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Part Number |
FDA69N25 |
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Manufacturer |
Fairchild Semiconductor |
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Semiconductor DataSheet |
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DataSheet View |
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FDA69N25 250V N-Channel MOSFET
May 2006
UniFET
FDA69N25
250V N-Channel MOSFET
Features
• • • • • 69A, 250V, RDS(on) = 0.041Ω @VGS = 10 V Low gate charge ( typical 77 nC) Low Crss ( typical 84pF) Fast switching Improved dv/dt capability
TM
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies, active power factor correction, electronic lamp ballast based on half bridge topology.
D
G
TO-3P
G DS
FDA Series
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S
Absolute Maximum Ratings
Symbol
VDSS VDS(Avalanche) ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Repetitive Avalanche Voltage Drain Current - Continuous (TC = 25°C) - Continuous (TC = 100°C) Drain Current - Pulsed
(Note 1) (Note 1) (Note 2)
Parameter
FDA69N25
250 300 69 44.2 276 ± 30
(Note 2) (Note 1) (Note 1) (Note 3)
Units
V V A A A V mJ A mJ V/ns W W/°C °C °C
Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C) - Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8 from case for 5 seconds
1894 69 48 4.5 480 3.84 -55 to +150 300
Thermal Characteristics
Symbol
RθJC RθJA
Parameter
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient
FDA69N25
0.26 40
Units
°C/W °C/W
©2006 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FDA69N25 Rev. A
FDA69N25 250V N-Channel MOSFET
Package Marking and Ordering Information
Device Marking
FDA69N25
Device
FDA69N25
Package
TO-3P
Reel Size
--
Tape Width
--
Quantity
30
Electrical Characteristics
Symbol
Off Characteristics BVDSS ∆BVDSS/ ∆TJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd
TC = 25°C unless otherwise noted
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current
Test Conditions
VGS = 0 V, ID = 250 µA ID = 250 µA, Referenced to 25°C VDS = 250 V, VGS = 0 V VDS = 200 V, TC = 125°C VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V VDS = VGS, ID = 250 µA VGS = 10 V, ID = 34.5 A VDS = 40 V, ID = 34.5 A VDS = 25 V, VGS = 0 V, f = 1.0 MHz
(Note 4)
Min
250 ------
Typ
-0.25 -----
Max Units
--1 10 100 -100 V V/°C µA µA nA nA
Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse
On Characteristics Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance 3.0 ---0.034 25 5.0 0.041 -V Ω S
Dynamic Characteristics Input Capacitance Output Capacitance Reverse Transfer Capacitance ---3570 750 84 4640 980 130 pF pF pF
Switching Characteristics Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time
(Note 4, 5)
VDD = 125 V, ID = 69A, RG = 25 Ω
-----
95 855 130 220 77 24 37
200 1720 270 450 100 ---
ns ns ns ns nC nC nC
Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS = 200 V, ID = 69A, VGS = 10 V
(Note 4, 5)
----
Drain-Source Diode Characteristics and Maximum Ratings IS ISM VSD trr Qrr
NOTES: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 0.64mH, IAS =69A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C 3. ISD ≤ 69A, di/dt ≤200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2% 5. Essentially independent of operating temperature
Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = 69 A VGS = 0 V, IS = 69 A, dIF / dt = 100 A/µs
(Note 4)
------
---210 5.7
34 136 1.4 ---
A A V ns µC
2 FDA69N25 Rev. A
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FDA69N25 250V N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top :
Figure 2. Transfer Characteristics
10
2
10
2
ID, Drain Current [A]
ID, Drain Current [A]
150°C 25°C -55°C
* Notes : 1. VDS = 40V 2. 250µs Pulse Test
10
1
10
1
* Notes : 1. 250µs Pulse Test 2. TC = 25°C
10
0
10
-1
10
0
10
1
10
0
2
4
6
8
10
12
VDS, Drain-Source Voltage [V]
VGS, Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue
0.10
RDS(ON) [Ω], Drain-Source On-Resistance
0.08
VGS = 10V
0.06
IDR, Reverse Drain Current [A]
10
2
10
1
VGS = 20V
0.04
* Note : TJ = 25°C
150°C 25°C
* Notes : 1. VGS = 0V 2. 250µs Pulse Test
10 0 25 50 75 100 125 150 175 200
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
ID, Drain Current [A]
VSD, Source-Drain voltage [V]
Figure 5. Capacitance Characteristics
9000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
Figure 6. Gate Charge Characteristics
12
VGS, Gate-Source Voltage [V]
10
VDS = 50V VDS = 125V
Capacitances [pF]
6000
Coss Ciss
8
VDS = 200V
6
3000
4
Crss
* Note ; 1. VGS = 0 V 2. f = 1 MHz
2
* Note : ID = 69A
0 -1 10
0
10
0
10
1
0
10
20
30
40
50
60
70
80
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
3 FDA69N25 Rev. A
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FDA69N25 250V N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation vs. Temperature
1.2
Figure 8. On-Resistance Variation vs. Temperature
3.0
BVDSS, (Normalized) Drain-Source Breakdown Voltage
1.1
RDS(ON), (Normalized) Drain-Source On-Resistance
2.5
2.0
1.0
1.5
1.0
0.9
* Notes : 1. VGS = 0 V 2. ID = 250µA
0.5
* Notes : 1. VGS = 10 V 2. ID = 34.5 A
0.8 -100
-50
0
50
100
150
200
0.0 -100
-50
0
50
100
150
200
TJ, Junction Temperature [°C]
TJ, Junction Temperature [°C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current vs. Case Temperature
80
10
3
10 µs
10
2
70 60
100 µs
ID, Drain Current [A]
ID, Drain Current [A]
10
1
1ms 10ms 100ms DC
Operation in This Area is Limited by R DS(on)
50 40 30 20 10 0 25
10
0
10
-1
* Notes : o 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
o
10
-2
10
0
10
1
10
2
50
75
100
o
125
150
VDS, Drain-SourceVoltage[V]
TC, Case Temperature [ C]
Figure 11. Transient Thermal Response Curve
10
0
Z? JC Thermal Response (t),
D=0.5
10
-1
0.2 0.1 0.05
10
-2
PDM t1 t2
* Notes : 0 1. ZθJC(t) = 0.26 C/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * ZθJC(t)
0.02 0.01 single pulse
-5 -4 -3 -2
10
10
10
10
10
-1
10
0
10
1
t1, Square Wave Pulse Duration [sec]
4 FDA69N25 Rev. A
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FDA69N25 250V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
5 FDA69N25 Rev. A
www.fairchildsemi.com
FDA69N25 250V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
6 FDA69N25 Rev. A
www.fairchildsemi.com
FDA69N25 250V N-Channel MOSFET
Mechanical Dimensions
TO-3P
15.60 ±0.20 3.80 ±0.20 13.60 ±0.20 ø3.20 ±0.10 9.60 ±0.20 4.80 ±0.20 1.50 –0.05
+0.15
12.76 ±0.20
19.90 ±0.20
16.50 ±0.30
3.00 ±0.20 1.00 ±0.20
3.50 ±0.20
2.00 ±0.20
13.90 ±0.20
23.40 ±0.20
18.70 ±0.20
1.40 ±0.20
5.45TYP [5.45 ±0.30]
5.45TYP [5.45 ±0.30]
0.60 –0.05
+0.15
Dimensions in Millimeters
7 FDA69N25 Rev. A
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FDA69N25 250V N-Channel MOSFET
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FAST® ACEx™ ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DOME™ HiSeC™ EcoSPARK™ I2C™ E2CMOS™ i-Lo™ ImpliedDisconnect™ EnSigna™ IntelliMAX™ FACT™ FACT Quiet Series™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UniFET™ UltraFET® VCX™ Wire™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life suppo |