Description
Splitter Splitter is used for dividing local power in a mobile phone . It is positioned ahead of VCO output and sends the local power to Rx/Tx parts separately. Output signals have mutually the same phase and amplitude. www.DataSheet4U.com General Features -Available in the 700MHz to 1.9GHz frequency range. - Low loss and high isolation - Ultra-small size and lightweight SMDs. - Available in tape and reel packings for automatic mounting. - Operating temperature: -35℃ to +85℃ - Recommended Matching Capacitor : 3pF for CIP21T701NE - Reflow soldering available. : 2pF for CIP21(or 31)T901NE : 1pF for CIP21(or 31)T182NE Applications - Dividing local power in a mobile phone. Splitter Part Numbering CI 1 ● 1 ● 2 ● 3 ● 4 ● 5 ● 6 ● P 2 ● Series Dimension Material 21 3 ● T 4 ● 901 5 ● N 6 ● E 7 ● Abbreviation of Splitter Frequency Band for Application Thickness Option 2 ● SERIES CODE P DESCRIPTION OF CODE CHIP SPLITTER 3 ● DIMENSION CODE 21 31 L 2.0±0.2 3.2±0.2 W 1.25±0.2 1.60±0.2 T 1.0± 0.2 1.0± 0.2 www.DataSheet4U.com 4 ● MATERIAL CODE T DESCRIPTION OF CODE MATERIAL FOR HIGH FREQUENCY 5 ● FREQUENCY BAND FOR APPLICATION Frequency band is identified by 3 digits. The first and second digits identify the first and second significant figures of the frequency. The third digit identified the multiplier example) 901 : 90 × 101 = 900MHz 182 : 18 × 102 = 1800MHz Splitter 6 ● THICKNESS OPTION CODE N A B DESCRIPTION OF CODE Standard thickness Thinner than standard thickness Thicker than standard thickness APPEARANCE AND DIMENSON W ② ① L www.DataSheet4U.com T a p b DIMENSION ( mm ) ③ ①:In (Sum port) ②:Out-1 ③:Out-2 CODE L 21 31 2.0±0.2 3.2±0.2 W 1.25±0.2 1.60±0.2 T 1.0±0.2 1.0±0.2 a 0.3+0.2/-0.1 0.4±0.2 b 0.2±0.1 0.45±0.2 p 0.65±0.05 0.95±0.1 Splitter CARACTERISTIC LINE UP Product CIP31T901NE CIP31T182NE www.DataSheet4U.com Insertion Loss 0.3dB 0.3dB 0.3dB 0.3dB Isolation 23dB 23dB 23dB 23dB VSWR 1.3 1.3 1.3 1.3 Dimension 3.2X1.6mm 3.2X1.6mm 2.0X1.2mm 2.0X1.2mm Thickness 1.0mm 1.0mm 1.0mm 1.0mm CIP21T901NE CIP21T182NE ※ 901 : 90X101 = 900MHz 182 : 18X102= 1800MHz Splitter RELIABILITY TEST CONDITION NO ITEM CONDITION TEMP. CYCLE OF THE FOLLOWING BE SUBJECT FOR 100CYCLES. -40℃,30min ↔ +85℃,30min SPECIFICATION ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. 1 www.DataSheet4U.com THERMAL SHOCK 2 HUMIDITY RESISTANCE HIGH TEMPERATURE RESISTANCE LOW TEMPERATURE RESISTANCE +40±3℃, RELATIVE HUMIDITY 90~95% FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. 3 +125±3℃ FOR 1000hours. 4 -40±3℃ FOR 1000hours. 5 SOLDERABILITY Soldering temp.: 245±5℃ Immersion time: 4±1sec. At least 90% of the termination on each should be covered with solder. Splitter 6 RESISTANCE TO SOLDERING HEAT Preheat : 100~130℃, 60~120sec Peak Temperature : 250℃ max. Specimens are soldered twice with the above condition then kept in room temperature and humidity for 24 hours before measurements. Temperature profile is as below ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. WITHOUT DISTINCT DEFORMATION IN APPEARANCE. ※ Temperature profile TEMP Preheating Soldering 250℃ 30~50 sec 220℃ Cooling Soldering Temp △T≤150 Preheating Temp 60≥ 60~120 6≥ TIME (sec) BLOCK DIAGRAM ● FREQUENCY SEPARATOR IN DUAL BAND PHONE CDMA/PCS www.DataSheet4U.com RX B PF BALUN ⓧ VCO SPLITTER LNA LNA SAW DUPLEXER PAM COUPLER TX ISOLATOR APC B PF Driver Amp. ⓧ Splitter APPLICATION MANUAL STAGE 1. Soldering PRECAUTION ▶ Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. TECHNICAL CONSIDERATION 1-1. Preheating when soldering Heating : Splitter should be preheated within 100 to 130℃ of the soldering. Cooling : The temperature difference between the components and cleaning process should not be greater than 100℃ . Splitter is susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.. ※ Recommended conditions for soldering [Reflow soldering] Temperature Profile www.DataSheet4U.com TEMP Preheating Soldering 250℃ 30~50 sec Cooling Soldering Temp △T≤150 220℃ Preheating Temp Splitter 60≥ 60~120 6≥ TIME (sec) ※ 1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thickness of the Splitter, as shown below: SPLITTER Solder 1/2T∼1/3T T PC board 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. 2. Cleaning ▶ Cleaning conditions 1. When cleaning the PC board after the splitters are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning(e.g. to remove soldering flux or other materials from the production process.) 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the splitter, resulting in a degradation of the splitter's electrical properties (especially insulation resistance). 2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the splitters. (1)Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the splitter or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20 w/l Ultrasonic frequency Below 40 kHz Ultrasonic washing period 5 min. or less 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the splitter's characteristics. STAGE 3. Post cleaning processes PRECAUTION ▶ Application of resin coatings, molding, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the splitter's performance. 2. When a resin's hardening temperature is higher than the splitter's operating temperature, the stresses generated by the excess heat may lead to splitter damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage splitters The use of such resins, molding materials etc. is not recommended. TECHNICAL CONSIDERATION www.DataSheet4U.com 4. Storage conditions ▶ Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature Below 40℃ Humidity Below 70% RH The ambient temperature must be kept below 30℃ . Even under ideal storage conditions splitter electrode solderability decreases as time passes, so splitters should be used within 6 months from the time of delivery. ※ The packaging material should be kept where no chlorine or sulfur exists in the air 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the splitters Splitter PACKAGING ● EMBOSSED PLASTIC TAPE 2 0.05[.079 .069±.004 1.75±0.1 www.DataSheet4U.com .002] 4±0.1[.157±.004] φ1.5 -0 +0.1 [.059 +.004 -0 ] ● QUANTITY TYPE 21 31 THICKNESS OF BODY[MM] 1.0 1.0 STANDARD QUANTITY[PCS] 3000 3000 8±0.3 .315±.012 TYPE 21 31 .138±.002 A 0.3 [0.012] T EMBOSSED TAPE TAPE MATERIAL EMBOSSED TAPE EMBOSSED TAPE A 1.5±0.2 [.059±.008] 2.0±0.2 [.079±.008] B 2.3±0.2 [.091±.008] 3.6±0.2 [.142±.008] T 2.0 [.079] 2.0 [.079] 3.5±0.05 B Splitter Unit : mm Tc (Chip Thickness) 1.0±0.2 1.0±0.2 ● REEL DIMENSION E www.DataSheet4U.com C R D B W A t unit : mm A φ178±2 B φ60±5.0 C Φ13±0.5 D Φ21±0.8 E 2±0.5 W 10.0±1.5 T 0.8±0.2 R Splitter 1.0 NOTICE ● Report before change If it is required to change the specifications, materials or manufacturing methods of this specified Baluns, we shall inform on written statement with its quality and reliability data before changes may occur. www.DataSheet4U.com ● Packaging Package includes label with below item and outgoing inspection data on customer's request. - Part No.& Lot No. - Quantity - Name and logo of manufacturer ● Restriction of environmental destructive material Baluns specified on this specification do not use any of under stated materials. Cd, Hg, As, Br and its chemical composite, PCB and asbestos. PBBS PBBOs PBDO PBDE PBB Splitter ● Usage of destructive materials to ozonosphere CBaluns specified on this specification do not use any of under stated ODS materials on its manufacturing stages. Freon Haron 1-1-1 TCE CCl4 HCFC

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CIP21T182NE

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