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Part Number |
FDA15N65 |
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Manufacturer |
Fairchild Semiconductor |
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Semiconductor DataSheet |
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DataSheet View |
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FDA15N65 650V N-Channel MOSFET
UniFET
FDA15N65
650V N-Channel MOSFET Features
• 16A, 650V, RDS(on) = 0.44Ω @VGS = 10 V • Low gate charge ( typical 48.5 nC) • Low Crss ( typical 23.6 pF) • Fast switching • 100% avalanche tested • Improved dv/dt capability
January 2007
TM
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction.
D
G
TO-3PN
G DS
FDA Series
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S
Absolute Maximum Ratings
Symbol
VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Gate-Source voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation
Parameter
- Continuous (TC = 25°C) - Continuous (TC = 100°C) - Pulsed
(Note 1)
FDA15N65
650 16 9.6 64 ± 30
(Note 2) (Note 1) (Note 1) (Note 3)
Unit
V A A A V mJ A mJ V/ns W W/°C °C °C
637 16 26 4.5 260 2.1 -55 to +150 300
(TC = 25°C) - Derate above 25°C
Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
RθJC RθCS RθJA
Parameter
Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-to-Ambient
Min.
-0.24 --
Max.
0.48 -40
Unit
°C/W °C/W °C/W
©2007 Fairchild Semiconductor Corporation
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FDA15N65 Rev. A
FDA15N65 650V N-Channel MOSFET
Package Marking and Ordering Information
Device Marking
FDA15N65
Device
FDA15N65
Package
TO-3PN
TC = 25°C unless otherwise noted
Reel Size
--
Tape Width
--
Quantity
30
Electrical Characteristics
Symbol
Off Characteristics BVDSS ΔBVDSS / ΔTJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr
NOTES:
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
Conditions
VGS = 0V, ID = 250μA, TJ = 25°C ID = 250μA, Referenced to 25°C VDS = 650V, VGS = 0V VDS = 520V, TC = 125°C VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VDS = VGS, ID = 250μA VGS = 10V, ID = 8A VDS = 40V, ID = 8A VDS = 25V, VGS = 0V, f = 1.0MHz
(Note 4)
Min
650 -----3.0 ------
Typ
-0.65 -----0.36 19.2 2380 295 23.6 65 125 105 65 48.5 14.0 21.2
Max Units
--1 10 100 -100 5.0 0.44 -3095 385 35.5 140 260 220 140 63.0 --V V/°C μA μA nA nA V Ω S pF pF pF ns ns ns ns nC nC nC
On Characteristics
Dynamic Characteristics
Switching Characteristics VDD = 325V, ID = 15A RG = 21.7Ω
(Note 4, 5)
------(Note 4, 5)
VDS = 520V, ID = 15A VGS = 10V
--
Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 16A VGS = 0V, IS = 15A dIF/dt =100A/μs
(Note 4)
------
---496 5.69
16 64 1.4 ---
A A V ns μC
1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. L = 4.6mH, IAS = 16A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C 3. ISD ≤ 16A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature Typical Characteristics
FDA15N65 Rev. A
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FDA15N65 650V N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
10
Figure 2. Transfer Characteristics
2
VGS Top : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V
ID, Drain Current [A]
ID, Drain Current [A]
10
1
10
1
150 C 25 C -55 C
* Notes : 1. VDS = 40V 2. 250μs Pulse Test
o o
o
10
0
* Notes : 1. 250μs Pulse Test 2. TC = 25 C
o
10
-1
10
0
10
-1
10
0
10
1
2
4
6
8
10
12
VDS, Drain-Source Voltage [V]
VGS, Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue
1.0
RDS(ON) [Ω], Drain-Source On-Resistance
0.8
0.6
VGS = 10V
IDR, Reverse Drain Current [A]
10
1
0.4
150 C 25 C
o
o
VGS = 20V
0.2
* Note : TJ = 25 C
o
* Notes : 1. VGS = 0V 2. 250μs Pulse Test
0.0
10
0
0
10
20
30
40
50
0.2
0.4
0.6
0.8
1.0
1.2
1.4
ID, Drain Current [A]
VSD, Source-Drain voltage [V]
Figure 5. Capacitance Characteristics
5000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd
Figure 6. Gate Charge Characteristics
12
VGS, Gate-Source Voltage [V]
4000
Coss Ciss
Crss = Cgd
10
VDS = 130V VDS = 325V VDS = 520V
Capacitances [pF]
8
3000
6
2000
* Note ; 1. VGS = 0 V 2. f = 1 MHz
4
1000
Crss
2
* Note : ID = 15A
0 -1 10
10
0
10
1
0
0
10
20
30
40
50
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
FDA15N65 Rev. A
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FDA15N65 650V N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation vs. Temperature
1.2
Figure 8. On-Resistance Variation vs. Temperature
3.0 3.0
BVDSS, (Normalized) Drain-Source Breakdown Voltage
1.1
1.0
0.9
* Notes : 1. VGS = 0 V 2. ID = 250 μA
RDS(ON), (Normalized) RDS(ON), On-Resistance Drain-Source(Normalized) Drain-Source On-Resistance
2.5 2.5
2.0 2.0
1.5 1.5
1.0 1.0
* Notes : * Notes : = 10 V 1. VGS 1.2. I = 5.5 V VGS = 10 A D 2. ID = 8 A
0.5 0.5
0.8 -100
-50
0
50
100
o
150
200
0.0 0.0 -100 -100
-50 -50
00
50 50
100 100
o
150 150
200 200
TJ, Junction Temperature [ C]
Junction Temperature o C] TT,J,Junction Temperature [[ C] J
Figure 9. Safe Operating Area
Figure 10. Maximum Drain Current vs. Case Temperature
18
10
2
10 μs
15
ID, Drain Current [A]
100 μs
10
1
10
0
Operation in This Area is Limited by R DS(on)
1 ms 10 ms 100 ms DC
ID, Drain Current [A]
3
12
9
* Notes :
6
10
-1
1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
o
o
3
10
-2
10
0
10
1
10
2
10
0 25
50
75
100
o
125
150
VDS, Drain-Source Voltage [V]
TC, Case Temperature [ C]
Figure 11. Transient Thermal Response Curve
10
0
ZθJC(t), Thermal Response
D = 0 .5
10
-1
0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1
* N o te s :
PDM t1 t2
o
10
-2
s in g le p u ls e
1 . Z θ J C ( t) = 0 .4 8 C /W M a x . 2 . D u ty F a c to r , D = t 1 /t 2 3 . T J M - T C = P D M * Z θ J C ( t)
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
FDA15N65 Rev. A
4
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FDA15N65 650V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDA15N65 Rev. A
5
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FDA15N65 650V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
FDA15N65 Rev. A
6
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FDA15N65 650V N-Channel MOSFET
Mechanical Dimensions
TO-3PN
Dimensions in Millimeters
FDA15N65 Rev. A
7
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FDA15N65 650V N-Channel MOSFET
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT® FAST® FASTr™ FPS™ FRFET™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC® UniFET™ VCX™ Wire™
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As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
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