www.DataSheet4U.com
PROCESS
CP704
Central
TM
Small Signal Transistors
PNP - High Current Transistor Chip
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TYPES MPSA55 MPSA56 EPITAXIAL PLANAR 22 x 22 MILS 9.0 MILS 3.7 X 3.7 MILS 4.2 X 4.2 MILS Al - 30,000Å Au - 18,000Å
BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824
R1 (15 -April 2005)
www.DataSheet4U.com
Central
TM
PROCESS
CP704
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824
R1 (15 -April 2005)
