7 Figure 9 Figure 12 Figure 13 Figure 11
© 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5
www.fairchildsemi.com 4
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
USB Hi-Speed Related AC Electrical Characteristics
Symbol
tSK(O) tSK(P)
Parameter
Channel-to-Channel Skew(5) Skew of Opposite Transitions of the Same Output(5) Total Jitter(5)
Conditions
RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF RL = 50Ω, CL = 5pF, tR = tF = 500ps at 480 Mbps (PRBS = 215 − 1)
VCC (V)
3.0 to 3.6
TA = −40°C to +85°C Min. Typ.
50
Max.
Units
ps
Figure Number
Figure 6 Figure 10 Figure 6 Figure 10
3.0 to 3.6
20
ps
tJ
3.0 to 3.6
200
ps
Note: 5. Guaranteed by characterization.
Capacitance
Symbol
CIN CON COFF
Parameter
Control Pin Input Capacitance D1n, D2n, Dn On Capacitance D1n, D2n Off Capacitance
Conditions
VCC = 0V VCC = 3.3, OE = 0V VCC and OE = 3.3
TA = −40°C to +85°C Min. Typ.
1.5 3.7 2.5
Max.
Units
pF pF pF
Figure Number
Figure 15 Figure 14 Figure 15
© 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5
www.fairchildsemi.com 5
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Typical Characteristics
Frequency Response
0 -1 -2 Gain (dB) -3 -4 -5 -6 -7 -8 1 10 100 Frequency (MHz) 1000 10000
CL = 0pF, VCC = 3.3V
Figure 1. Gain vs. Frequency
Frequency Response
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1
Off Isolation (dB)
10 Frequency (MHz)
100
1000
Figure 2. Off Isolation
Frequency Response
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1
Crosstalk (dB)
10 Frequency (MHz)
100 VCC = 3.3V
1000
Figure 3. Crosstalk
© 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5
www.fairchildsemi.com 6
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Test Diagrams
VON
FSUSB30
FSUSB30 HSDn Dn VIN GND Select VS = 0 to VCC RON = VON / ION GND ION
NC
IDn(OFF)
A
VIN Select GND VS = 0 or VCC Each switch port is tested separately.
Figure 4. On Resistance
Figure 5. Off Leakage
FSUSB30 HSDn D+, D– VIN GND RS CL GND VSel GND RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). CL includes test fixture and stray capacitance. RL VOUT
tRISE = 500ps 800mV Input: HSDn+, HSDn– 400mV VOH Output: D+, D– VOL tPLH
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